FIG. 1 is a top, left, front perspective view of an electronic device housing, showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a front elevation view thereof; and,
FIG. 7 is a rear elevation view thereof.
The material shown is of uniform thickness.
The broken lines of even length shown in the drawings illustrate portions of the electronic device housing that form no part of the claimed design.
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