FIG. 1 is a front perspective view of a headphone assembly according to our design shown in a first configuration thereof;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a back elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top elevation view thereof;
FIG. 7 is a bottom elevation view thereof;
FIG. 8 is a rear perspective view of the headphone assembly of FIG. 1, shown in a second configuration thereof;
FIG. 9 is a front elevation view thereof;
FIG. 10 is a back elevation view thereof;
FIG. 11 is a right side elevation view thereof;
FIG. 12 is a left side elevation view thereof;
FIG. 13 is a top elevation view thereof; and,
FIG. 14 is a bottom elevation view thereof.
Broken lines are environmental only and form no part of the claimed design.
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