FIG. 1 is a top, right, front isometric view of a headset earcup adapter;
FIG. 2 is a bottom, left, back isometric view of the headset earcup adapter shown in FIG. 1;
FIG. 3 is a front view of the headset earcup adapter shown in FIG. 1;
FIG. 4 is a right side view of the headset earcup adapter shown in FIG. 1;
FIG. 5 is a left side view of the headset earcup adapter shown in FIG. 1;
FIG. 6 is a top view of the headset earcup adapter shown in FIG. 1; and,
FIG. 7 is a bottom view of the headset earcup adapter shown in FIG. 1.
The broken lines shown in the drawings represent portions of the headset earcup adapter that form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
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Jun 06 2001 |
NEC Corporation |
Wireless headphone |
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Mar 11 2002 |
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Wireless headset |
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Feb 11 2004 |
Sony Ericsson Mobile Communications AB |
Headset |
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Nov 07 2006 |
Plantronics, Inc.; Plantronics, Inc |
Communications headset |
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Oct 27 2005 |
Samsung Electronics Co., Ltd. |
Headset |
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May 03 2007 |
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Headset |
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Dec 14 2007 |
HMD Global Oy |
Headset |
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Jan 14 2009 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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Dec 18 2008 |
Motorola Mobility LLC |
Audio headset |
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Jan 14 2009 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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Dec 18 2008 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Microphone boom for a communications headset |
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Jun 14 2010 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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Jun 28 2010 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
D681003, |
Apr 16 2012 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |
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Oct 30 2012 |
Harman International Industries, Incorporated |
Behind the ear earphone |
D711851, |
Jul 02 2013 |
Motorola Mobility LLC |
Headset for a communication device |
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Mar 31 2014 |
JVC Kenwood Corporation |
Portion of earphone |
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Jan 08 2013 |
GN Netcom A/S |
Headset |
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Dec 18 2008 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Communications headset |