In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.
The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.
|
1. A method for laser induced breakdown (LIB) of a non-biologic material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a rapid and distinct change in slope at a characteristic laser pulse width, said method comprising the steps of:
a. generating a beam of at least one or more laser pulses in which each pulse has a pulse width equal to or less than said characteristic laser pulse width; and b. focusing said beam directing said pulse to a point at or beneath the surface of the material.
0. 51. A method of optimally selecting a pulse width and fluence for a pulsed laser beam such that the pulsed laser induces laser induced breakdown (LIB) of a material, the material being characterized by a relationship of fluence threshold at which breakdown occurs versus the square root of laser pulse width comprising the step of identifying where the relationship between fluence threshold and the square root of pulse width exhibits a distinct change in slope and selecting the pulse width and fluence level associated with the distinct change in slope and directing the pulse at a point at or beneath the surface of the material.
0. 54. A method for laser induced breakdown of a material with a pulsed laser beam, the material being characterized by a relationship of fluence threshold at which breakdown occurs versus the square root of laser pulse width that exhibits a distinct change in slope at a characteristic pulse width, said method comprising the steps of:
selecting a pulse width and fluence which is equal to or less than the distinct change in slope; generating at least one laser pulse which has a pulse width equal to or less than the characteristic laser pulse width and fluence; and directing said pulse to a point at or beneath the surface of a material.
0. 46. A method for laser induced breakdown (LIB) of a metallic material with a pulsed laser beam, the material being characterized by a relationship of fluence threshold at which breakdown occurs versus laser pulse width that exhibits a distinct change in slope at a characteristic laser pulse width, said method comprising the steps of:
generating at least one laser pulse which has a pulse width equal to or less than said characteristic laser pulse width, said pulse having a width between 10 and 10,000 femtoseconds, and the pulse has an energy of 1 nanojoule to 1 microjoule; and directing the pulse to a point at or beneath the surface of the material.
0. 48. A method for laser induced breakdown (LIB) of a metallic material transparent to radiation with a pulsed laser beam, the material being characterized by a relationship of fluence threshold at which breakdown occurs versus laser pulse width that exhibits a distinct change in slope at a characteristic laser pulse width, said method comprising the steps of:
generating at least one laser pulse which has a pulse width equal to or less than said characteristic laser pulse width, where the laser pulse width is 10 to 10,000 femtoseconds and the laser pulse has an energy of 10 nanojoules to 1 millijoule; and directing the pulse to a point at or beneath the surface of the material.
37. A method for laser induced breakdown of a material which comprises:
a. determining, for a selected material, characteristic curve of fluence breakdown threshold (Fth) as a function of the square root of laser pulse width; b. identifying a pulse width value on said curve corresponding to a rapid and distinct change in slope of said Fth versus pulse width curve the relationship between the fluence breakdown and the square root of pulse width characteristic of said material; c. generating a beam of one or more laser pulses, said pulses having a pulse width at or below said pulse width value corresponding to said distinct change in slope; and d. focusing directing said one or more pulses of said beam to a point at or beneath the surface of the material.
0. 50. A method for laser induced breakdown (LIB) of a metallic material with a pulsed laser beam, the material being characterized by a relationship of fluence threshold at which breakdown occurs versus the square root of laser pulse width that exhibits a distinct change in slope at a characteristic laser pulse width;
determining the ablation (LIB) threshold of the material as a function of pulse width and determining where the ablation (LIB) threshold function is no longer proportional to the square root of pulse width; generating at least one laser pulse which has a pulse width equal to or less than the characteristic pulse width; and directing the pulse to a point at or beneath the surface of the material.
35. A method for laser induced breakdown (LIB) of a non-biologic material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a rapid and distinct change in slope at a predetermined laser pulse width where the onset of plasma induced breakdown occurs, said method comprising the steps of:
a. generating a beam of at least one or more laser pulses in which each pulse has a pulse width equal to or less than said predetermined laser pulse width; and b. focusing said beam directing said pulse to a point at or beneath the surface of the material which is biological tissue , the pulse width is 10 to 10,000 femtoseconds and the beam has an energy of 10 nanojoules to 1 millijoule.
7. A method for laser induced breakdown (LIB) of a material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold versus laser pulse width that exhibits a rapid and distinct change in slope at a predetermined laser pulse width where the onset of plasma induced breakdown occurs, said method comprising the steps of:
a. generating a beam of one or more laser pulses in which each pulse has a pulse width equal to or less than said predetermined laser pulse width obtained by determining the ablation (LIB) threshold of the material as a function of pulse width and by determining where the ablation (LIB) threshold function is no longer proportional to the square root of pulse width; and b. focusing said beam to a point at or beneath the surface of the material.
24. A method for laser induced breakdown of a material which comprises:
a. generating a beam of one or more laser pulses in which each pulse has a pulse width equal to or less than a pulse width value corresponding to a change in slope of a curve of fluence breakdown threshold (Fth) as a function of laser pulse width (T), said change occurring at a point between first and second portions of said curve, said first portion spanning a range of relatively long pulse width where Fth varies with the square root of pulse width (T1/2) and said second portion spanning a range of short pulse width relative to said first portion with a Fth versus T slope which differs from that of said first portion; and b. focusing directing said one or more pulses of said beam to a point at or beneath the surface of the material.
36. A method for laser induced breakdown (LIB) of a material by plasma formation with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a distinct change in slope at a characteristic laser pulse width, said method comprising the steps of:
a. generating a beam of at least one or more laser pulses in which each pulse has a pulse width equal to or less than said characteristic laser pulse width, said characteristic pulse width being defined by the ablation (LIB) threshold of the material as a function of pulse width where the ablation (LIB) threshold function is no longer proportional to the square root of pulse width; and b. focusing said beam directing said pulse to a point at or beneath the surface of the material and inducing breakdown by plasma formation in the material.
33. A method for laser induced breakdown (LIB) of a non-organic material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold at which breakdown occurs versus laser pulse width that exhibits a rapid and distinct change in slope at a predetermined laser pulse width where the onset of plasma induced breakdown occurs, said method comprising the steps of:
a. generating a beam of at least one or more laser pulses in which each pulse has a pulse width equal to or less than said predetermined laser pulse width; and b. focusing said beam directing said pulse to a point at or beneath the surface of the material so that the laser beam defines a spot and has a lateral gaussian profile characterized in that fluence at or near the center of the beam spot is greater than the threshold fluence whereby the laser induced breakdown is ablation of an area within the spot.
