Patent
   D863238
Priority
Aug 30 2017
Filed
Feb 26 2018
Issued
Oct 15 2019
Expiry
Oct 15 2034
Assg.orig
Entity
unknown
0
12
n/a
The ornamental design for a light emitting diode chip, as shown and described.

FIG. 1 is a front perspective view of a light emitting diode chip showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 2; and,

FIG. 8 is an enlarged partial view of a circled portion 8 of FIG. 7.

The broken lines shown in the drawings are illustrative purpose only and form no part of the claimed design. The dash-dot-dash broken lines are used to show the boundary between unclaimed and claimed subject matter, and thus form no part of the claimed design. The top layer is substantially transparent or translucent.

Sakamoto, Ryo

Patent Priority Assignee Title
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D690670, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D691569, Mar 25 2011 CREELED, INC LED chip
D693779, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D693781, Aug 22 2012 Kabushiki Kaisha Toshiba Light-emitting diode
D707641, Aug 01 2013 EPISTAR CORPORATION Light-emitting diode
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Feb 16 2018SAKAMOTO, RYODOWA ELECTRONICS MATERIALS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454420441 pdf
Feb 26 2018DOWA ELECTRONICS MATERIALS CO., LTD.(assignment on the face of the patent)
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