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The ornamental design for a module-based field termination assembly, as shown and described.
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The broken lines shown in
Kumar KN, Dinesh, Pakimo, Dawa, Thayumanavan, Chandrashekar, Cherian, Jaison, Deshpande, Shripurnabodh, Bhutia, Karma, Vijaykumar, Hemanth, Balakrishna, Vishwanath
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Jan 28 2019 | PAKIMO, DAWA | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 28 2019 | THAYUMANAVAN, CHANDRASHEKAR | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 28 2019 | CHERIAN, JAISON | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 28 2019 | DESHPANDE, SHRIPURNABODH | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 28 2019 | VIJAYKUMAR, HEMANTH | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 28 2019 | BALAKRISHNA, VISHWANATH | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 29 2019 | KUMAR KN, DINESH | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 29 2019 | BHUTIA, KARMA | Honeywell International Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048209 | 0461 | |
Jan 31 2019 | Honeywell International Inc. | (assignment on the face of the patent) |
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