2. The method according to
3. The method according to
4. The method according to
5. The method according to
0. 6. The method according to
8. The method according to
9. The method according to
10. The method according to
11. The method according to
12. The method according to
13. The method according to
18. The method according to
19. The method according to
21. The method according to
22. The method according to claim 22 21 wherein the spot size is a diffraction limited spot size providing an ablation cavity having a diameter less than the fundamental wavelength size.
23. The method according to
25. The method according to
a. identifying a pulse width start point; b. focusing directing the laser beam initial start point at or beneath the surface of the material; and c. scanning said beam along a predetermined path in a transverse direction.
26. The method according to
a. identifying a pulse width start point; b. focusing directing the laser beam initial start point at or beneath the surface of the material; and c. scanning said beam along a predetermined path in a longitudinal direction in the material to a depth smaller than the Rayleigh range.
27. The method according to
32. The method according to any one of claims 1, 2, 5 or 24 wherein said beam is obtained by chirped-pulse amplification (CPA) means comprising means for generating a short optical pulse having a predetermined duration; means for stretching such optical pulse in time; means for amplifying such time-stretched optical pulse including solid state amplifying media; and means for recompressing such amplified pulse to its original duration.
34. The method according to
38. The method according to
a. identifying a pulse width start point; b. focusing directing the laser beam initial start point at or beneath the surface of the material; and c. scanning said beam along a predetermined path in a transverse direction.
39. The method according to
a. identifying a pulse width start point; b. focusing directing the laser beam initial start point at or beneath the surface of the material; and c. scanning said beam along a predetermined path in a longitudinal direction in the material to a depth smaller than the Rayleigh range.
40. The method according to
45. The method according to any one of claims 35, or 37 wherein said beam is obtained by chirped-pulse amplification (CPA) means comprising means for generating a short optical pulse having a predetermined duration; means for stretching such optical pulse in time; means for amplifying such time-stretched optical pulse including solid state amplifying media; and means for recompressing such amplified pulse to its original duration.
0. 47. A method as in
means for stretching such optical pulse in time; means for amplifying such stretched optical pulse including solid state amplifying media; and means for recompressing such amplified pulse to its original duration.
0. 49. A method as in
means for stretching such optical pulse in time; means for amplifying such stretched optical pulse including solid state amplifying media; and means for recompressing such amplified pulse to its original duration.
0. 52. The method as in
0. 53. A method as in
|
This invention was made with government support provided by the Office of Naval Research and the National Science Foundation under the terms of No. STC PHY 8920108. The government has certain rights in the invention.
Referring to
Chirped-pulse amplification systems have been described by Jeffrey Squier and Gerard Mourou, two of the joint inventors in the present application, in a publication entitled Laser Focus World published by Pennwell in June of 1992. It is described that CPA systems can be roughly divided into four categories. The first includes the high energy low repetition systems such as ND glass lasers with outputs of several joules but they may fire less than 1 shot per minute. A second category are lasers that have an output of approximately 1 joule and repetition rates from 1 to 20 hertz. The third group consists of millijoule level lasers that operate at rates ranging from 1 to 10 kilohertz. A fourth group of lasers operates at 250 to 350 kilohertz and produces a 1 to 2 microjoules per pulse. In U.S. Pat. No. 5,235,606 several solid state amplifying materials are identified and the invention of U.S. Pat. No. 5,235,606 is illustrated using the Alexandrite. The examples below use Ti:Sapphire and generally follow the basic process of U.S. Pat. No. 5,235,606 with some variations as described below.
The illustrative examples described below generally pertain to pulse energies less than a microjoule and often in the nanojoule range with pulse duration in the range of hundreds of picoseconds or less and the frequency on the order of 1 kilohertz. But these examples are merely illustrative and the invention is not limited thereby.
In a basic scheme for CPA, first a short pulse is generated. Ideally the pulse from the oscillator is sufficiently short so that further pulse compression is not necessary. After the pulse is produced it is stretched by a grating pair arranged to provide positive group velocity dispersion. The amount the pulse is stretched depends on the amount of amplification. Below a millijoule, tens of picoseconds are usually sufficient. A first stage of amplification typically takes place in either a regenerative or a multipass amplifier. In one configuration this consists of an optical resonator that contains the gain media, a Pockels cell, and a thin film polarizer. After the regenerative amplification stage the pulse can either be recompressed or further amplified. The compressor consists of a grating or grating pair arranged to provide negative group velocity dispersion. Gratings are used in the compressor to correspond to those in the stretching stage. More particulars of a typical system are described in U.S. Pat. No. 5,235,606, previously incorporated herein by reference.
An important aspect of the invention is the development of a characteristic curve of fluence breakdown threshold Fth as a function of laser pulse width specific to a material. Then identify on such curve, the point at which there is an abrupt, or distinct and rapid change or at least a discernable change in slope characteristic of the material. In general it is more desirable to operate past this point because of the more precise control of the laser induced breakdown (LIB) or ablation threshold.
In experimental conditions with wavelength of 800 nm and 200 fs pulses on gold (FIG. 3), the absorption depth is 275 A with a diffusion length of 50 A. In the case of nanosecond pulses the diffusion length, which is on the order of 10 μm (micron) in diameter, is much longer than the absorption depth, resulting in thermal diffusion being the limiting factor in feature size resolution. Empirical evidence for the existence of these two regimes is as exhibited in FIG. 3. Here both experimental and theoretical ablation thresholds are plotted as a function of pulse width. An arrow at approximately 7 picoseconds pulse width (designated herein as T or τp) delineates the point (or region closely bounding that point) at which the thermal diffusion length (Lth) is equal to the absorption depth (1/a). It is clear that for a smaller size spot a shorter (smaller) pulse is necessary. For spot size on the order of 1000 Å or less, pulse width on the order of 100 femtoseconds or less will be needed. It is clear from the figure that this is the point at which the ablation threshold transitions from a slowly varying or nearly constant value as a function of pulse width to one that is dramatically dependent on pulse time. This result is surprising. It has been demonstrated that the electron thermalization time for laser deposited energy in gold is on the order of, or less than, 500 fs and the electron-lattice interaction time is 1 ps. The consequences of this four ultrafast laser pulses is that the energy is contained within the beam spot. In fact for energies at or near the threshold for ablation, the spatial profile of the laser beam will determine the size and shape of the region being ablated (FIGS. 4 and 5).
