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Patent
D833301
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Priority
Jan 27 2017
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Filed
Jan 27 2017
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Issued
Nov 13 2018
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Expiry
Nov 13 2033
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Assg.orig
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Entity
unknown
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8
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39
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n/a
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The ornamental design for a nesting and shock absorbing package, as shown and described.
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FIG. 1 is a top, front and side isometric view of a nesting and shock absorbing package;
FIG. 2 is a bottom, back and side isometric view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a back view thereof;
FIG. 5 is a first side view thereof;
FIG. 6 is a second side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
Liu, Sichang
Patent |
Priority |
Assignee |
Title |
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|
|
|
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Mountainside Investment Group, LLC |
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D801804, |
Jun 21 2016 |
MONARCH FINANCE LLC, AS SUCCESSOR AGENT |
Utility storage base or top |
D810585, |
Jul 30 2015 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Package for a printer component |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 27 2017 | | Western Digital Technologies, Inc. | (assignment on the face of the patent) | | / |
Nov 21 2017 | LIU, SICHANG | Western Digital Technologies, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 044539 | /0019 |
pdf |
Jan 13 2020 | Western Digital Technologies, INC | JPMORGAN CHASE BANK, N A , AS AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 052915 | /0566 |
pdf |
Feb 03 2022 | JPMORGAN CHASE BANK, N A | Western Digital Technologies, INC | RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 | 059127 | /0001 |
pdf |
Aug 18 2023 | Western Digital Technologies, INC | JPMORGAN CHASE BANK, N A | PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT | 064715 | /0001 |
pdf |
Aug 18 2023 | Western Digital Technologies, INC | JPMORGAN CHASE BANK, N A | PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT | 067045 | /0156 |
pdf |
May 03 2024 | Western Digital Technologies, INC | SanDisk Technologies, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 067567 | /0682 |
pdf |
Jun 21 2024 | SanDisk Technologies, Inc | SanDisk Technologies, Inc | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 067982 | /0032 |
pdf |
Aug 20 2024 | SanDisk Technologies, Inc | JPMORGAN CHASE BANK, N A , AS THE AGENT | PATENT COLLATERAL AGREEMENT | 068762 | /0494 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a