A backup material for small bore drilling in hard crystalline materials, such as multilayer circuit boards containing polyimide/glass, polyimide kevlar or modified epoxy BT/glass, includes at least one layer of hard crystalline material. Standard LCOA material with an additional layer selected from the group comprising polyimides, fluorocarbons and high temperature polycarbonates has proven successful.

Patent
   RE32759
Priority
Mar 04 1987
Filed
Mar 04 1987
Issued
Oct 04 1988
Expiry
Mar 04 2007
Assg.orig
Entity
Large
0
5
EXPIRED
1. In a backup sheet for backing a work sheet during a small bore drilling process, said work sheet containing at least one layer of hard crystalline hard material selected from the group comprising polyimide/glass, polyimide/kevlar and modified epoxy BT/glass, said backup sheet having a core, the improvement comprising an additional layer of hard crystalline hard material selected from the group comprising polyimides, fluorocarbons and high temperature polycarbonates fixed to opposite sides of said core.
3. A backup sheet for backing a work sheet during a small bore drilling process, said work sheet containing at least one layer of hard crystalline hard material, said backup sheet comprising a core constructed of a compressed organic material and a binder, said organic material being selected from the group comprising wood chips and sawdust, said core having opposite planar surfaces; a first aluminum layer adhered to one of said planar surfaces of said core and a second aluminum layer adhered to the other of said planar surfaces of said core; and a first layer of hard crystalline hard material adhered to said first aluminum layer and a second layer of hard crystalline hard material adhered to said second aluminum layer, said first and second layers of hard crystalline hard material being selected from the group comprising polyimides, fluorocarbons and high temperature polycarbonates.
2. A backup sheet according to claim 1 wherein said additional layer consists of a layer of polyimide of the order of about 0.002 inches thick fixed to said core with a layer of acrylic adhesive of the order of 0.001 inches thick.
4. A backup sheet according to claim 3 wherein said first and second layers of hard crystalline hard materials each consist of a layer of polyimide of the order of about 0.002 inches thick and are adhered to the respective first and second aluminum layers with a layer of acrylic adhesive of the order of about 0.001 inches thick.

This invention relates to a backup or substrate for drilling small holes in polyimide and modified epoxy materials.

Multilayer printed circuit boards are typically constructed of an insulative layer separating conductive layers, such as copper. Standard multilayer boards, having 2 to 20 layers, range in thickness from 0.015 to about 0.125 inches each. Heretofore, it was possible to successfully drill holes down to about 0.006 inches in diameter in printed circuit boards constructed of epoxy glass using backup materials such as LCOA, a material commercially available from Laminating Company of America of Escondido, Calif. However, more recently printed circuit boards have been constructed of polyimide/glass, polyimide/kevlar and modified epoxy BT/glass materials. These particular materials are hard crystallinehard crystalline hard structures. Particularly, the material has proven useful in connection with drilling materials constructed of polyimide glass, polyimide-kevlar and modified epoxy BT-glass material. In addition, although polyimide material is disclosed as being the preferred material to adhered by acrylics to LCOA back-up material, it has also been found that flurocarbons, such as Teflon, and high temperature polycarbonates are also useful in place of polyimide materials.

This invention is not to be limited by the embodiment shown in the drawing and described in the description, which is given by way of example and not of limitation, but only in accordance with the scope of the appended claims.

Eidal, Russell C.

Patent Priority Assignee Title
Patent Priority Assignee Title
4343846, May 12 1980 Baltek Corporation Balsa-core sandwich laminate
4408365, Dec 06 1980 BONAR FLOORS LIMITED Mats
4456657, Nov 05 1980 VANTICO INC Metal-clad laminate adapted for printed circuits
4562119, Sep 15 1980 CIBA-GEIGY CORPORATION, A CORP OF NEW YORK Flexible, printed circuit
4680220, Feb 26 1985 W. L. Gore & Associates, Inc. Dielectric materials
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Mar 04 1987Control Data Corporation(assignment on the face of the patent)
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