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Patent
D875071
Priority
Oct 15 2018
Filed
Oct 15 2018
Issued
Feb 11 2020
Expiry
Feb 11 2035
Assg.orig
Entity
unknown
22
50
n/a
The ornamental design for a headset for telephones , as shown and described.
FIG. 1 is a front elevation view of a headset for telephones;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a top plan the view thereof;
FIG. 6 is a bottom plan the view thereof; and,
FIG. 7 is a front, right side perspective view thereof.
The dashed or broken lines shown in the drawings depict portions of the headset for telephones in which the design is embodied that form no part of the claimed design.
Lu, Haichuan , Wei, Xinlong
Patent
Priority
Assignee
Title
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Feb 08 2012
Decibullz LLC
Moldable earpiece system
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Jan 20 2017
Decibullz LLC
Earpiece intra-auricular support system
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Decibullz LLC
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Earpiece intra-auricular support system
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Feb 08 2012
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Moldable earpiece system
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Aug 30 2018
DIGIORANGE INC.; DIGIORANGE INC
Pair of wireless earbuds
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Dec 28 2017
Harman International Industries, Incorporated
Headphone
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Apr 10 2020
Earphone
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GN AUDIO A/S
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BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
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Decibullz LLC
Intra-auricular earbud support
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JVCKENWOOD Corporation
Earphone
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Dec 31 2019
Harman International Industries, Incorporated
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Jan 06 2020
SHENZHEN NEARBYEXPRESS TECHNOLOGY DEVELOPMENT COMPANY LIMITED
Earphones
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GOOGLE LLC
Wireless earbud
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GOOGLE LLC
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Patent
Priority
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Bose Corporation
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Bose Corporation
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Bose Corporation
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Bose Corporation
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Bose Corporation
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Bose Corporation
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Harman International Industries, Incorporated
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CIRQUE AUDIO TECHNOLOGY CO., LTD.
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JVC Kenwood Corporation
Earphone
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May 09 2017
DROWSY DIGITAL, INC
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Jul 02 2018
MPOW TECHNOLOGY CO., LIMITED
Earphone
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Oct 20 2017
SHENZHEN SHENGLAN ELECTRONIC INDUSTRY CO., LTD.
Earphone
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May 24 2017
Shenzhen Kingvie Technology Co., Ltd.
Earphones
EM56097570001 ,
Executed on Assignor Assignee Conveyance Frame Reel Doc
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Maintenance Fee Events
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