Patent
   D762183
Priority
Apr 24 2015
Filed
Apr 24 2015
Issued
Jul 26 2016
Expiry
Jul 26 2030
Assg.orig
Entity
unknown
19
15
n/a
The ornamental design for an led package body, as shown and described.

FIG. 1 is a perspective view of a LED package body showing our new design;

FIG. 2 is a front view thereof where the rear view is a mirror image;

FIG. 3 is a left side view thereof where the right side view is a mirror image;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a cross-sectional view taken along, line 6-6 of FIG. 4.

The broken lines depict portions of the LED package body that form no part of the claimed design.

The cross sectional view shown in FIG. 6 is included for the purpose of showing the interior contours shown in FIG. 1 which may not be clear from the remaining illustrations. Any features of internal construction shown are incidental and form no part of the claimed design.

Kim, Baek Jun, Kim, Ha Na, Kim, Byung Mok, Park, Hae Jin

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 24 2015LG Electronics Inc.(assignment on the face of the patent)
Apr 24 2015KIM, BYUNG MOKLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355030753 pdf
Apr 24 2015PARK, HAE JINLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355030753 pdf
Apr 24 2015KIM, BAEK JUNLG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355030753 pdf
Apr 24 2015KIM, HA NALG INNOTEK CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355030753 pdf
May 20 2021LG INNOTEK CO , LTD SUZHOU LEKIN SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0563660335 pdf
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