Patent
   D940769
Priority
Sep 26 2018
Filed
Feb 26 2019
Issued
Jan 11 2022
Expiry
Jan 11 2037
Assg.orig
Entity
unknown
0
18
n/a
The ornamental design for a thermal conduction metal material, as shown and described.

FIG. 1 is a perspective view from the top and left side of thermal conduction metal material.

FIG. 2 is a perspective view from the bottom and left side thereof.

FIG. 3 is a perspective view from the top and right side thereof.

FIG. 4 is a top plan view thereof.

FIG. 5 is a bottom plan view thereof.

FIG. 6 is a front elevation view thereof.

FIG. 7 is a rear elevation view thereof.

FIG. 8 is a left side elevation view thereof.

FIG. 9 is a right side elevation view thereof.

FIG. 10 is an enlarged cross-sectional view taken along the line 10-10 in the FIG. 4.

FIG. 11 is an enlarged cross-sectional view taken along the line 11-11 in the FIG. 4

FIG. 12 is an enlarged cross-sectional view taken along the line 12-12 in the FIG. 4; and,

FIG. 13 is an enlarged cross-sectional view taken along the line 13-13 in the FIG. 4.

The design shown is not to be limited to any particular size and may be scaled larger or smaller.

Saiwai, Toshihiko, Sakamoto, Fumio

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Feb 12 2019SAIWAI, TOSHIHIKOMitsubishi Materials CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0484400237 pdf
Feb 12 2019SAKAMOTO, FUMIOMitsubishi Materials CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0484400237 pdf
Feb 26 2019Mitsubishi Materials Corporation(assignment on the face of the patent)
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