Additional experiments were performed to measure the amount of recombination light produced as a function of the fluence impinging on a gold film. The technique involved is based upon the experimental setup previously described. A basic assumption is that the intensity of the light is proportional to the amount of material ablated. In
Additional experiments on opaque materials used a 800 nm Ti:Sapphire oscillator whose pulses were stretched by a grating pair, amplified in a regenerative amplifier operating at 1 kHz, and finally recompressed by another grating pair. Pulse widths from 7 ns to 100 fs were obtained. The beam was focused with a 10× objective, implying a theoretical spot size of 3.0 μm in diameter. A SEM photo-micrograph of ablated holes obtained in a silver film on glass, using a pulse width of 200 fs and a pulse energy of 30 nJ (fluence of 0.4 J/cm2) produced two holes of diameter approximately 0.3 μm in diameter. Similar results have been obtained in aluminum.
These results suggest that by, producing a smaller spot size which is a function of numerical aperture and wavelength, even smaller holes can be machined. We have demonstrated the ability to generate the fourth harmonic (200 nm) using a nonlinear crystal. Thus by using a stronger objective lens along with the 200 nm light, holes with diameters of 200 angstroms could in principle be formed.
These examples show that by using femtosecond pulses the spatial resolution of the ablation/machining process can be considerably less than the wavelength of the laser radiation used to produce it. The ablated holes have an area or diameter less than the area or diameter of the spot size. In the special case of diffraction limited spot size, the ablated hole has a size (diameter) less than the fundamental wavelength size. We have produced laser ablated holes with diameters less than the spot diameter and with diameters 10% or less of the laser beam spot size. For ultrafast pulses in metals the thermal diffusion length, lth=(Dt)1/2 (where D is the thermal diffusivity and t the pulse time), is significantly smaller than the absorption depth (1/a), where a is the absorption coefficient for the radiation.
Those skilled in the art will understand that the basic method of the invention may be utilized in alternative embodiments depending on the desired configurations of the induced breakdown. Examples include, but are not limited to using a mask in the beam path, varying spot size, adjusting focus position by moving the lens, adjusting laser cavity design, Fourier Transform (FT) shaping, using a laser operating mode other than TEMoo, and adjusting the Rayleigh range, the depth of focus or beam waist.
The use of a mask is illustrated in
The varying spot size is accomplished by varying the laster f/#, varying the focal length of the lens or input beam size to the lens as by adjustable diaphragm.
Operation in other than the TEMoo mode means that higher order transverse modes could be used. This affects the beam and material as follows: the beam need not be circular or gaussian in intensity. The material will be ablated corresponding to the beam shape.
The Rayleigh range (Z axis) may be adjusted by varying the beam diameter, where the focal plane is in the x-y axis.
A series of tests were performed on an SiO2 (glass) sample to determine the laser induced breakdown (LIB) threshold as a function of laser pulse width between 150 fs-7 ns, using a CPA laser system. The short pulse laser used was a 10 Hz Ti:Sapphire oscillator amplifier system based on the CPA technique. The laser pulse was focused by an f=25 cm lens inside the SiO2 sample. The Rayleigh length of the focused beam is ∼2 mm. The focused spot size was measured in-situ by a microscope objective lens. The measured spot size FWHM (full width at half max) was 26 μm in diameter in a gaussian mode. The fused silica samples were made from Corning 7940, with a thickness of 0.15 mm. They were optically polished on both sides with a scratch/dig of 20-10. Each sample was cleaned by methanol before the experiment. Thin samples were used in order to avoid the complications of self-focusing of the laser pulses in the bulk. The SiO2 sample was mounted on a computer controlled motorized X-Y translation stage. Each location on the sample was illuminated by the laser only once.
Two diagnostics were used to determine the breakdown threshold Fth. First, the plasma emission from the focal region was collected by a lens to a photomultiplier tube with appropriate filters. Second, the change of transmission through the sample was measured with an energy meter. (See
where k is the linear transmission coefficient. The solid curve in
A series of experiments was performed to determine the breakdown threshold of cornea as a function of laser pulse width between 150 fs-7 ns, using a CPA laser system. As noted earlier, in this CPA laser system, laser pulse width can be varied while all other experimental parameters (spot size, wavelength, energy, etc.) remain unchanged. The laser was focused to a spot size (FWHM) of 26 μm in diameter. The plasma emission was recorded as a function of pulse energy in order to determine the tissue damage threshold. Histologic damage was also assessed.
Breakdown thresholds calculated from plasma emission data revealed deviations from the scaling law. Fth α T1/2, as in the case of metals and glass. As shown in
The breakdown threshold for ultrashort pulses (<10 ps) is less than longer pulses and has smaller standard deviations. Reduced adjacent histological damage to tissue results from the ultrashort laser pulses.
In summary, it has been demonstrated that sub-wavelength holes can be machined into metal surfaces using femtosecond laser pulses. The effect is physically understood in terms of the thermal diffusion length, over the time period of the pulse deposition, being less than the absorption depth of the incident radiation. The interpretation is further based on the hole diameter being determined by the lateral gaussian distribution of the pulse in relation to the threshold for vaporization and ablation.
Laser induced optical breakdown dielectrics consists of three general steps: free electron generation and multiplication, plasma heating and material deformation or breakdown. Avalanche ionization and multiphoton ionization are the two processes responsible for the breakdown. The laser induced breakdown threshold in dielectric material depends on the pulse width of the laser pulses. An empirical scaling law of the fluence breakdown threshold as a function of the pulse width is given by Fth α τp, or alternatively, the intensity breakdown threshold, Ith=Fth/τp. Although this scaling law applies in the pulse width regime from nanosecond to tens of picoseconds, the invention takes advantage of the heretofore unknown regime where breakdown threshold does not follow the scaling law when suitably short laser pulses are used, such as shorter than 7 picoseconds for gold and 10 picoseconds for SiO2.
While not wishing to be held to any particular theory, it is thought that the ionization process of a solid dielectric illuminated by an intense laser pulse can be described by the general equation
where ne(t) is the free electron (plasma) density, η(E) is the avalanche coefficient, and E is the electric field strength. The second term on the right hand side is the photoionization contribution, and the third term is the loss due to electron diffusion, recombination, etc. When the pulse width is in the picosecond regime, the loss of the electron is negligible during the duration of the short pulse.
Photoionization contribution can be estimated by the tunneling rate. For short pulses, E∼108 V/cm, the tunneling rate is estimated to be w∼4×109 sec-1, which is small compared to that of avalanche, which is derived below. However, photoionization can provide the initial electrons needed for the avalanche processes at short pulse widths. For example, the data shows at 1 ps, the rms field threshold is about 5×107 V/cm. The field will reach a value of 3.5×107 V/cm (ms) at 0.5 ps before the peak of the pulse, and w∼100 sec-1. During a Δt∼100 fs period the electron density can reach ne∼nt[1-exp(-wΔt)]∼1011 cm-3, where nt∼1022 is the total initial valence band electron density.
