FIG. 1 is a top perspective view of an improved wire bond for light emitter devices showing our design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a third view thereof, opposite the view of FIG. 4; and,
FIG. 7 is a fourth side view thereof, opposite the view of FIG. 5.
The dashed broken lines are included for the purpose of illustrating environment of the design and form no part of the claimed design. The dot-dash broken lines represent boundaries of the claimed design. None of the broken lines form part of the claimed design.
Patent |
Priority |
Assignee |
Title |
4327860, |
Jan 03 1980 |
Kulicke and Soffa Investments, Inc |
Method of making slack free wire interconnections |
4437604, |
Mar 15 1982 |
Kulicke and Soffa Investments, Inc |
Method of making fine wire interconnections |
4445633, |
Feb 11 1982 |
NEXANS, INC |
Automatic bonder for forming wire interconnections of automatically controlled configuration |
4932584, |
Jan 31 1989 |
Kabushiki Kaisha Shinkawa |
Method of wire bonding |
5612549, |
Mar 24 1994 |
Motorola |
Integrated electro-optical package |
5760422, |
Jun 21 1995 |
Rohm Co., Ltd. |
Light-emitting diode chip and light-emitting diode using the same |
5938105, |
Jan 15 1997 |
National Semiconductor Corporation |
Encapsulated ball bonding apparatus and method |
6010057, |
Mar 02 1996 |
ESEC Trading SA |
Method for making a wire connections of predetermined shape |
6065667, |
Jan 15 1997 |
National Semiconductor Corporation |
Method and apparatus for fine pitch wire bonding |
6119926, |
Feb 19 1998 |
ESEC Trading SA |
Method for producing wire connections on semiconductor chips |
6180962, |
Oct 23 1998 |
ROHM CO , LTD |
Chip type semiconductor light emitting device having a solder preventive portion |
6244499, |
Dec 13 1999 |
Advanced Semiconductor Engineering, Inc. |
Structure of a ball bump for wire bonding and the formation thereof |
6315190, |
Jun 25 1998 |
Kabushiki Kaisha Shinkawa |
Wire bonding method |
6391759, |
Apr 27 2000 |
Advanced Semiconductor Engineering, Inc. |
Bonding method which prevents wire sweep and the wire structure thereof |
6489637, |
Jun 09 1999 |
III Holdings 2, LLC |
Hybrid integrated circuit device |
6640436, |
Oct 16 1997 |
NEC Electronics Corporation |
Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire |
6933223, |
Apr 15 2004 |
National Semiconductor Corporation |
Ultra-low loop wire bonding |
7086148, |
Feb 25 2004 |
Bell Semiconductor, LLC |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
7135034, |
Nov 14 2003 |
LUMERX, INC |
Flexible array |
7443042, |
Feb 25 2004 |
Bell Semiconductor, LLC |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
7445354, |
Sep 27 2005 |
Nichia Corporation |
Light emitting apparatus |
7547626, |
Oct 27 2006 |
HANWHA TECHWIN CO , LTD |
Semiconductor package and method of forming wire loop of semiconductor package |
7750361, |
Aug 10 2007 |
STANLEY ELECTRIC CO , LTD |
Surface mount light emitting apparatus |
7815343, |
Aug 04 2006 |
Nichia Corporation |
Light emitting device |
8022431, |
Nov 04 2004 |
Panasonic Intellectual Property Corporation of America |
Illuminating apparatus, method for fabricating the using the same and display apparatus using the same |
8084777, |
Mar 24 2009 |
Bridgelux, Inc. |
Light emitting diode source with protective barrier |
8519426, |
Aug 09 2010 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Light emitting device and lighting system having the same |
8648356, |
Mar 08 2007 |
Senseonics, Incorporated |
Light emitting diode for harsh environments |
8779567, |
May 24 2012 |
Nichia Corporation |
Semiconductor device |
8912555, |
Aug 22 2012 |
SUPER ELITE INT L LIMITED |
Semiconductor light-emitting device |
9112126, |
Oct 28 2011 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Light emitting device package, lighting device including the same, and image display device |
9172012, |
Oct 31 2007 |
CREELED, INC |
Multi-chip light emitter packages and related methods |
20040262738, |
|
|
|
20090090928, |
|
|
|
20090108281, |
|
|
|
20100090330, |
|
|
|
20100176500, |
|
|
|
20100224890, |
|
|
|
20100244282, |
|
|
|
20110062482, |
|
|
|
20110079904, |
|
|
|
20110089443, |
|
|
|
20110220920, |
|
|
|
20110248289, |
|
|
|
20110291154, |
|
|
|
20120091489, |
|
|
|
20120305949, |
|
|
|
20130092960, |
|
|
|
20130105835, |
|
|
|
D615504, |
Oct 31 2007 |
CREELED, INC |
Emitter package |
D650343, |
Jan 31 2011 |
CREELED, INC |
Multiple configuration light emitting device package |
D658139, |
Jan 31 2011 |
CREE LED, INC |
High-density emitter package |
D660257, |
Jan 31 2011 |
CREE LED, INC |
Emitter package |
D660258, |
May 04 2011 |
EPISTAR CORPORATION |
Light emitting diode |
D675169, |
Dec 13 2011 |
Lextar Electronics Corp. |
Multi-chip LED |
D689209, |
Jan 31 2011 |
CREE LED, INC |
Lamp packages |
D689210, |
Jan 31 2011 |
CREE LED, INC |
Lamp packages |
D691973, |
Jul 08 2011 |
CREE LED, INC |
Lamp packages |
D703348, |
Jul 09 2012 |
CREE LED, INC |
Lamp package |
D709464, |
May 31 2012 |
CREELED, INC |
Light emitting diode (LED) package |
D711841, |
Aug 23 2012 |
CREELED, INC |
Light emitting diode (LED) package |
D713804, |
May 14 2012 |
CREELED, INC |
Light emitting diode (LED) package with multiple anodes and cathodes |
D741821, |
Apr 10 2014 |
KINGBRIGHT ELECTRONICS CO., LTD. |
LED component |
H445, |
|
|
|
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 07 2012 | | Cree, Inc. | (assignment on the face of the patent) | | / |
Mar 04 2013 | HUSSELL, CHRISTOPHER | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033275 | /0209 |
pdf |
Mar 04 2013 | SIGNOR, ANDREW | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033275 | /0209 |
pdf |
Mar 05 2013 | WELCH, ERIN | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033275 | /0209 |
pdf |
Apr 01 2013 | ANDREWS, PETER | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033275 | /0209 |
pdf |
Mar 01 2021 | Cree, Inc | CREELED, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 055780 | /0121 |
pdf |
Feb 07 2022 | SMART High Reliability Solutions, LLC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 |
pdf |
Feb 07 2022 | SMART EMBEDDED COMPUTING, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 |
pdf |
Feb 07 2022 | CREELED, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 |
pdf |
Feb 07 2022 | SMART MODULAR TECHNOLOGIES, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 |
pdf |