FIG. 1 is a perspective view of a 3D printing apparatus showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is the second perspective view showing the 3D printing apparatus.
The broken lines shown represent unclaimed subject matter and form no part of the claimed design.
	
	  
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	  	 | Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
	  
	  | Jul 24 2015 | HSU, CHUN-AN | Cal-Comp Electronics & Communications Company Limited | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | CHUNG, WEN-CHUN | Cal-Comp Electronics & Communications Company Limited | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | KAO, CHIEH | Cal-Comp Electronics & Communications Company Limited | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | HSU, CHUN-AN | KINPO ELECTRONICS, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | CHUNG, WEN-CHUN | KINPO ELECTRONICS, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | KAO, CHIEH | KINPO ELECTRONICS, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | HSU, CHUN-AN | XYZPRINTING, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | CHUNG, WEN-CHUN | XYZPRINTING, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 24 2015 | KAO, CHIEH | XYZPRINTING, INC  | ASSIGNMENT OF ASSIGNORS INTEREST  SEE DOCUMENT FOR DETAILS   | 036192 | /0570 | 
    pdf | 
    
    
| Jul 28 2015 |  | Cal-Comp Electronics & Communications Company Limited | (assignment on the face of the patent) |  | / | 
    
    
    
| Jul 28 2015 |  | KINPO ELECTRONICS, INC. | (assignment on the face of the patent) |  | / | 
    
    
    
| Jul 28 2015 |  | XYZPRINTING, INC. | (assignment on the face of the patent) |  | / |