Patent
   D975060
Priority
Sep 29 2020
Filed
Sep 29 2020
Issued
Jan 10 2023
Expiry
Jan 10 2038
Assg.orig
Entity
unknown
0
13
n/a
The ornamental design for a modular earpiece housing, as shown and described.

FIG. 1 is a front perspective elevation view of a modular earpiece housing showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along line 8-8 in FIG. 6.

The broken lines show portions of the modular earpiece housing that forms no part of the claimed design.

Staerke, Mads, Martini, Jesper

Patent Priority Assignee Title
Patent Priority Assignee Title
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CN306128979,
D488460, Dec 09 2002 Shure Incorporated Earphone
D563945, Dec 28 2006 Shure Acquisition Holdings, Inc Earphone portion
D735169, Jun 23 2014 Housing of an in-ear earphone
D740786, Jul 25 2014 Zhongshan K-mate General Electronics Co., Ltd. Pair of earphones
D783578, Dec 30 2015 Facebook Technologies, LLC Earbud
D840979, Dec 30 2015 META PLATFORMS TECHNOLOGIES, LLC Pair of earbud tips
D885371, Apr 21 2018 DONGGUAN ZHENGSAI ELECTRONICS CO , LTD Earphone
D912647, Dec 19 2018 Bose Corporation Earbud
D912648, Dec 21 2018 Bose Corporation Earbud
D930622, Sep 17 2020 Shenzhen Worgo Technology Limited. Pair of earbuds
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 29 2020Adapto Global ApS(assignment on the face of the patent)
Sep 29 2020STAERKE, MADSAdapto Global ApSASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0539130416 pdf
Sep 29 2020MARTINI, JESPERAdapto Global ApSASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0539130416 pdf
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