Patent
   D755135
Priority
Jan 28 2014
Filed
May 05 2014
Issued
May 03 2016
Expiry
May 03 2030

TERM.DISCL.
Assg.orig
Entity
unknown
5
41
n/a
The ornamental design for a light emitting diode chip, as shown and described.

FIG. 1 is a perspective view of a light emitting diode chip showing an embodiment of my new design;

FIG. 2 is a front view of the embodiment;

FIG. 3 is a rear view of the embodiment;

FIG. 4 is a left side view of the embodiment;

FIG. 5 is a right side view of the embodiment;

FIG. 6 is a top view of the embodiment; and,

FIG. 7 is a bottom view of the embodiment.

The broken line portions of the light emitting diode chip in FIGS. 1-7 represent unclaimed portions of the design and form no part thereof.

Feng, Hui-Ching

Patent Priority Assignee Title
D768094, Oct 30 2014 EPISTAR CORPORATION Light-emitting diode unit
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D769831, Oct 28 2014 EPISTAR CORPORATION Light-emitting diode unit
D777693, Nov 05 2014 EPISTAR CORPORATION Light-emitting diode unit
D824864, Nov 05 2014 EPISTAR CORPORATION Light-emitting diode unit
Patent Priority Assignee Title
2280631,
4032944, Mar 11 1975 U.S. Philips Corporation Semiconductor device for generating incoherent radiation and method of manufacturing same
4189027, Aug 19 1976 United Technologies Corporation Sound suppressor liners
6012543, Mar 07 1997 Nissan Motor Co., Ltd. Sound isolation plate structure
6764196, Mar 29 2001 Lighting system
6870125, Dec 03 2001 Sony Corporation Crystal layer separation method, laser irradiation method and method of fabricating devices using the same
7621654, Mar 26 2004 SIGNIFY HOLDING B V LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
7690809, Nov 14 2007 Taiwan Green Energy Co., Ltd. LED lighting device inlaid on a ceiling
7710014, Mar 31 2005 Samsung SDI Co., Ltd. Electron emission device, electron emission display device using the same and method of manufacturing the same
7786491, Feb 02 2006 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
8415689, Apr 30 2008 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Semiconductor light emitting device
8569739, Dec 16 2010 California Institute of Technology Chemically-etched nanostructures and related devices
8704249, Feb 14 2012 Toyoda Gosei Co., Ltd. Semiconductor light emitting device
8749263, Aug 30 2010 Sharp Kabushiki Kaisha Semiconductor apparatus, inspection method thereof and electric device
20030001477,
20050184647,
20060022575,
20060160409,
20060208628,
20060261725,
20070096624,
20070176206,
20080030117,
20080116782,
20100208761,
20110220872,
20110291070,
20110291120,
20120056232,
20120153260,
20130285105,
20130321902,
20140191650,
20140353709,
D410973, Mar 18 1998 LEGO A S Toy building element
D412189, Mar 18 1998 LEGO A S Toy building element
D510912, Sep 15 2003 Nichia Corporation Light emitting diode
D511329, Jul 09 2003 Nichia Corporation Light emitting diode
D616506, Jan 27 2009 LEGO A S Element of a toy construction set
D646647, Jul 30 2010 Everlight Electronics Co., Ltd. Light emitting diode
D725052, Apr 30 2014 EPISTAR CORPORATION Light-emitting diode device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 23 2014FENG, HUI-CHINGFormosa Epitaxy IncorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329070873 pdf
May 05 2014Formosa Epitaxy Incorporation(assignment on the face of the patent)
Sep 22 2016Formosa Epitaxy IncorporationEPISTAR CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0401490765 pdf
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