Patent
   D751555
Priority
Mar 05 2013
Filed
Sep 03 2013
Issued
Mar 15 2016
Expiry
Mar 15 2030
Assg.orig
Entity
unknown
2
13
n/a
The ornamental design for probe card case, as shown and described.

FIG. 1 is a front view of a probe card case illustrating our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a sectional view taken along line A-A of FIG. 1;

FIG. 8 is a sectional view taken along line B-B of FIG. 1;

FIG. 9 is a sectional view taken along line C-C of FIG. 1;

FIG. 10 is a sectional view taken along line D-D of FIG. 1; and,

FIG. 11 is a reference perspective view thereof.

Amemiya, Takashi, Mori, Chikaomi

Patent Priority Assignee Title
D929351, Mar 28 2019 Foster Electric Company, Limited Actuator
D971212, Mar 31 2021 Protective cover for mobile phone
Patent Priority Assignee Title
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6788082, Aug 23 2002 Mitsubishi Denki Kabushiki Kaisha Probe card
6914586, Mar 11 2002 Dialog Semiconductor GmbH LCD module identification
7307440, Oct 25 2005 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Semiconductor integrated circuit tester with interchangeable tester module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 12 2013AMEMIYA, TAKASHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311270224 pdf
Aug 12 2013AMEMIYA, TAKASHIJAPAN ELECTRONIC MATERIALS CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311270224 pdf
Aug 19 2013MORI, CHIKAOMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311270224 pdf
Aug 19 2013MORI, CHIKAOMIJAPAN ELECTRONIC MATERIALS CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311270224 pdf
Sep 03 2013Japan Electronic Materials Corp.(assignment on the face of the patent)
Jan 07 2016Tokyo Electron LimitedJAPAN ELECTRONIC MATERIALS CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0374870864 pdf
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