FIG. 1 is a perspective view of earphones showing my new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines in the drawings depict boundaries of the earphones that form no part of the claimed design.
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Pair of headsets for telephones |
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SHENZHEN SHI KISB ELECTRONIC CO , LTD |
Earphone |
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SHENZHEN SHENGXINGWANG PRECISION TECHNOLOGY CO , LTD |
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