An aligning system includes an object to be acted upon at predetermined locations, such as a circuit board to receive solder paste. There is a device, such as a stencil, characterized by the pattern for acting upon the object. A video probe is arranged to look at both the device and the object for providing image signals representative of both. A comparator compares the image signals to provide an error signal representative of misalignment between the device and object. A positioner responsive to the error signal relatively positions the device and object to reduce the error. An operator causes the device to operate upon the object at the predetermined locations.

Patent
   RE34615
Priority
Jan 31 1992
Filed
Jan 31 1992
Issued
May 24 1994
Expiry
Jan 31 2012
Assg.orig
Entity
Large
40
4
all paid
1. Aligning apparatus comprising,
an object to be acted upon at predetermined locations defining a pattern,
a device characterized by said pattern for acting upon said object,
a video probe arranged to look at both said device and said object for providing image signals representative of both,
means for comparing both image signals to obtain an error signal representative of misalignment between the device and object,
means responsive to said error signal for relatively positioning translating and rotating said device and said object to reduce said error,
and means for operating upon said object with said device upon said predetermined locations.
12. A method of aligning an object to be acted upon at predetermined locations defining a pattern with a device characterized by said pattern for acting upon said object which method includes the steps of,
positioning a video probe to look at first one of said device and said object and then the other for providing image signals representative of both,
comparing both said image signals to provide an error signal representative of misalignment between said device and object,
relatively positioning translating and rotating said device and said object while sensing said error signal to reduce said error,
and operating upon said object with said device upon said predetermined locations with said object and said device then being in alignment.
2. Aligning apparatus is accordance with claim 1 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
3. Aligning apparatus in accordance with claim 1 and further comprising,
an object to be acted upon at predetermined locations defining a pattern,
a device characterized by said pattern for acting upon said object,
a video probe arranged to look at said device and said object for providing image signals representative of both,
means for comparing both image signals to obtain an error signal representative of misalignment between the device and object,
means responsive to said error signal for relatively positioning said device and said object to reduce said error,
and means for operating upon said object with said device upon said predetermined locations,
a second of said video probes spaced from the first-mentioned video probe arranged to look at both said device and said object for providing image signals representative of both at areas thereof different from the areas viewed by said first-mentioned video probe,
and means for relatively displacing said video probes while in fixed relative relation and one of said object and device predetermined incremental distances in first and second orthogonal directions and a rotational directional to provide a reference image signal characterizing said pattern.
4. Aligning apparatus is accordance with claim 3 and further comprising:
for each of said video probes video probe support means for selectively moving the associated video probe between a first position located between said device and said object and a second position outside the region between said object and said device,
and means for locating the associated video probe in said first position before acting upon said object and then displacing said video probe to said second position after relatively positioning said device and said object to reduce said error and operating upon said object with said device upon said predetermined locations with the associated video probe in said second position.
5. Aligning apparatus in accordance with claim 4 wherein each of said video probe support means comprises,
a movable probe support carrying said video probe,
a fixed base having vertical walls each formed with front and rear slots with each slot having a horizontal leading portion and a depending angled trailing portion,
said movable probe support having elements for riding in said slots to allow said video probe to move between said first position with said video probe extended and said second position with said video probe retracted.
6. Aligning apparatus in accordance with claim 8 5 wherein said movable probe support comprises a main clamp supporting said video probe substantially at its center of gravity and further comprising,
ball-and-cone pieces and reference balls,
said fixed base comprising a vertical bracket carrying one of said reference balls and said ball-and-cone pieces,
said main clamp carrying the other of said reference balls and ball-and-cone pieces arranged so that engagement of said ball-and-cone pieces with mating reference balls defines a reference position of said video probe.
7. Aligning apparatus in accordance with claim 1 and further comprising,
video probe support means for selectively moving said video probe between a first position located between said device and said object and a second position outside the region between said object and said device,
and means for locating said video probe in said first position before acting upon said object and then displacing said video probe to said second position after relatively positioning said device and said object to reduce said error and operating upon said object with said device upon said predetermined locations with said video probe in said second position.
8. Aligning apparatus in accordance with claim 7 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
9. Aligning apparatus in accordance with claim 7 wherein each of said video probes comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
10. Aligning apparatus in accordance with claim 7 wherein said video probe support means comprises,
a movable probe support carrying said video probe,
a fixed base having vertical walls each formed with front and rear slots with each slot having a horizontal leading portion and a depending angled trailing portion,
said movable probe support having elements for riding in said slots to allow said video probe to move between said first position with said video probe extended and said second position with said video probe retracted.
11. Aligning apparatus in accordance with claim 2 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
13. A method in accordance with claim 12 and further including the steps of moving said video probe between an inside position located between said device and said object,
then locating said video probe in an outside position outside the region between said object and said device,
and operating upon said object with said device only with said video probe in said outside position.
14. A method in accordance with claim 13 and further including the steps of of aligning an object to be acted upon at predetermined locations defining a pattern with a device characterized by said pattern for acting upon said object which method includes the steps of,
positioning a video probe to look at first one of said device and said object and then the other for providing image signals representative of both,
comparing both said image signals to provide an error signal representative of misalignment between said device and object,
relatively positioning said device and said object while sensing said error signal to reduce said error,
operating upon said object with said device upon said predetermined locations with said object and said device then being in alignment,
looking first at one of said device and said object and then the other with a second video probe spaced from the first-mentioned video probe to provide a second set of image signals representative of said device and said object different from the image signals provided by said first-mentioned video and the areas representative thereof,
and relatively displacing said video probes while in fixed relative relation with respect to one of said object and device predetermined incremental distances in first and second orthogonal directions and a rotational direction to provide a reference image signal characterizing said pattern.