Neglecting the last two terms there is the case of an electron avalanche process, with impact ionization by primary electrons driven by the laser field. The electron density is then given by ne(t)=no×exp(n(E)t), where no is the initial free electron density. These initial electrons may be generated through thermal ionization of shallow traps or photoionization. When assisted by photoionization at short pulse regime, the breakdown is more statistical. According to the condition that breakdown occurs when the electron density exceeds nth≡1018 cm-3 and an initial density of no≡1910 cm-3, the breakdown condition is then given by ητp≡18. For the experiment, it is more appropriate to use nth≡1.6×1021 cm-3, the plasma critical density, hence the threshold is reached when ητp≡30. There is some arbitrariness in the definition of plasma density relating to the breakdown threshold. However, the particular choice of plasma density does not change the dependence of threshold as function of pulse duration (the scaling law).
In the experiment, the applied electric field is on the order of a few tens of MV/cm and higher. Under such a high field, the electrons have an average energy of ∼5 eV, and the electron collision time is less than 0.4 fs for electrons with energy U≧5-6 eV. Electrons will make more than one collision during one period of the electric oscillation. Hence the electric field is essentially a dc field to those high energy electrons. The breakdown field at optical frequencies has been shown to correspond to dc breakdown field by the relationship Ermkth(w)=EdcTH(1+w2τ2)1/2, where w is the optical frequency and τ is the collision time.
In dc breakdown, the ionization rate per unit length, α, is used to describe the avalanche process, with η=α(E)vdrift, where vdrift is the drift velocity of electrons. When the electric field is as high as a few MV/cm, the drift velocity of free electrons is saturated and independent of the laser electric field, vdrift≡2×107 cm/s.
The ionization rate per unit length of an electron is just eE/Ui times the probability, P(E), that the electron has an energy ≧Ui, or α(E)=(eE/Ui)P(E). Denoting EkT,Ep, and Ei as threshold fields for electrons to overcome the decelerating effects of thermal, phonon, and ionization scattering, respectively. Then the electric field is negligible, E<EkT, so the distribution is essentially thermal, P(E) is simply exp(-Ui/kT). It has been suggested: P(E)∼exp(-const/E) for EkT<E<Ep; P(E)∼exp(-const/E2) at higher fields (E>Ep). Combining the three cases the expression that satisfies both low and high field limits:
This leads to Fth α E2τp∼1/τp, i.e., the fluence threshold will increase for ultrashort laser pulses when E>EpEi is satisfied.
Opaque and transparent materials have common characteristics in the curves of
where ZR is the Rayleigh range and is equal to
Wo is the beam size at the waist (Z=0).
We can see that the highest value of the field is at Z=R=0 at the center of the waist. If the threshold is precisely defined it is possible to damage the material precisely at the waist and have a damaged volume representing only a fraction of the waist in the R direction or in the Z direction. It is very important to control precisely the damage threshold or the laser intensity fluctuation.
For example, if the damage threshold or the laser fluctuations known within 10% that means that on the axis (R=0)
damaged volume can be produced at a distance ZR/3 where ZR again is the Rayleigh range. For a beam waist of Wo=λ then
and the d distance between hole can
as shown in FIG. 13.
The maximum intensity is exactly at the center of the beam waist (Z=0, R=0). For a sharp threshold it is possible to damage transparent, dielectric material in a small volume centered around the origin point (Z=0, R=0). The damage would be much smaller than the beam waist in the R direction. Small cavities, holes, or damage can have dimensions smaller than the Rayleigh range (ZR) in the volume of the transparent, dielectric material. In another variation, the lens can be moved to increase the size of the hole or cavity in the Z direction. In this case, the focal point is essentially moved along the Z axis to increase the longitudinal dimension of the hole or cavity. These features are important to the applications described above and to related applications such as micro machining, integrated circuit manufacture, and encoding data in data storage media.
Advantageously, the invention identifies the regime where breakdown threshold fluence does not follow the scaling law and makes use of such regime to provide greater precision of laser induced breakdown, and to induce breakdown in a preselected pattern in a material or on a material. The invention makes it possible to operate the laser where the breakdown or ablation threshold becomes essentially accurate. The accuracy can be clearly seen by the I-bars along the curves of
While this invention has been described in terms of certain embodiment thereof, it is not intended that it be limited to the above description, but rather only to the extent set forth in the following claims.
The embodiments of the invention in which an exclusive property or privilege is claimed are defined in the appended claims.
Liu, Xinbing, Dutta, Subrata K., Kurtz, Ron, Mourou, Gérard, Pronko, Peter P., Du, Detao, Elner, Victor, Lichter, Paul R., Squier, Jeffrey A.
