FIG. 1 is a 3D view of a LED chip according to a first embodiment of the present disclosure, in which the light emitting layer is provided with multiple holes penetrating through the light emitting layer and exposing the substrate;
FIG. 2 is another 3D view of the LED chip according to the first embodiment of the present disclosure;
FIG. 3 is a top view of the LED chip according to the first embodiment of the present disclosure;
FIG. 4 is a left-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 5 is a right-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 6 is a front-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 7 is a rear-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 8 is a bottom view of the LED chip according to the first embodiment of the present disclosure;
FIG. 9 is a 3D view of a LED chip according to a second embodiment of the present disclosure;
FIG. 10 is a another 3D view of the LED chip according to a second embodiment of the present disclosure;
FIG. 11 is a top view of the LED chip according to a second embodiment of the present disclosure;
FIG. 12 is a cross-sectional view of the LED chip along line 12-12 in FIG. 11;
FIG. 13 is a left-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 14 is a right-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 15 is a front-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 16 is a rear-side view of the LED chip according to a second embodiment of the present disclosure; and,
FIG. 17 is a bottom view of the LED chip according to a second embodiment of the present disclosure.