11loos looks at the stencil. This next prompt instructs the operator to rotate the vision probes throu through 180° to look at the stencil. The operator then rotates mirror tubes 32 through the 180° established by the rotate clamps 42. The operator then drives the screen into position above the board with joy stick and θ push button controls on the ASP-24 machine. The operator positions the overhead structure in x, y and θ into a position such that the vision probes observe the pattern on the screen or stencil that matches the pattern on the circuit board previously aligned centered within the field of view of the probes. In response to each actuation of button 14A the menu prompts the operator to teach the pattern that is desirable after manually locating the stencil. The operator may be required to make fine adjustments in the window by moving trackball 14D and changing the window size until the object is clearly defined and boxed in a square on monitor 15. The operator then depresses push-button 14B and thereby teaches the system the pattern it is looking for with the first probe. The operator follows the same procedure for the second probe. Then the operator pushes button 14C to indicate teaching is complete.

The screen printer then makes a number of automatic moves to learn the geometry associated with this particular setup and this particular type board.

The x stepper motor first moves the screen printer a predetermined number of steps in the x direction. This movement defines the world coordinate system for the cameras 33. Because of this feature the cameras may be placed at any angle anywhere along the front of the circuit board. The y stepper motors then move the screen printer a predetermined number of steps in the orthogonal y direction to confirm the world coordinate system. The system also recognizes the number of steps per pixel during these x-y moves. These moves enable recognition of how much the image moves for every step of the stepper drive system. Then the stepper motors move the screen printer through pure rotation a predetermined number of steps to determine how the object translates in x and y coordinates during a pure rotation. The printer repeats these translational and rotational movements.

The system has thus recognized how the object moves in x and y and how it translates in x and y during a rotational move. This information on these moves allows the system to learn trigonometric solutions of several triangles.

Referring to FIG. 6, there is shown a diagrammatic representation of moves in x, y and θ helpful in understanding the principles of the invention involved in learning the geometry of the circuit boards and stencils. The pattern is characterized by a center of rotation 111. The apparatus may learn from looking at the stencil or screen driven by the stepping motors with reference to two points, such as 112 and 113, that are some vector distance away from the center of rotation 111. First performing a move in the x direction facilitates learning the world coordinate system and steps per pixel confirmed by a movement in the y direction. The following rotational moves involves taking a picture of the objects, such as 112 and 113, after an incremental move in one direction, typically counterclockwise, followed by a move from the initial position in the opposite direction by the same increment from the initial position, typically clockwise. The moves in the x and y direction basically define right triangles having a hypotenuse of magnitude corresponding to the square root of the sum of the squares of the incremental displacements in the x and y directions. The angular displacements effectively create two isosceles triangles from the shifts about points 112 and 113 with the center of rotation 111 being the common vertex for both isosceles triangles. The invention facilitates learning the geometry of the board by looking at only two points and making moves in x, y and θ directions for each of these points.

An operator may select any target point that appears unique on the board such that it may be distinguished from other target points around it, choose a second target point similarly distinguishable from other surrounding targets, and teach the apparatus the geometry of the board such that when any circuit board enters the apparatus out of line with the stencil, the video probes looking at the board automatically download the proper x, y and θ moves for the stencil to bring stencil and board into alignment.

