The ornamental design for a component of a liquiddischarge nozzle for semiconductor substrate processing apparatus, as shown and described herein.
FIG. 1 is a front, bottom and left-side perspective view of a component of a liquid discharge nozzle for semiconductor substrate processing apparatus;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown represent portions of a component of a liquid discharge nozzle for semiconductor substrate processing apparatus and form no part of the claimed design.