Solder pad

Abstract

Description

FIG. 1 is a front, left, and top perspective view of a first embodiment of a solder pad in accordance with our design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left elevation view thereof; and

FIG. 6 is a right elevation view thereof;

FIG. 7 is a front, left, and top perspective view of a second embodiment of a solder pad in accordance with our design;

FIG. 8 is a top plan view thereof;

FIG. 9 is a front elevation view thereof;

FIG. 10 is a rear elevation view thereof;

FIG. 11 is a left elevation view thereof; and,

FIG. 12 is a right elevation view thereof.

All broken lines shown in the drawings depict portions of the solder pad that form no part of the claimed design.

Claims

The ornamental design for a solder pad, as shown and described.