An ordered-disordered transition is observed in semiconductor alloys which enables either the ordered or disordered structure to be produced.

Patent
   RE33693
Priority
Apr 26 1989
Filed
Jun 08 1990
Issued
Sep 17 1991
Expiry
Apr 26 2009
Assg.orig
Entity
Large
5
5
all paid
1. A semiconductor device comprising a superlattice of interleaved first and second semiconductor layers, such interleaved first and second layers having first and second compositions, said first composition comprising ordered Gex Si1-x.
2. A device as recited in claim 1 further comprising first and second semiconductor layers on opposed major surfaces of said superlattice.
3. A device as recited in claim 1 further comprising electrical contacts to said first and second layers.
4. A device as recited in claim 3 in which said first and second layers have opposite conductivity types.
5. A device as recited in claim 1 further comprising a light source, said source illuminating said superlattice.
6. A device as recited in claim 5 in which the beam from source is parallel to said interleaved layers.
7. A device as recited in claim 5 in which the beam from source is perpendicular to said interleaved layers.
8. A device as recited in claim 7 further comprising means for scanning said light beam on said superlattice.
9. A device as recited in claim 8 further comprising means for detecting light reflected from said superlattice. PAR
10. A device as recited in claim 2 further comprising source and drain electrodes to said interleaved layers.
11. A device as recited in claim 10 further comprising a gate electrode.
12. A device as recited in claim 2 further comprising a substrate, said superlattice and said first and second layers being disposed on said substrate.
A semiconductor device comprising at least one strained epitaxial semiconductor alloy layer having a composition which comprises ordered Gex Si1-x, the atoms of said ordered Gex Si1-x layer being characterized by long-range periodicity of the constituent
species in the lattice. 14. The device of claim 13, said at least one layer being comprised in a superlattice of interleaved first and second semiconductor layers, such interleaved first and second layers having first and second compositions, said first composition comprising ordered Gex Si1-x. 15. The device of claim 14, further comprising first and second semiconductor layers on opposed major surfaces of said superlattice. 16. The device of claim 15, further comprising a substrate, said superlattice and said first and second layers being disposed on said substrate. 17. The device of claim 14, said first and second layers having opposite conductivity types. 18. The device of claim 13, further comprising an electrical contact to said layer. 19. The device of claim 18, comprising a plurality of electrical contacts to said layer, said plurality comprising a source contact and a drain contact. 20. The device of claim 19, said plurality comprising a gate contact. 21. The device of claim 13, further comprising a light source for illuminating said layer. 22. The device of claim 21, said light source being adapted for illumination in a direction parallel to said layer. 23. The device of claim 21, said light source being adapted for illumination in a direction perpendicular to said layer. 24. The device of claim 21, further comprising means for scanning light from said source across said layer. 25. The device of claim 24, further comprising means for detecting light reflected from said layer.

Order-disorder transitions can be effected as described above in preferred structures comprising at least one strained epitaxial germanium-silicon semiconductor alloy layer.

Bean, John C., Ourmazd, Abbas

Patent Priority Assignee Title
5891769, Apr 07 1997 Freescale Semiconductor, Inc Method for forming a semiconductor device having a heteroepitaxial layer
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Jun 08 1990AT&T Bell Laboratories(assignment on the face of the patent)
Mar 29 1996AT&T CorpAGERE Systems IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0163010651 pdf
Jan 30 2001Lucent Technologies IncAGERE Systems IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0163010651 pdf
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