Patent | Priority | Assignee | Title |
10034795, | Mar 13 2007 | AMO Development, LLC | Intraocular lens |
10074960, | Nov 23 2015 | nLIGHT, Inc.; NLIGHT, INC | Predictive modification of laser diode drive current waveform in order to optimize optical output waveform in high power laser systems |
10092393, | Mar 14 2013 | ALLOTEX, INC | Corneal implant systems and methods |
10098784, | Nov 10 2006 | Carl Zeiss Meditec AG | Treatment apparatus for surgical correction of defective eyesight, method of generating control data therefore, and method for surgical correction of defective eyesight |
10100393, | Feb 21 2013 | NLIGHT, INC | Laser patterning of multi-layer structures |
10130510, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
10166086, | Jun 01 2011 | OSAKA UNIVERSITY; HAMAMATSU PHOTONICS K K | Dental therapy apparatus |
10195017, | Mar 13 2007 | AMO Development, LLC | Method for creating incision to improve intraocular lens placement |
10239160, | Sep 21 2011 | Coherent, Inc | Systems and processes that singulate materials |
10295845, | Sep 29 2016 | nLIGHT, Inc.; NLIGHT, INC | Adjustable beam characteristics |
10310201, | Aug 01 2014 | NLIGHT, INC | Back-reflection protection and monitoring in fiber and fiber-delivered lasers |
10376356, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
10390994, | Nov 10 2006 | Carl Zeiss Meditec AG | Treatment apparatus for surgical correction of defective eyesight, method of generating control data therefore, and method for surgical correction of defective eyesight |
10390996, | Jun 23 2011 | AMO Development, LLC | Ophthalmic range finding |
10405970, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
10434600, | Nov 23 2015 | nLIGHT Photonics Corporation | Fine-scale temporal control for laser material processing |
10449090, | Jul 31 2015 | ALLOTEX, INC | Corneal implant systems and methods |
10464172, | Feb 21 2013 | NLIGHT, INC | Patterning conductive films using variable focal plane to control feature size |
10493559, | Jul 09 2008 | Fei Company | Method and apparatus for laser machining |
10520671, | Jul 08 2015 | nLIGHT Photonics Corporation | Fiber with depressed central index for increased beam parameter product |
10535973, | Jan 26 2015 | nLIGHT, Inc. | High-power, single-mode fiber sources |
10548715, | Mar 13 2007 | AMO Development, LLC | Apparatus for creating incisions to improve intraocular lens placement |
10548716, | Mar 13 2007 | AMO Development, LLC | Method for creating incision to improve intraocular lens placement |
10559395, | Feb 21 2013 | nLIGHT, Inc. | Optimization of high resolution digitally encoded laser scanners for fine feature marking |
10618131, | Jun 05 2014 | NLIGHT, INC | Laser patterning skew correction |
10639140, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
10663767, | Sep 29 2016 | nLIGHT, Inc.; NLIGHT, INC | Adjustable beam characteristics |
10687980, | Apr 01 2008 | AMO Development, LLC | System and method of iris-pupil contrast enhancement |
10692620, | Feb 21 2013 | nLIGHT, Inc. | Optimization of high resolution digitally encoded laser scanners for fine feature marking |
10695223, | Apr 01 2008 | AMO Development, LLC | System and method of iris-pupil contrast enhancement |
10709548, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
10729538, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
10730785, | Sep 29 2016 | nLIGHT Photonics Corporation | Optical fiber bending mechanisms |
10732439, | Sep 29 2016 | nLIGHT, Inc. | Fiber-coupled device for varying beam characteristics |
10736733, | Mar 13 2007 | AMO Development, LLC | Intraocular lens |
10739579, | Jan 19 2016 | nLIGHT, Inc. | Method of processing calibration data in 3D laser scanner systems |
10828149, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
10874553, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
10901162, | Aug 01 2014 | nLIGHT, Inc. | Back-reflection protection and monitoring in fiber and fiber-delivered lasers |
10916908, | Jan 26 2015 | nLIGHT, Inc. | High-power, single-mode fiber sources |
10925720, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
10952900, | Jul 31 2015 | Allotex, Inc. | Corneal implant systems and methods |
10971884, | Mar 26 2015 | nLIGHT, Inc. | Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss |
10971885, | Jun 02 2014 | nLIGHT, Inc. | Scalable high power fiber laser |
11008644, | Feb 21 2013 | nLIGHT, Inc. | Laser patterning of multi-layer structures |
11026838, | Jan 09 2008 | Alcon Inc | Photodisruptive laser fragmentation of tissue |
11103381, | Nov 10 2006 | Carl Zeiss Meditec AG | Treatment apparatus for surgical correction of defective eyesight, method of generating control data therefore, and method for surgical correction of defective eyesight |
11173548, | Apr 04 2017 | nLIGHT, Inc. | Optical fiducial generation for galvanometric scanner calibration |
11247939, | Jul 24 2015 | Corning Incorporated | Glass bumps on glass articles and methods of laser-induced growth |
11331756, | Nov 23 2015 | nLIGHT, Inc. | Fine-scale temporal control for laser material processing |
11364147, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
11411132, | Feb 21 2013 | nLIGHT, Inc. | Optimization of high resolution digitally encoded laser scanners for fine feature marking |
11465232, | Jun 05 2014 | nLIGHT, Inc. | Laser patterning skew correction |
11612478, | Mar 13 2007 | AMO Development, LLC | Apparatus for creating incisions to improve intraocular lens placement |
11654015, | Mar 13 2007 | AMO Development, LLC | Intraocular lens |
11701221, | Mar 13 2007 | AMO Development, LLC | Intraocular lens |
11759310, | Mar 13 2007 | AMO Development, LLC | Method for creating incision to improve intraocular lens placement |
11794282, | Nov 23 2015 | nLIGHT, Inc. | Fine-scale temporal control for laser material processing |
11826245, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
11839536, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
11888084, | Feb 21 2013 | nLIGHT, Inc. | Optimization of high resolution digitally encoded laser scanners for fine feature marking |
6489589, | Feb 07 1994 | Board of Regents, University of Nebraska-Lincoln | Femtosecond laser utilization methods and apparatus and method for producing nanoparticles |
6852946, | Dec 20 2002 | Caterpillar Inc | Laser-induced plasma micromachining |
6979798, | Mar 07 2003 | Electro Scientific Industries, Inc | Laser system and method for material processing with ultra fast lasers |
6995336, | Jan 29 2003 | The Regents of the University of Michigan | Method for forming nanoscale features |
7115514, | Oct 02 2003 | Coherent, Inc | Semiconductor manufacturing using optical ablation |
7139116, | Nov 30 2005 | Coherent, Inc | Post amplification optical isolator |
7143769, | Aug 11 2003 | Coherent, Inc | Controlling pulse energy of an optical amplifier by controlling pump diode current |
7169687, | Nov 03 2004 | Intel Corporation | Laser micromachining method |
7245419, | Sep 22 2005 | Coherent, Inc | Wavelength-stabilized pump diodes for pumping gain media in an ultrashort pulsed laser system |
