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Patent
D975060
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Priority
Sep 29 2020
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Filed
Sep 29 2020
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Issued
Jan 10 2023
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Expiry
Jan 10 2038
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Assg.orig
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Entity
unknown
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0
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13
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n/a
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The ornamental design for a modular earpiece housing, as shown and described.
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FIG. 1 is a front perspective elevation view of a modular earpiece housing showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof taken along line 8-8 in FIG. 6.
The broken lines show portions of the modular earpiece housing that forms no part of the claimed design.
Staerke, Mads, Martini, Jesper
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
3047089, |
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20220103928, |
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|
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CN306128979, |
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|
D488460, |
Dec 09 2002 |
Shure Incorporated |
Earphone |
D563945, |
Dec 28 2006 |
Shure Acquisition Holdings, Inc |
Earphone portion |
D735169, |
Jun 23 2014 |
|
Housing of an in-ear earphone |
D740786, |
Jul 25 2014 |
Zhongshan K-mate General Electronics Co., Ltd. |
Pair of earphones |
D783578, |
Dec 30 2015 |
Facebook Technologies, LLC |
Earbud |
D840979, |
Dec 30 2015 |
META PLATFORMS TECHNOLOGIES, LLC |
Pair of earbud tips |
D885371, |
Apr 21 2018 |
DONGGUAN ZHENGSAI ELECTRONICS CO , LTD |
Earphone |
D912647, |
Dec 19 2018 |
Bose Corporation |
Earbud |
D912648, |
Dec 21 2018 |
Bose Corporation |
Earbud |
D930622, |
Sep 17 2020 |
Shenzhen Worgo Technology Limited. |
Pair of earbuds |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a