An improved method for teaching the location of a bond site on a selected lead finger of a semiconductor leadframe during a wire bonding process is provided. Initially, the location of the lateral edges and terminal edge of a tip portion of the lead finger is sensed by an automated vision system of a wire bonding apparatus. A width (W) and a longitudinal axis of the lead finger are then determined. The bond site is located along the longitudinal axis a predetermined distance of (W/2) from the terminal edge of the lead finger. The improved method allows greater accuracy in the placement of bond sites and precisely controls the length of the bond wire used during the wire bonding process.
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16. A process for bonding a wire to a bond site located on a tip portion of a lead finger of a semiconductor leadframe, comprising:
sensing a location of lateral edges and a terminal edge of the tip portion of the lead finger; determining a location of a longitudinal axis of the tip portion of the lead finger by determining a width "W" of the lead finger and then dividing by two; locating the bond site on the lead finger along the longitudinal axis and spaced by a distance equal to "W/2" from the terminal edge; and bonding the wire to the lead finger substantially at the bond site.
18. A process for bonding a wire to a bond site located on an end portion of a conductor of a carrier for a semiconductor die, comprising:
sensing a location of lateral edges and a terminal edge of the end portion of the conductor; determining a location of a longitudinal axis of the end portion of the conductor; locating the bond site on the conductor along the longitudinal axis of the conductor end portion and spaced by a distance from the terminal edge equal to a width of the end portion of the conductor divided by two; and bonding the wire to the conductor substantially at the bond site.
17. A method for bonding a wire to a bond site located on a tip portion of a selected lead finger of a leadframe, comprising:
providing a semiconductor leadframe having at least one die mounting site with an associated arrangement of lead fingers, said lead fingers including tip portions having generally parallel lateral edges and a terminal edge; sensing the location of the lateral edges and a terminal edge of the selected lead finger and determining the location of a longitudinal axis of the selected lead finger tip portion; locating the bond site along the longitudinal axis and spaced from the terminal edge by a distance equal to a width of the tip portion of the selected lead finger divided by two; and bonding a bond wire to the selected lead finger substantially at the bond site.
1. In a wire bonding process, in which a bond wire is bonded to bond pads formed on a semiconductor die and then to a bond site located on a tip portion of a lead finger of a semiconductor leadframe, utilizing an automated wire bonding apparatus, a method for teaching a location of the bond site on the lead finger, said method comprising the steps of:
sensing a location of the lateral edge and a terminal edge of the tip portion of the lead finger using an automated vision sensing system of the wire bonding apparatus; determining a location of a longitudinal axis of the tip portion of the lead finger; and then locating the bond site on the lead finger along the longitudinal axis of the lead finger and spaced by a predetermined distance from the terminal edge.
13. In a wire bonding process, in which a bond wire is bonded to bond pads formed on a semiconductor die and then to a bond site located on a tip portion of a lead finger of a semiconductor leadframe, utilizing an automated wire bonding apparatus, a method for teaching a location of the bond site on the lead finger, said method comprising the steps of:
sensing a location of lateral edges and a terminal edge of the tip portion of the lead finger using an automated vision sensing system of the automated wire bonding apparatus; determining a location of a longitudinal axis of the tip portion of the lead finger by determining a width "W" of the lead finger and then dividing by two; and then locating the bond site on the lead finger along the longitudinal axis of the lead finger and spaced by a predetermined distance equal to "W/2" from the terminal edge.
15. In semiconductor manufacture, a method for wire bonding a bond pad on a die to a bond site located on a tip portion of a selected lead finger of a leadframe, said method comprising:
providing a semiconductor leadframe having a plurality of generally rectangular shaped die mounting paddles each surrounded by an arrangement of lead fingers, each of said lead fingers including a tip portion located at a proximal end thereof having generally parallel lateral edges and a terminal edge generally parallel to a side of a mounting paddle; sensing the location of the lateral edges and terminal edge of the selected lead finger and determining the location of a longitudinal axis of the selected lead finger; and locating the bond site along the longitudinal axis and spaced from the terminal edge by a predetermined distance equal to the width of the tip portion of the selected lead finger divided by two.
