Patent
   D738029
Priority
Feb 28 2014
Filed
Feb 28 2014
Issued
Sep 01 2015
Expiry
Sep 01 2029
Assg.orig
Entity
unknown
2
65
n/a
The ornamental design for a modular unit, as shown and described.

FIG. 1 is a perspective view of a first embodiment of a modular unit showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view of a second embodiment of a modular unit showing our new design;

FIG. 8 is a front elevation view thereof;

FIG. 9 is a right side elevation view thereof;

FIG. 10 is a left side elevation view thereof;

FIG. 11 is a top plan view thereof; and,

FIG. 12 is a bottom plan view thereof.

The broken lines illustrate unclaimed portions of the modular unit and form no part of claimed design.

Fujita, Hideki, Oka, Hiroki, Obana, Bunichi, Yokosawa, Nobuyuki, Tachino, Hideaki

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 28 2014Sony Corporation(assignment on the face of the patent)
Apr 09 2014OBANA, BUNICHISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0354710756 pdf
Apr 11 2014TACHINO, HIDEAKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0354710756 pdf
Apr 15 2014FUJITA, HIDEKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0354710756 pdf
Apr 17 2014YOKOSAWA, NOBUYUKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0354710756 pdf
Jun 14 2014OKA, HIROKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0354710756 pdf
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