7308171, | Nov 16 2005 | Coherent, Inc | Method and apparatus for optical isolation in high power fiber-optic systems |
7349452, | Dec 13 2004 | Coherent, Inc | Bragg fibers in systems for the generation of high peak power light |
7361171, | May 20 2003 | Coherent, Inc | Man-portable optical ablation system |
7367969, | Aug 11 2003 | Coherent, Inc | Ablative material removal with a preset removal rate or volume or depth |
7382389, | Mar 29 2001 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Methods and systems for thermal-based laser processing a multi-material device |
7391557, | Mar 28 2003 | APPLIED PHOTONICS WORLDWIDE INC | Mobile terawatt femtosecond laser system (MTFLS) for long range spectral sensing and identification of bioaerosols and chemical agents in the atmosphere |
7394476, | Mar 29 2001 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Methods and systems for thermal-based laser processing a multi-material device |
7413847, | Feb 09 2004 | Coherent, Inc | Semiconductor-type processing for solid-state lasers |
7474919, | Aug 29 2002 | The Regents of the University of Michigan | Laser-based method and system for enhancing optical breakdown |
7482551, | Jan 10 2000 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Processing a memory link with a set of at least two laser pulses |
7486705, | Mar 31 2004 | IMRA America, Inc.; IMRA America, Inc | Femtosecond laser processing system with process parameters, controls and feedback |
7560658, | Jan 29 2003 | The Regents of the University of Michigan | Method for forming nanoscale features |
7582848, | Dec 28 1999 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Energy-efficient, laser-based method and system for processing target material |
7584756, | Aug 17 2004 | AMO Development, LLC | Apparatus and method for correction of aberrations in laser system optics |
7611966, | May 05 2005 | Intel Corporation | Dual pulsed beam laser micromachining method |
7671295, | Jan 10 2000 | Electro Scientific Industries, Inc | Processing a memory link with a set of at least two laser pulses |
7679030, | Dec 28 1999 | Electro Scientific Industries, Inc | Energy-efficient, laser-based method and system for processing target material |
7723642, | Dec 28 1999 | Electro Scientific Industries, Inc | Laser-based system for memory link processing with picosecond lasers |
7750268, | Dec 28 1999 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Energy efficient, laser-based method and system for processing target material |
7767272, | May 25 2007 | IMRA America, Inc | Method of producing compound nanorods and thin films |
7838794, | Dec 28 1999 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Laser-based method and system for removing one or more target link structures |
7887532, | Sep 05 2006 | AMO Development, LLC | System and method for resecting corneal tissue using non-continuous initial incisions |
7912100, | Mar 31 2004 | IMRA America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
7955905, | Mar 29 2001 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Methods and systems for thermal-based laser processing a multi-material device |
7955906, | Mar 29 2001 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Methods and systems for thermal-based laser processing a multi-material device |
7970026, | May 04 2007 | EKSPLA Ltd. | Multiple output repetitively pulsed laser |
8029501, | Dec 30 2004 | LIGHT MATTER INTERACTION INC | Laser selective cutting by impulsive heat deposition in the IR wavelength range for direct-drive ablation |
8125704, | Aug 18 2008 | Coherent, Inc | Systems and methods for controlling a pulsed laser by combining laser signals |
8135050, | Jul 19 2005 | Coherent, Inc | Automated polarization correction |
8139910, | Jan 23 2006 | Coherent, Inc | Systems and methods for control of ultra short pulse amplification |
8150271, | Mar 28 2006 | Coherent, Inc | Active tuning of temporal dispersion in an ultrashort pulse laser system |
8168961, | Nov 26 2008 | Fei Company | Charged particle beam masking for laser ablation micromachining |
8173929, | Aug 11 2003 | Coherent, Inc | Methods and systems for trimming circuits |
8189971, | Jan 23 2006 | Coherent, Inc | Dispersion compensation in a chirped pulse amplification system |
8217304, | Mar 29 2001 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Methods and systems for thermal-based laser processing a multi-material device |
8231612, | Nov 19 2007 | AMO Development, LLC | Method of making sub-surface photoalterations in a material |
8232687, | Apr 26 2006 | Coherent, Inc | Intelligent laser interlock system |
8246609, | Jun 27 2008 | AMO Development LLC | Intracorneal inlay, system, and method |
8253066, | Dec 28 1999 | BARCLAYS BANK PLC, AS COLLATERAL AGENT | Laser-based method and system for removing one or more target link structures |
8279903, | Mar 31 2004 | IMRA America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
8292877, | Nov 07 2007 | AMO Development, LLC. | System and method for incising material |
8338746, | Jan 10 2000 | Electro Scientific Industries, Inc. | Method for processing a memory link with a set of at least two laser pulses |
8350183, | Jun 14 2007 | GERRSHEIMER REGENSBURG GMBH | Method for laser machining transparent materials |
8357196, | Nov 18 2009 | JOHNSON & JOHNSON SURGICAL VISION, INC | Mark for intraocular lenses |
8388609, | Dec 01 2008 | AMO Development, LLC. | System and method for multibeam scanning |
8394084, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8398622, | May 20 2003 | Coherent, Inc | Portable optical ablation system |
8403921, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8425497, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8461478, | Feb 03 2009 | ABBOTT CARDIOVASCULAR SYSTEMS INC | Multiple beam laser system for forming stents |
8498538, | Nov 14 2008 | Coherent, Inc | Compact monolithic dispersion compensator |
8500724, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8518026, | Mar 13 2007 | AMO Development, LLC | Apparatus for creating incisions to improve intraocular lens placement |
8524139, | Aug 10 2009 | Fei Company | Gas-assisted laser ablation |
8530783, | Feb 03 2009 | ABBOTT CARDIOVASCULAR SYSTEMS INC | Laser cutting system |
8556511, | Sep 08 2010 | ABBOTT CARDIOVASCULAR SYSTEMS INC | Fluid bearing to support stent tubing during laser cutting |
8568478, | Sep 21 2006 | JOHNSON & JOHNSON SURGICAL VISION, INC | Intraocular lenses for managing glare, adhesion, and cell migration |
8609205, | Feb 07 2007 | IMRA America, Inc | Method for depositing crystalline titania nanoparticles and films |
8619357, | Nov 30 2007 | Coherent, Inc | Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system |
8629416, | Nov 26 2008 | Fei Company | Charged particle beam masking for laser ablation micromachining |
8644356, | Mar 31 2004 | IMRA America, Inc. | Femtosecond laser processing system with process parameters controls and feedback |