9. In semiconductor manufacture, a method for wire bonding a bond pad on a die to a bond site located on a tip portion of a selected lead finger of a leadframe, said method comprising:
providing a semiconductor leadframe having a plurality of generally rectangular shaped die mounting paddles each surrounded by an arrangement of lead fingers, each of said lead fingers including a tip portion located at a proximal end thereof having generally parallel lateral edges and a terminal edge generally parallel to a side of a mounting paddle; sensing the location of the lateral edges and terminal edge of the selected lead finger and determining the location of a longitudinal axis of the selected lead finger; and locating the bond site along the longitudinal axis and spaced from the terminal edge by a predetermined distance.
11. A semiconductor device wire bonding method, comprising:
providing a semiconductor die having a plurality of bond pads thereon connected to integrated circuits formed on the semiconductor die; providing a semiconductor leadframe strip having a plurality of die mounting sites, each mounting site having an associated arrangement of lead fingers including tip portions; attaching the semiconductor die to the semiconductor leadframe strip at a mounting site; bonding a fine bond wire to a bond pad of the semiconductor die; determining a previously unverified width (W) at the tip portion of a selected lead finger and determining a longitudinal axis of the tip portion of the selected lead finger; locating a bond site on the tip portion of the selected lead finger generally along the longitudinal axis and spaced from a terminal edge of the selected lead finger by a distance determined as a function of width (W) as determined; and bonding the fine bond wire to the selected lead finger substantially at the bond site.
5. A wire bonding method for semiconductor manufacture comprising:
providing a semiconductor die having a plurality of bond pads thereon connected to integrated circuits formed on the die; providing a semiconductor leadframe having a plurality of generally rectangular shaped die mounting paddles each surrounded by an arrangement of lead fingers, each of said lead fingers including a tip portion located at a proximal end thereof with a terminal edge of each tip portion generally parallel to a side of a mounting paddle; attaching the die to a mounting paddle; bonding a fine bond wire to a bond pad of the die using a bonding tool of an automated wire bonding apparatus having an automated vision system for sensing a location of the die and lead fingers; determining a width (W) of the tip portion of a selected lead finger and a longitudinal axis of the selected lead finger using the automated vision system; locating a bond site on the tip portion of the selected lead finger generally along the longitudinal axis and spaced from the terminal edge of the selected lead finger by a predetermined distance; and bonding the fine bond wire to the selected lead finger at the bond site using the bonding tool.
2. The method as recited in
4. The method as recited in
6. The bonding method as recited in
7. The bonding method as recited in
8. The bonding method as recited in 7 and wherein the wire bonding apparatus is an existing apparatus and the computer software is modified for determining the width (w) and longitudinal axis of the tip portion of the selected lead finger and for locating the bond site the predetermined distance (W/2) from the terminal edge.
10. The method as recited in
12. The bonding method as recited in
14. The method as recited in
19. The method as recited in
bonding the wire to a bond pad on said semiconductor die.
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The present invention relates to semiconductor manufacturing and specifically to semiconductor wire bonding processes. More particularly, the present invention relates to an improved method for teaching the location of a bond site on a lead finger of a leadframe during a wire bonding process.
In semiconductor manufacture a wire bonding process is used to electrically connect bond pads formed on semiconductor dice to the lead fingers of a leadfreeleadfree leadframe strip 30 includes die mounting paddles 32 for mounting the individual semiconductor dice (not shown) to the leadframe strip 30. The die mounting paddles 32 have a generally rectangular peripheral configuration which matches the peripheral configuration of a semiconductor die. Mounting paddle connecting members 58 attached to the strip rails 34 connect and support the mounting paddles 32 on the leadfree leadframe strip 30.
From the point in the manufacturing process in which the die mounting paddles 32 are coated with adhesive for die bonding, until the point in which the individual semiconductor packages or chips are separated from the leadframe strip rails 34 during a trim and form process, a leadframe strip 30 is treated as a unit in the manufacturing process.
The leadframe strip 10 30 also includes an arrangement of lead fingers 40. Each die mounting paddle 32 has an associated set of lead fingers 40 which surround the generally rectangular shaped mounting paddle 32. Each lead finger 40 includes a distal end 42 which following encapsulation of the die, will become the external lead of a completed semiconductor package. In addition, each lead finger 40 includes a proximal end or tip portion 60 for bonding to a bond wire during the wire bonding process. A terminal edge 56 (FIG. 3) of the tip portion 60 of each lead finger 42 is located adjacent to and generally parallel to an edge of the die mounting paddle 32. The tip portions 60 of each set of lead fingers 40 for a die mounting paddle 32 circumscribe the generally rectangular periphery of the die mounting paddle 32. The terminal edges 56 of the tip portions 60 of the lead fingers 40 are generally parallel to either a longitudinal edge 64 (FIG. 3) or a lateral edge 66 (FIG. 3) of the die mounting paddles 32.
