Patent
   D816860
Priority
Jun 27 2016
Filed
Jun 27 2016
Issued
May 01 2018
Expiry
May 01 2033
Assg.orig
Entity
unknown
11
7
n/a
The ornamental design for a system including multiple instrument modules and arrangement thereof, as shown and described.

FIG. 1 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 2 is a rear perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 3 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 4 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 5 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 6 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 7 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 8 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 9 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 10 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 11 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 12 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 13 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 14 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment; and,

FIG. 15 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment.

The broken lines shown in the figures represent portions of the system including multiple instrument modules and arrangement thereof that form no part of the claimed design. The broken line showing immediately adjacent the shaded areas represents boundaries to the claimed design and forms no part of the claimed design.

Watson, Richard, Lloyd, Mark, Cumming, Justin, LiCalzi, Daniel, Lee, Youngsang, Bange, Gregory, Warwick, Richard, Faranda, Robert

Patent Priority Assignee Title
D849539, Jan 26 2018 RAI STRATEGIC HOLDINGS, INC Packaging tray
D854704, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855198, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855199, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855200, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855201, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855202, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D855824, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D857913, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
D857914, Jun 27 2016 Siemens Healthcare Diagnostics Inc. Instrument module
D858791, Jun 27 2016 Siemens Healthcare Diagnostics Inc. System including multiple instrument modules and arrangement thereof
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 27 2016Siemens Healthcare Diagnostics Inc.(assignment on the face of the patent)
Jul 07 2016WARWICK, RICHARDSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Jul 07 2016LLOYD, MARKSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Jul 08 2016LEE, YOUNGSANGSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Jul 08 2016LICALZI, DANIELSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Jul 08 2016FARANDA, ROBERTSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Jul 10 2016BANGE, GREGORYSiemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240598 pdf
Aug 14 2016WATSON, RICHARDESSENTIAL INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240591 pdf
Aug 15 2016CUMMING, JUSTINESSENTIAL INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240591 pdf
Sep 27 2016ESSENTIAL INC Siemens Healthcare Diagnostics IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0400240588 pdf
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