FIG. 1 is a perspective view of a first embodiment of a headphone, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a perspective view of a second embodiment of a headphone;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
Broken lines are for illustrating portions of the headphone which form no part of the claimed design.
The stippling in FIGS. 8-14 represents a difference in color and/or material.
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