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Patent
D781734
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Priority
Sep 13 2013
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Filed
Mar 13 2014
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Issued
Mar 21 2017
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Expiry
Mar 21 2031
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Assg.orig
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Entity
unknown
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3
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7
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n/a
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I claim, the ornamental design for a sensor for measuring materials, as shown and described.
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FIG. 1 is a front perspective view of a sensor for measuring materials, showing my new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a front elevation view thereof;
FIG. 7 is an enlarged partial view of FIG. 6;
FIG. 8 is a rear elevation view thereof;
FIG. 9 is an enlarged partial view of FIG. 8;
FIG. 10 is a side elevation view thereof taken from the right of FIG. 6; and,
FIG. 11 is a side elevation view thereof taken from the left of FIG. 6.
Lim, Wai-Loong
Patent |
Priority |
Assignee |
Title |
5983701, |
Jun 13 1997 |
HASSANI, FERRI P ; SADRI, AFSHIN; MOMAYEZ, MOE |
Non-destructive evaluation of geological material structures |
6151379, |
Mar 21 1996 |
|
Method and device for measuring density |
7617730, |
Jun 28 2006 |
The Boeing Company |
Ultrasonic inspection and repair mode selection |
8700342, |
Nov 18 2009 |
EVIDENT SCIENTIFIC, INC |
Multi-frequency bond testing |
20040123665, |
|
|
|
D358340, |
Aug 25 1993 |
Hitachi Denshi Kabushiki Kaisha |
Oscilloscope |
D360150, |
Mar 30 1994 |
Agilent Technologies Inc |
Portable protocol analyzer |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 13 2014 | | PROCEQ AG | (assignment on the face of the patent) | | / |
Jul 07 2014 | LIM, WAI-LOONG | PROCEQ AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033798 | /0445 |
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