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Patent
D920912
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Priority
Jan 23 2019
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Filed
Jul 17 2019
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Issued
Jun 01 2021
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Expiry
Jun 01 2036
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Assg.orig
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Entity
unknown
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3
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17
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n/a
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The ornamental design for a core component, as shown and described.
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FIG. 1 is a front elevation view of the core component, showing my new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top, front, right side perspective view thereof; and,
FIG. 8 is a bottom, front, right side perspective view thereof.
The broken lines in the drawings show environment only and form no part of the claimed design.
Moriya, Hitoshi
Patent |
Priority |
Assignee |
Title |
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Circuit board and electronic circuit module using the same |
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Heat sink |
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Jul 25 2011 |
SUMIDA CORPORATION |
Coil part |
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SUMIDA CORPORATION |
Magnetic component |
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Dec 13 2016 |
SMK Corporation |
Contactor |
JP2006108453, |
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JP2017216260, |
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JP8213242, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a