The ornamental design for a flip cappackage with chamfer, as shown and described.
FIG. 1 is a top, front perspective view of a flip cap package with chamfer according to the present design.
FIG. 2 is a bottom, right side perspective view thereof.
FIG. 3 is a front elevation view thereof.
FIG. 4 is a rear elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a left side elevation view thereof.
FIG. 7 is a top plan view thereof.
FIG. 8 is a bottom plan view thereof.
FIG. 9 is a rear elevation view of a second embodiment of a flip cap package with chamfer showing the same portions of the package as the first embodiment except for the hinge in broken lines.
FIG. 10 is a right side elevation view of the embodiment of FIG. 9; and,
FIG. 11 is a left side elevation view of the embodiment of FIG. 9.
The broken lines shown represent portions of the claim that form no part of the claimed design.