FIG. 1 is a perspective view of an earphone showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a right side elevation view thereof;
FIG. 8 is a perspective view of a second embodiment of an earphone showing our new design;
FIG. 9 is another perspective view thereof;
FIG. 10 is a front elevation view thereof;
FIG. 11 is a rear elevation view thereof;
FIG. 12 is a top plan view thereof;
FIG. 13 is a bottom plan view thereof;
FIG. 14 is a left side elevation view thereof;
FIG. 15 is a right side elevation view thereof;
FIG. 16 is a perspective view of a third embodiment of an earphone showing our new design;
FIG. 17 is a front elevation view thereof;
FIG. 18 is a rear elevation view thereof;
FIG. 19 is a top plan view thereof;
FIG. 20 is a bottom plan view thereof;
FIG. 21 is a left side elevation view thereof;
FIG. 22 is a right side elevation view thereof;
FIG. 23 is a perspective view of a fourth embodiment of an earphone showing our new design;
FIG. 24 is another perspective view thereof,
FIG. 25 is a front elevation view thereof;
FIG. 26 is a rear elevation view thereof;
FIG. 27 is a top plan view thereof;
FIG. 28 is a bottom plan view thereof;
FIG. 29 is a left side elevation view thereof; and,
FIG. 30 is a right side elevation view thereof.
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