Patent
   D784342
Priority
Jan 11 2016
Filed
Jan 11 2016
Issued
Apr 18 2017
Expiry
Apr 18 2032
Assg.orig
Entity
unknown
7
18
n/a
The ornamental design for a connection module, as shown and described.

FIG. 1 is a top, front, left side perspective of the connection module;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a back elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a left side elevation view thereof; and,

FIG. 8 is a bottom, front, right side perspective view thereof.

The broken lines that appear on the drawings form no part of the claimed design and are included for illustrative purposes only.

Kim, SeongWhan, Ko, Taehyoung

Patent Priority Assignee Title
D800665, Oct 08 2015 Telit Technologies (Cyprus) Ltd. Connection module
D801277, Oct 08 2015 Telit Technologies (Cyprus) Ltd.; TELIT TECHNOLOGIES CYPRUS LIMITED Connection module
D821331, Oct 08 2015 TELIT TECHNOLOGIES (CYPRUS) LIMITED Connection module
D904355, Dec 11 2015 TELIT CINTERION DEUTSCHLAND GMBH Radio module
D988299, Jun 18 2021 Cellular module
D988300, Mar 09 2021 IoT module
ER3835,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 11 2016Telit Communications S.p.A.(assignment on the face of the patent)
Jan 11 2016KIM, SEONGWHANTELIT COMMUNICATIONS S P A ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0374780743 pdf
Jan 11 2016KO, TAEHYOUNGTELIT COMMUNICATIONS S P A ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0374780743 pdf
Oct 13 2016TELIT COMMUNICATIONS S P A HSBC BANK PLCSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0400070239 pdf
Feb 27 2019HSBC BANK PLCTELIT COMMUNICATIONS S P A RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0484660354 pdf
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