Patent
   D754665
Priority
Aug 29 2014
Filed
Oct 30 2014
Issued
Apr 26 2016
Expiry
Apr 26 2030
Assg.orig
Entity
unknown
24
12
n/a
The ornamental design for a notebook ultrasonic module, as shown and described.

FIG. 1 is a front side perspective view of a notebook ultrasonic module showing my new design;

FIG. 2 is another side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Zhang, Renfu, Xia, Chunhong, Xiao, Shunjin

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 11 2014ZHANG, RENFUEDAN INSTRUMENTS, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0340700739 pdf
Oct 11 2014XIA, CHUNHONGEDAN INSTRUMENTS, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0340700739 pdf
Oct 11 2014XIAO, SHUNJINEDAN INSTRUMENTS, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0340700739 pdf
Oct 30 2014EDAN INSTRUMENTS, INC.(assignment on the face of the patent)
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