Patent
   D888676
Priority
Aug 29 2018
Filed
Feb 27 2019
Issued
Jun 30 2020
Expiry
Jun 30 2035
Assg.orig
Entity
unknown
3
15
n/a
The ornamental design for a case for a circuit board, as shown and described.

FIG. 1 is a perspective view of a case for a circuit board showing our new design.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view of a case for a circuit board shown in an example environment.

The broken lines are for environmental purposes only and form no part of the claimed design.

Lim, Gwangman

Patent Priority Assignee Title
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Patent Priority Assignee Title
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Dec 10 2018LIM, GWANGMANSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0484500982 pdf
Feb 27 2019Samsung Electronics Co., Ltd.(assignment on the face of the patent)
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