PTO
Wrapper
PDF
Dossier
Espace
Google
Patent
D908632
Priority
Sep 17 2018
Filed
Sep 17 2018
Issued
Jan 26 2021
Expiry
Jan 26 2036
Assg.orig
Entity
unknown
8
61
n/a
The ornamental design for a power module , as shown and described.
FIG. 1 is a top perspective view of a power module showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a side view thereof;
FIG. 5 is an opposing side view thereof:
FIG. 6 is an end view thereof; and,
FIG. 7 is an opposing end view thereof.
The broken lines shown in the drawings depict portions of the power module that form no part of the claimed design.
Passmore, Brandon , Cole, Zachary
Patent
Priority
Assignee
Title
10028400 ,
Aug 07 2015
Fuji Electric Co., Ltd.
Semiconductor device
10080301 ,
Oct 17 2013
WOLFSPEED, INC
High voltage power chip module
10091898 ,
Dec 13 2016
Hyundai Motor Company; Kia Motors Corporation
Power conversion device
10312227 ,
Feb 18 2016
Mitsubishi Electric Corporation
Power semiconductor module
10345864 ,
May 31 2018
Dell Products, LP
Multi-standard chassis security slot for information handling systems
10347608 ,
May 27 2016
General Electric Company
Power module
10517181 ,
Sep 29 2015
HITACHI ASTEMO, LTD
Electronic control device and manufacturing method for same
5347158 ,
Aug 19 1992
Kabushiki Kaisha Toshiba
Semiconductor device having a particular terminal arrangement
5466974 ,
Feb 19 1993
Sundstrand Corporation
Electric power distribution module for an electric power generation and distribution system
5471089 ,
Jun 30 1992
Mitsubishi Denki Kabushiki Kaisha
Semiconductor power module
5705775 ,
Dec 21 1994
NGK Insulators, Ltd.
Corona control ring having elongated water discharge holes
5835356 ,
Sep 29 1995
Allen Bradley Company, LLC; ALLEN-BRADY COMPANY, INC
Power substrate module
6000034 ,
May 06 1997
POWER MEASUREMENT LTD
Security system and method for revenue class electricity meter
6307755 ,
May 27 1999
Advanced Analogic Technologies, Inc
Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die
6400577 ,
Aug 30 2001
Tyco Electronics Corporation
Integrated circuit socket assembly having integral shielding members
7687903 ,
Nov 16 2007
Semiconductor Components Industries, LLC
Power module and method of fabricating the same
7786486 ,
Aug 02 2005
Perfect Galaxy International Limited
Double-sided package for power module
8018056 ,
Dec 21 2005
Infineon Technologies Americas Corp
Package for high power density devices
8368210 ,
Dec 21 2005
Infineon Technologies Americas Corp
Wafer scale package for high power devices
8410720 ,
Apr 07 2008
Metrospec Technology, LLC.; MetroSpec Technology, LLC
Solid state lighting circuit and controls
9095054 ,
Oct 12 2012
WOLFSPEED, INC
High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices
9426883 ,
Jan 30 2014
WOLFSPEED, INC
Low profile, highly configurable, current sharing paralleled wide band gap power device power module
9839146 ,
Oct 20 2015
WOLFSPEED, INC
High voltage power module
20040252462 ,
20050161797 ,
20050174744 ,
20060126318 ,
20080098895 ,
20090004547 ,
20090021895 ,
20100043781 ,
20100284155 ,
20110011633 ,
20110102054 ,
20110193491 ,
20110210568 ,
20110221268 ,
20110222244 ,
20120299661 ,
20130062751 ,
20130063184 ,
20130164567 ,
20130188397 ,
20130248883 ,
20130285234 ,
20140097501 ,
20140183550 ,
20140284155 ,
20150131236 ,
20150138858 ,
20150189784 ,
20150216067 ,
20150303806 ,
20160043711 ,
20170112005 ,
20180070462 ,
CN102064718 ,
D821306 ,
Mar 21 2017
SHENZHEN PULESI ELECTRONIC TECHNOLOGY CO , LTD
Automobile jump starter
D839184 ,
Nov 16 2016
GETAC TECHNOLOGY CORPORATION
Battery charger
D872021 ,
Mar 26 2018
GUANGDONG BESTEK E-COMMERCE CO., LTD.
Power adapter
WO2014090686 ,
Executed on Assignor Assignee Conveyance Frame Reel Doc
Sep 14 2018 COLE, ZACHARY CREE FAYETTEVILLE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 046886 /0727
pdf
Sep 14 2018 PASSMORE, BRANDON CREE FAYETTEVILLE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 046886 /0727
pdf
Sep 17 2018 Cree Fayetteville, Inc. (assignment on the face of the patent) /
Jun 24 2021 CREE FAYETTEVILLE, INC Cree, Inc MERGER SEE DOCUMENT FOR DETAILS 057738 /0781
pdf
Oct 01 2021 Cree, Inc WOLFSPEED, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 057891 /0880
pdf
Jun 23 2023 WOLFSPEED, INC U S BANK TRUST COMPANY, NATIONAL ASSOCIATION SECURITY INTEREST SEE DOCUMENT FOR DETAILS 064185 /0755
pdf
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a