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Patent
D838190
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Priority
May 26 2017
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Filed
May 26 2017
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Issued
Jan 15 2019
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Expiry
Jan 15 2034
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Assg.orig
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Entity
unknown
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13
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4
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n/a
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The ornamental design for a sensor module, as shown and described.
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FIG. 1 is a perspective view of a sensor module showing our new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is yet another perspective view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a top plan view thereof; and,
FIG. 9 is a bottom plan view thereof.
The broken line portions in the drawing views are included to show unclaimed subject matter only and form no part of the claimed design.
Hsieh, Yuan-Ping, Tu, Sheng-Chan, Lai, Pin-Chen, Hung, Chen-Yu
Patent |
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Assignee |
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D986421, |
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D987217, |
Mar 06 2023 |
|
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D988145, |
Jan 28 2021 |
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D988146, |
Jan 28 2021 |
Mitsubishi Electric Corporation |
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D988147, |
Jan 28 2021 |
Mitsubishi Electric Corporation |
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ER2142, |
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ER3320, |
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ER5334, |
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ER8940, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a