The operator then rotates both probes to look down at the board. Looking now at the board, the system learns the pattern on the board which correlates with a pattern on the screen. The operator has then completed the automatic setup.

It may be desirable to modify this procedure slightly. For example, it may be desirable to rotate the probes to look up again after the system has learned the circuit board pattern to better correlate circuit board and screen or stencil images.

With the probes then looking at the board, the operator may then select auto print on the main menu, and the apparatus is then ready for a production run. During a production run, both probe assemblies index into position after the board has been brought in, recognize the patterns that is learned on each of the probes and automatically moves the screen relative to the board to align the stencil very accurately with the board. The probes then moves into the retracted position, printing occurs and the board just properly printed exits the machine. A new board enters, set down against the vacuum stop, the probes move to the extended position, the apparatus recognizes the patterns, downloads to the stepper motors the proper movements to align the stencil with the circuit board, print, exits, and the process repeats.

As an alternative, the operator may edit a setup. If an operator notices that the screen printer is printing consistently off the pad in one direction or other, the operator may select edit setup from the menu and modify where the screen printer is printing by selecting a predetermined direction and distance of correction. Thereafter, the apparatus will automatically print consistently in the new location and continue to print in that location until modified again.

A feature of the invention is the lighting arrangement for back lighting the stencil. Stencils and screens are usually shiny or have objects on the bottom which may be confused with object features to be taught. By laying the translucent material on the stencil and providing a light behind it, back lighting occurs which prevents this problem. This arrangement disperses the light in a manner that clearly defines each hole in the stencil relative to any type of reflective background that might occur.

The invention has a number of features. The vision probes enter between circuit board and stencil and perform the alignment as distinguished from looking at the board outside the screen printer.

There has been described novel apparatus and techniques for aligning. It is evident that those skilled in the art may now make numerous other uses and modifications of and departures from the apparatus and techniques herein disclosed without departing from the inventive concepts. Consequently, the invention is to be construed as embracing each and every novel feature and novel combination of features present in or possessed by the apparatus and techniques herein disclosed and limited solely by the spirit and scope of the appended claims. ##SPC1##

Freeman, Gary T.