8657810, | Mar 13 2007 | AMO Development, LLC | Method for creating incisions to improve intraocular lens placement |
8663208, | Feb 09 2009 | AMO Development, LLC; AMO Development LLC | System and method for intrastromal refractive correction |
8685006, | Nov 10 2006 | Carl Zeiss Meditec AG | Treatment apparatus for surgical correction of defective eyesight, method of generating control data therefore, and method for surgical correction of defective eyesight |
8690862, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8709001, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
8764736, | Sep 05 2007 | Alcon Inc | Laser-induced protection shield in laser surgery |
8809734, | Mar 29 2001 | Electro Scientific Industries, Inc | Methods and systems for thermal-based laser processing a multi-material device |
8842358, | Aug 01 2012 | Gentex Corporation | Apparatus, method, and process with laser induced channel edge |
8852175, | Nov 21 2008 | AMO Development LLC | Apparatus, system and method for precision depth measurement |
8853592, | Jul 09 2008 | Fei Company | Method for laser machining a sample having a crystalline structure |
8872062, | Feb 03 2009 | ABBOTT CARDIOVASCULAR SYSTEMS INC | Laser cutting process for forming stents |
8884184, | Aug 12 2010 | Coherent, Inc | Polymer tubing laser micromachining |
8901452, | Feb 03 2009 | Abbott Cardiovascular Systems, Inc. | Multiple beam laser system for forming stents |
8921733, | Aug 11 2003 | Coherent, Inc | Methods and systems for trimming circuits |
8968375, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
9006604, | Feb 03 2009 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
9022037, | Aug 11 2003 | Coherent, Inc | Laser ablation method and apparatus having a feedback loop and control unit |
9095415, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9101446, | Jan 02 2008 | INTRALASE CORP | System and method for scanning a pulsed laser beam |
9101448, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9107732, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9108270, | Jan 02 2008 | AMO Development, LLC | System and method for scanning a pulsed laser beam |
9114482, | Sep 16 2010 | Coherent, Inc | Laser based processing of layered materials |
9119703, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9119704, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9125725, | Jan 10 2005 | AMO Development, LLC | Method and apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation |
9130344, | Jan 23 2006 | Coherent, Inc | Automated laser tuning |
9138351, | Jan 02 2008 | AMO Development, LLC | Method for scanning a pulsed laser beam |
9147989, | Mar 31 2004 | IMRA America, Inc. | Femtosecond laser processing system with process parameters controls and feedback |
9199334, | Feb 03 2009 | Multiple beam laser system for forming stents | |
9226853, | Jan 02 2008 | AMO Development, LLC | Method for scanning a pulsed laser beam |
9233023, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
9233024, | Mar 13 2007 | AMO Development, LLC | Method and apparatus for creating ocular surgical and relaxing incisions |
9271870, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9281653, | Apr 26 2006 | Coherent, Inc | Intelligent laser interlock system |
9295518, | Jul 23 2009 | Koninklijke Philips Electronics N V | Optical blade and hair cutting device |
9359252, | Jul 24 2015 | Corning Incorporated | Methods for controlled laser-induced growth of glass bumps on glass articles |
9364317, | Mar 13 2007 | AMO Development, LLC | Method for creating incisions to improve intraocular lens placement |
9370445, | Nov 10 2006 | Carl Zeiss Meditec AG | Treatment apparatus for surgical correction of defective eyesight, method of generating control data therefore, and method for surgical correction of defective eyesight |
9399267, | Feb 03 2009 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
9402715, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
9411938, | Apr 02 2009 | SIE AG, Surgical Instrument Engineering | System for defining cuts in eye tissue |
9421131, | Apr 01 2008 | AMO Development, LLC | System and method of iris-pupil contrast enhancement |
9427356, | Jan 09 2008 | Alcon Inc | Photodisruptive laser fragmentation of tissue |
9456925, | Sep 06 2007 | Alcon Inc | Photodisruptive laser treatment of the crystalline lens |
9462943, | Nov 21 2008 | AMO Development, LLC | Apparatus, system and method for precision depth measurement |
9474648, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9474649, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9480601, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9521949, | Jun 23 2011 | AMO DEVELOPMENTS, LLC | Ophthalmic range finding |
9526608, | Mar 13 2007 | AMO Development, LLC | Apparatus for creating incisions to improve intraocular lens placement |
9537042, | Feb 21 2013 | NLIGHT, INC | Non-ablative laser patterning |
9603519, | Jun 23 2011 | AMO Development, LLC | Ophthalmic range finding |
9603702, | Sep 21 2006 | JOHNSON & JOHNSON SURGICAL VISION, INC | Intraocular lenses for managing glare, adhesion, and cell migration |
9650292, | Jul 24 2015 | Corning Incorporated | Methods for controlled laser-induced growth of glass bumps on glass articles |
9662198, | Mar 13 2007 | AMO Development, LLC | Method for creating incisions to improve intraocular lens placement |
9693903, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9693904, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9693905, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9714194, | Jul 24 2015 | Corning Incorporated | Methods for controlled laser-induced growth of glass bumps on glass articles |
9750640, | Jan 10 2005 | AMO Development, LLC | Apparatus for patterned plasma-mediated laser ophthalmic surgery |
9774160, | Mar 31 2004 | IMRA America, Inc. | Femtosecond laser processing system with process parameters controls and feedback |
9782253, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
9795472, | Mar 13 2007 | AMO Development, LLC | Method for creating incision to improve intraocular lens placement |
9815141, | Dec 07 2011 | General Atomics | Methods and systems for use in laser machining |
9820848, | Mar 13 2007 | AMO Development, LLC | Method for creating incision to improve intraocular lens placement |
9842665, | Feb 21 2013 | NLIGHT, INC | Optimization of high resolution digitally encoded laser scanners for fine feature marking |
9844463, | Apr 01 2008 | AMO Development, LLC | Ophthalmic laser apparatus, system, and method with high resolution imaging |
9968439, | Mar 13 2007 | AMO Development, LLC | Method for patterned plasma-mediated modification of the crystalline lens |
Patent | Priority | Assignee | Title |
3720213, | |||
4001840, | Oct 07 1974 | Precision Instrument Co. | Non-photographic, digital laser image recording |
4087672, | Jul 08 1975 | United Kingdom Atomic Energy Authority | Laser removal of material from workpieces |
4114018, | Sep 30 1976 | Lasag AG | Method for ablating metal workpieces with laser radiation |
