FIG. 1 is a front elevational view of a first embodiment of a wireless IC tag according to our new design. A rear elevational view thereof is a mirror-image of the front elevational view.
FIG. 2 is a right side elevational view thereof.
FIG. 3 is a left side elevational view thereof.
FIG. 4 is a top plan view thereof.
FIG. 5 is a cross-sectional view thereof, taken in the direction of line 5-5 in FIG. 4.
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a perspective view thereof.
FIG. 8 is a front elevational view of a second embodiment of a wireless IC tag according to our new design. A rear elevational view thereof is a mirror-image of the front elevational view.
FIG. 9 is a right side elevational view thereof.
FIG. 10 is a left side elevational view thereof.
FIG. 11 is a top plan view thereof.
FIG. 12 is a cross-sectional view thereof, taken in the direction of line 12-12 in FIG. 11.
FIG. 13 is a bottom plan view thereof; and,
FIG. 14 is a perspective view thereof.
The broken lines shown in FIG. 4, and FIG. 11 indicate planes upon which the sectional views in FIG. 5, and FIG. 12, respectively, are taken and form no part of the claimed design.
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