Patent
   D855572
Priority
Oct 20 2017
Filed
Apr 02 2018
Issued
Aug 06 2019
Expiry
Aug 06 2034
Assg.orig
Entity
unknown
5
11
n/a
The ornamental design for a connector, as shown and described.

FIG. 1 is a front elevational view of a connector showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view showing a front, top and right side thereof;

FIG. 8 is a perspective view showing a rear, bottom and left side thereof;

FIG. 9 is a perspective view showing a front, right side and bottom thereof; and,

FIG. 10 is a perspective view showing a rear, left side and top thereof.

The broken line showing of the connector is for the purpose of illustrating portions of the article and forms no part of the claimed design.

Komoto, Tetsuya

Patent Priority Assignee Title
D906981, Aug 24 2018 SMK Corporation Electrical connector
D911290, Aug 24 2018 SMK Corporation Electrical connector
D976837, Sep 29 2020 Japan Aviation Electronics Industry, Limited Connector
ER5807,
ER6119,
Patent Priority Assignee Title
5073116, Mar 01 1991 AMP Incorporated Surface mount LCC socket
6752632, Mar 21 2003 The Boeing Company Connector interface pad for structurally integrated wiring
6780056, Jul 31 2003 Amphenol Corporation EMI-shielded interposer assembly
7234946, Feb 25 2005 Hon Hai Precision Ind. Co., Ltd. Land grid array socket
8221135, Apr 13 2010 Hon Hai Precision Ind. Co., Ltd. Socket connector having resilient positioning member securing IC package therein
20020196614,
20050239302,
20080032538,
20100033940,
D524246, Mar 08 2005 Cheng, Uei Precision Industry Co., Ltd. Camera module socket connector
D531122, Mar 12 2004 SMK Corporation Electrical connector
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Mar 26 2018KOMOTO, TETSUYAJapan Aviation Electronics Industry, LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454070752 pdf
Apr 02 2018Japan Aviation Electronics Industry, Limited(assignment on the face of the patent)
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