Patent Priority Assignee Title
10703089, Apr 07 2015 Illinois Tool Works Inc Edge lock assembly for a stencil printer
10723117, Apr 07 2015 Illinois Tool Works Inc.; Illinois Tool Works Inc Lift tool assembly for stencil printer
5669970, Jun 02 1995 KPS SPECIAL SITUATIONS FUND II L P Stencil apparatus for applying solder paste
5794329, Feb 27 1995 KPS SPECIAL SITUATIONS FUND II L P Support apparatus for circuit board
5883663, Dec 02 1996 Multiple image camera for measuring the alignment of objects in different planes
5943089, Aug 23 1996 KPS SPECIAL SITUATIONS FUND II L P Method and apparatus for viewing an object and for viewing a device that acts upon the object
6031242, Jan 23 1998 ESEC Trading SA Semiconductor die in-flight registration and orientation method and apparatus
6077022, Feb 18 1997 NORTHROP GRUMMAN CORPRATION Placement machine and a method to control a placement machine
6129040, Sep 05 1997 ESEC Trading SA Semi-conductor mounting apparatus for applying adhesive to a substrate
6135339, Jan 26 1998 ESEC Trading SA Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
6157870, Feb 18 1997 Zevatech Trading AG Apparatus supplying components to a placement machine with splice sensor
6179938, Oct 30 1997 ESEC Trading SA Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder
6185815, Dec 07 1997 ESEC Trading SA Semiconductor mounting apparatus with a chip gripper travelling back and forth
6663712, Feb 22 1997 KPS SPECIAL SITUATIONS FUND II L P Dual track stenciling system with solder gathering head
6891967, May 04 1999 KPS SPECIAL SITUATIONS FUND II L P Systems and methods for detecting defects in printed solder paste
6938227, Aug 08 2002 FRY S METALS, INC System and method for modifying electronic design data
6955120, Mar 28 2003 KPS SPECIAL SITUATIONS FUND II L P Pressure control system for printing a viscous material
7013802, Feb 19 2004 SPEEDLINE TECHNOLOGIES, INC Method and apparatus for simultaneous inspection and cleaning of a stencil
7072503, May 04 1999 SPEEDLINE TECHNOLOGIES, INC Systems and methods for detecting defects in printed solder paste
7121199, Oct 18 2004 SPEEDLINE TECHNOLOGIES, INC Method and apparatus for supporting and clamping a substrate
7149344, May 04 1999 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
7171898, Feb 19 2004 Speedline Technologies, Inc. Method and apparatus for performing operations within a stencil printer
7213738, Sep 30 2002 KPS SPECIAL SITUATIONS FUND II L P Selective wave solder system
7270478, Aug 13 2002 GOOGLE LLC X-ray alignment system for fabricating electronic chips
7293691, Jan 17 2003 KPS SPECIAL SITUATIONS FUND II L P Electronic substrate printing
7310438, May 04 1999 Speedline Technologies, Inc. Systems for detecting defects in printed solder paste
7322288, Feb 19 2004 Speedline Technologies, Inc. Method and apparatus for performing operations within a stencil printer
7458318, Feb 01 2006 Speedline Technologies, Inc. Off-axis illumination assembly and method
7469635, Feb 19 2004 Speedline Technologies, Inc. Method and apparatus for performing operations within a stencil printer
7549371, Jul 10 2006 Speedline Technologies, Inc. Method and apparatus for clamping a substrate
7710611, Feb 16 2007 Illinois Tool Works, Inc Single and multi-spectral illumination system and method
7827909, Apr 17 2007 Illinois Tool Works Inc Stencil printer with multiplexed control of multi-axis machine having distributed control motor amplifier
7861650, Apr 13 2007 Illinois Tool Works, Inc.; Illinois Tool Works, Inc Method and apparatus for adjusting a substrate support
8085983, Dec 26 2007 Altek Corporation Method of adjusting selected window size of image object
8230783, Apr 13 2007 Illinois Tool Works Inc. Method and apparatus for adjusting a substrate support
8253355, Apr 17 2007 Illinois Tool Works Inc. Multiplexed control of multi-axis machine with distributed control amplifier
9370923, Apr 07 2015 Illinois Tool Works Inc. Lift tool assembly for stencil printer
9370924, Mar 25 2015 Illinois Tool Works Inc.; Illinois Tool Works Inc Dual action stencil wiper assembly for stencil printer
9370925, Mar 25 2015 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
9868278, Apr 07 2015 Illinois Tool Works Inc. Lift tool assembly for stencil printer
Patent Priority Assignee Title
4608494, Nov 11 1983 Hitachi, Ltd. Component alignment apparatus
4672437, Jul 08 1985 Atmel Corporation Fiber optic inspection system
4686565, May 22 1984 Fujitsu Limited Method and apparatus for visually examining an array of objects disposed in a narrow gap
4737845, Oct 11 1985 HITACHI TECHNO ENGINEERING CO , LTD Method of loading surface mounted device and an apparatus therefor
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 31 1992MPM Corporation(assignment on the face of the patent)
Dec 31 1998MPM CorporationSPEEDLINE TECHNOLOGIES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097190352 pdf
Jan 05 2004SPEEDLINE TECHNOLOGIES, INC SPEEDLINE HOLDINGS I, LLCNOTICE OF GRANT OF SECURITY INTEREST IN PATENTS0149430593 pdf
May 21 2004SPEEDLINE TECHNOLOGIES, INC KPS SPECIAL SITUATIONS FUND II L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0154600737 pdf
Nov 06 2006SPEEDLINE HOLDINGS I, LLCSPEEDLINE TECHNOLOGIES, INC RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0184800775 pdf
Date Maintenance Fee Events
Sep 10 1996ASPN: Payor Number Assigned.
Oct 14 1997M184: Payment of Maintenance Fee, 8th Year, Large Entity.
Oct 14 1997R284: Refund - Payment of Maintenance Fee, 8th Yr, Small Entity.
Nov 07 1997LSM2: Pat Hldr no Longer Claims Small Ent Stat as Small Business.
Mar 20 2002M182: 11.5 yr surcharge- late pmt w/in 6 mo, Large Entity.
Mar 20 2002M185: Payment of Maintenance Fee, 12th Year, Large Entity.


Date Maintenance Schedule
May 24 19974 years fee payment window open
Nov 24 19976 months grace period start (w surcharge)
May 24 1998patent expiry (for year 4)
May 24 20002 years to revive unintentionally abandoned end. (for year 4)
May 24 20018 years fee payment window open
Nov 24 20016 months grace period start (w surcharge)
May 24 2002patent expiry (for year 8)
May 24 20042 years to revive unintentionally abandoned end. (for year 8)
May 24 200512 years fee payment window open
Nov 24 20056 months grace period start (w surcharge)
May 24 2006patent expiry (for year 12)
May 24 20082 years to revive unintentionally abandoned end. (for year 12)