With reference to FIG. 3, a semiconductor die 10 wire bonded in accordance with the invention is shown. Prior to the wire bonding process the semiconductor die 10 is attached to a mounting paddle 32 of the leadfree leadframe strip 30. During the wire bonding process bond pads 44 formed on the die 10 are attached to bond sites 46 on the lead fingers 40 using fine bond wires 48 substantially as previously described.
The wire bonding process can be performed utilizing an automated wire bonding apparatus. One suitable automated wire bonding apparatus is manufactured by Kulicke and Soffa Industries, Inc., Horsham, Pa. and is designated as a Model No. 1484 wire bonder. Other suitable automated wire bonding apparatus are manufactured by ESEC, Shinkawa, and Kiajo Denki. Such automated wire bonding apparatus typically include an automated vision sensing system. In addition to a vision sensing system, such automated wire bonding apparatus typically include a computer control system for controlling various aspects of the wire bonding process. Instructions for operation of the computer are encoded on suitable computer software. The present invention is directed to a method for precisely locating the bond sites 46 on the lead fingers 40 utilizing such an automated wire bonder.
With reference to FIG. 4, the method of the invention can be explained by referring to a particular lead finger 40'. In accordance with the invention, the location of a bond site 46' on the tip portion 60' of the lead finger 40' is taught. In general the term "teach" or "taught" is used in the art to refer to the step in the wire bonding process wherein a bond site location is ascertained and the wire bonding tool of the wire bonding apparatus is instructed to complete a bond at that location. As previously explained, the bond site 46' is for the second bond performed for each bond wire 48'. A first bond is the bond between the bond wire 48' and the appropriate bond pad 44 (FIG. 3) of the die 10.
The method of the invention includes the following steps:
1. Sensing a location of the lateral edges 50', 52', and a terminal edge 56' of the tip portion 60' of the lead finger 40' using a vision sensing system of an automated wire bonding apparatus.
2. Determining a location of the longitudinal axis 54' of the tip portion 60' of the lead finger 40' using the vision sensing system. This determination is made by determining the width "W" of the lead finger 40' at the tip portion 60' and dividing the width by two. Because the lateral edges 50', 52' are generally parallel to one another, the longitudinal axis 54' is thus equidistant from each lateral edge 50', 52' of the tip portion 60' by a predetermined distance "W/2".
3. Teaching a location of a bond site 46' by locating the bond site 46' along the longitudinal axis 54' of the tip portion 60' of the lead finger 40' and spaced the predetermined distance W/2 from the terminal edge 56' of the tip portion 60'.
An existing automated wire bonder, such as the wire bonders previously identified, can be modified to perform the method of the invention by appropriate changes in the software for the computer control of the wire bonding apparatus. In general, such software modifications are dependent on the particular software for the wire bonding apparatus and can be accomplished by techniques that are known in the art.
By precisely locating the bond site 46', a set distance from the terminal edge 56' of the tip portion 60' of a selected lead finger 40', cost savings in bonding wire 48' can be realized. As an example, the bond wire 48' can be made approximately 0.005 inches shorter utilizing the method of the invention as compared to conventional methods of wire bonding. For a large scale semiconductor manufacturer, such as the assignee hereunder, this may amount to a savings of several hundred spools of bond wire 48' in a years time. As the bond wire 48' is typically fabricated of expensive gold wire, this is a significant cost saving. Furthermore, the method of the invention insures that the location of the bond site 46' is consistent between different wire bonding apparatus and for different operators of the same wire bonding apparatus.
Thus the method of the invention provides a simple yet unobvious method for wire bonding and for teaching the location of a bond site on a lead finger of a leadframe. Although the invention has been described in terms of a preferred embodiment, it is intended that alternate embodiments of the inventive concepts expressed herein be included within the scope of the following claims.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Nov 04 1994 | MICRON SEMICONDUCTOR, INC | Micron Technology Inc | MERGER SEE DOCUMENT FOR DETAILS | 008438 | /0933 | |
| Sep 26 1996 | Micron Technology, Inc. | (assignment on the face of the patent) | / |
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