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Patent
D956004
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Priority
Mar 27 2020
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Filed
Sep 28 2020
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Issued
Jun 28 2022
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Expiry
Jun 28 2037
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Assg.orig
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Entity
unknown
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2
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13
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n/a
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The ornamental design for a liquid-cooling heat dissipation module, as shown and described.
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FIG. 1 is a front, top, right perspective view of a liquid-cooling heat dissipation module showing our new design;
FIG. 2 is a back, top, left perspective view thereof;
FIG. 3 is a front, bottom, right perspective view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a top plan view thereof; and,
FIG. 9 is a bottom plan view thereof.
The broken lines in the drawings illustrate portions of the liquid-cooling heat dissipation module which form no part of the claimed design.
Chen, Chien-Yu, Chen, Chien-An, Ye, Tian-Li, Lin, Jen-Hao
Patent |
Priority |
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Oct 14 2016 |
KOKUSAI ELECTRIC CORPORATION |
Air flow controller for heater of substrate processing apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a