4289378, | Dec 20 1974 | Apparatus for adjusting the focal point of an operating laser beam focused by an objective | |
4464761, | Dec 18 1981 | DUBIN WARREN B | Chromium-doped beryllium aluminum silicate laser systems |
4579430, | Dec 11 1982 | Carl-Zeiss-Stiftung | Method and apparatus for forming an image of the ocular fundus |
4630274, | Nov 24 1983 | Max-Planck-Geselschaft zur Foerderung der Wissenschaften e.V. | Method and apparatus for generating short intensive pulses of electromagnetic radiation in the wavelength range below about 100 nm |
4665913, | Nov 17 1983 | Visx, Incorporated | Method for ophthalmological surgery |
4675500, | Oct 28 1983 | Gretag Aktiengesellschaft | Laser processing apparatus with means for selectively varying the transverse mode distribution of the laser beam |
4712543, | Jan 20 1982 | Process for recurving the cornea of an eye | |
4727381, | Jul 25 1984 | Appartus for, and methods of, inscribing patterns on semiconductor wafers | |
4729372, | Nov 17 1983 | Visx, Incorporated | Apparatus for performing ophthalmic laser surgery |
4732473, | Jun 14 1984 | Apparatus for, and methods of, determining the characteristics of semi-conductor wafers | |
4733660, | Aug 07 1984 | Medical Laser Research and Development Corporation | Laser system for providing target specific energy deposition and damage |
4764930, | Jan 27 1988 | AMO Development, LLC | Multiwavelength laser source |
4838679, | Jun 14 1984 | LASER DIAGNOSTIC TECHNOLOGIES INC, A CALIFORNIA CORPORATION | Apparatus for, and method of, examining eyes |
4839493, | Jul 06 1984 | FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E V | Arrangement for machining workpieces by means of a laser beam by building up a plasma that is to be kept within limits |
4848340, | Feb 10 1988 | AMO Development, LLC | Eyetracker and method of use |
4881808, | Feb 10 1988 | AMO Development, LLC | Imaging system for surgical lasers |
4901718, | Feb 02 1988 | AMO Development, LLC | 3-Dimensional laser beam guidance system |
4907586, | Mar 31 1988 | AMO Development, LLC | Method for reshaping the eye |
4925523, | Oct 28 1988 | General Electric Capital Corporation | Enhancement of ultraviolet laser ablation and etching organic solids |
4930505, | Oct 04 1986 | HELMUT K PINSCH GMBH & CO , A CORP OF GERMANY | Method of enhancing the well-being of a living creature |
4942586, | Apr 25 1989 | Intelligent Surgical Lasers Inc.; INTELLIGENT SURGICAL LASERS INC | High power diode pumped laser |
4988348, | May 26 1989 | AMO Development, LLC | Method for reshaping the cornea |
5062702, | Mar 16 1990 | ESCALON HOLDINGS, INC | Device for mapping corneal topography |
5093548, | Oct 17 1989 | Robert Bosch GmbH | Method of forming high precision through holes in workpieces with a laser beam |
5098426, | Feb 06 1989 | AMO Manufacturing USA, LLC | Method and apparatus for precision laser surgery |
5141506, | Oct 22 1985 | Systems and methods for creating substrate surfaces by photoablation | |
5207668, | Nov 17 1983 | AMO Manufacturing USA, LLC | Method for opthalmological surgery |
5208437, | May 18 1990 | Hitachi, Ltd. | Method of cutting interconnection pattern with laser and apparatus thereof |
5219343, | Nov 17 1983 | AMO Manufacturing USA, LLC | Apparatus for performing ophthalmogolical surgery |
5235606, | Oct 29 1991 | LASER ENERGETICS | Amplification of ultrashort pulses with Nd:glass amplifiers pumped by alexandrite free running laser |
5246435, | Feb 25 1992 | AMO Development, LLC | Method for removing cataractous material |
5269778, | Nov 01 1988 | Xintec Corporation | Variable pulse width laser and method of use |
5280491, | Aug 02 1991 | Two dimensional scan amplifier laser | |
5289407, | Jul 22 1991 | CORNELL RESEARCH FOUNDATION, INC A CORP OF NEW YORK | Method for three dimensional optical data storage and retrieval |
5312396, | Sep 06 1990 | MASSACHUSETTS INSTITUTE OF TECHNOLOGY A CORP OF MA | Pulsed laser system for the surgical removal of tissue |
5335258, | Mar 31 1993 | The United States of America as represented by the Secretary of the Navy; UNITED STATES OF AMERICA, THE, AS REPRESENTED BY THE SECRETARY OF THE NAVY | Submicrosecond, synchronizable x-ray source |
5348018, | Nov 25 1991 | Research Foundation of City College of New York; MEDISCIENCE TECHNOLOGY CORP | Method for determining if tissue is malignant as opposed to non-malignant using time-resolved fluorescence spectroscopy |
5389786, | Oct 06 1992 | President of Nagoya University | Method of quantitative determination of defect concentration on surfaces |
5454902, | Nov 12 1991 | Hughes Electronics Corporation | Production of clean, well-ordered CdTe surfaces using laser ablation |
5558789, | Mar 02 1994 | FLORIDA, UNIVERSITY OF | Method of applying a laser beam creating micro-scale surface structures prior to deposition of film for increased adhesion |
5984916, | Apr 20 1993 | AMO Development, LLC | Ophthalmic surgical laser and method |
DE4119024, | |||
JP6293095, | |||
WO8908529, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 04 1999 | The Regents of the University of Michigan | (assignment on the face of the patent) | / | |||
Dec 31 2002 | INTRALASE CORP | Silicon Valley Bank | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 013705 | /0441 | |
Dec 08 2006 | Silicon Valley Bank | IntraLase Corporation | RELEASE | 018711 | /0119 | |
Jan 01 2008 | INTRALASE CORP | AMO Development, LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 020309 | /0349 | |
Jan 01 2008 | INTRALASE CORP | AMO Development, LLC | CORRECT AN ERROR IN A COVER SHEET PREVIOUSLY RECORDED AT REEL FRAME 0203009 0349, NAMELY TO DELETE U S PATENT NO 5656186 AND RE37585 | 020550 | /0216 | |
Jan 01 2008 | INTRALASE CORP | AMO Development, LLC | CORRECTIVE ASSIGNMENT TO CORRECT THE U S PATENT NO 5466233 WAS INCORRECTLY ASSIGNED TO AMO DEVELOPMENT, LLC PREVIOUSLY RECORDED ON REEL 020309 FRAME 0349 ASSIGNOR S HEREBY CONFIRMS THE INTRALASE CORP | 020679 | /0026 |
Date | Maintenance Fee Events |
Mar 08 2005 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Mar 08 2005 | M1555: 7.5 yr surcharge - late pmt w/in 6 mo, Large Entity. |
Feb 12 2009 | M1553: Payment of Maintenance Fee, 12th Year, Large Entity. |
Feb 16 2009 | REM: Maintenance Fee Reminder Mailed. |
Date | Maintenance Schedule |
Mar 19 2005 | 4 years fee payment window open |
Sep 19 2005 | 6 months grace period start (w surcharge) |
Mar 19 2006 | patent expiry (for year 4) |
Mar 19 2008 | 2 years to revive unintentionally abandoned end. (for year 4) |
Mar 19 2009 | 8 years fee payment window open |
Sep 19 2009 | 6 months grace period start (w surcharge) |
Mar 19 2010 | patent expiry (for year 8) |
Mar 19 2012 | 2 years to revive unintentionally abandoned end. (for year 8) |
Mar 19 2013 | 12 years fee payment window open |
Sep 19 2013 | 6 months grace period start (w surcharge) |
Mar 19 2014 | patent expiry (for year 12) |
Mar 19 2016 | 2 years to revive unintentionally abandoned end. (for year 12) |