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Patent
D788704
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Priority
Aug 21 2015
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Filed
Feb 18 2016
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Issued
Jun 06 2017
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Expiry
Jun 06 2032
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Assg.orig
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Entity
unknown
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4
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11
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n/a
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We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).
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FIG. 1 is a front and top perspective view of a heat insulating unit for substrate processing apparatus showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view.
Tateno, Hideto, Hara, Daisuke
Patent |
Priority |
Assignee |
Title |
9082694, |
Feb 24 2011 |
KOKUSAI ELECTRIC CORPORATION |
Substrate processing apparatus, method for manufacturing substrate, and method for manufacturing semiconductor device |
9134052, |
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D709323, |
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BBM Technology Ltd |
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D758317, |
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D766833, |
Jul 04 2013 |
Schneider Electric Industries SAS |
Terminal block |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a