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The ornamental design for a heat dissipation plate, as shown and described.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 05 2019 | Cooler Master Co., Ltd. | (assignment on the face of the patent) | / | |||
Jul 19 2019 | CHENG, WEN-TI | COOLER MASTER CO ,LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049877 | /0988 |
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