Wafer puck

Abstract

Description

FIG. 1 is a top plan view of the first embodiment of my new design for a wafer puck;

FIG. 2 is a top perspective view thereof;

FIG. 3 is a side elevational view thereof;

FIG. 4 is a top plan view of the second embodiment of my new design for a wafer puck;

FIG. 5 is a top perspective view thereof; and,

FIG. 6 is a side elevational view thereof.

Claims

The ornamental design for a wafer puck, as shown and described.