A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.
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0. 22. A heat sink comprising:
a substrate having a floor and a vertical sidewall structure comprising a plurality of walls; a driving device supported by said substrate; and a fan for being rotated by said driving device, wherein: a height of an entire upper surface of said side wall structure is lower than that of an upper surface of said driving device relative to said floor of said substrate. 1. A heat sink comprising:
a substrate having a floor and a vertical side wall open in one direction; a plurality of fins vertically projecting from said floor of said substrate; driving means at least a part of which is supported by said floor of said substrate; and a fan rotated by said driving means wherein: a height of an upper surface of said side wall is lower than that of an upper surface of said driving means relative to said floor of said substrate. 0. 25. A heat sink comprising:
a substrate having a floor and a vertical sidewall; a driving device supported by said substrate; a fan for being rotated by said driving device; and a plate mounted on an upper surface of said sidewall and having an opening, wherein: a height of said upper surface of said side wall and a height of an upper surface of said plate are lower than that of an upper surface of said driving device relative to said floor of said substrate. 0. 35. A heat sink comprising:
a substrate having a floor and a vertical side wall open in one direction; a plurality of fins vertically projecting from said floor of said substrate; a driving device at least a part of which is supported by said floor of said substrate; and a fan for being rotated by said driving device, wherein: a height of an upper surface of said side wall is lower than that of an upper surface of said driving device relative to said floor of said substrate. 0. 29. A heat sink comprising:
a substrate having a floor; a driving device supported by said substrate; a fan for being rotated by said driving device; a plate having an opening; a vertical side wall structure disposed between said substrate and said plate, wherein: said plate is positioned at an upper surface of said side wall structure, and said plate and said side wall structure form a frame having a height which is lower than a height of an upper surface of said driving device relative to said floor of said substrate. 0. 12. A heat sink apparatus comprising:
a heat sink apparatus substrate for being attached to a heat emitting element, and having a bottom portion with a standing wall mounted thereon; a driving device supported by said substrate; a fan mounted on said driving device; and a cover mounted on said standing wall, wherein: said driving device protrudes through an opening formed on said cover and a height of an upper surface of said fan and a height of an upper surface of said cover are lower than that of an upper surface of said driving device relative to said bottom wall. 4. A heat sink comprising:
a substrate having a floor and a vertical side wall open in one direction; a plurality of fins vertically projecting from said floor of said substrate; driving means at least a part of which is supported by said substrate; a fan rotated by said driving means; and a plate mounted on an upper surface of said side wall and having an opening, wherein: a height of said upper surface of said side wall and a height of an upper surface of said plate are lower than that of an upper surface of said driving means relative to said floor of said substrate. 0. 38. A heat sink comprising:
a substrate having a floor and a vertical sidewall open in one direction; a plurality of fins vertically projecting from said floor of said substrate; a driving device at least a part of which is supported by said substrate; a fan for being rotated by said driving device; and a plate mounted on an upper surface of said sidewall and having an opening, wherein: a height of said upper surface of said side wall and a height of an upper surface of said plate are lower than that of an upper surface of said driving device relative to said floor of said substrate. 8. A heat sink comprising:
a substrate having a floor; a plurality of fins vertically projecting from said floor of said substrate; driving means at least a part of which is supported by said substrate; a fan rotated by said driving means; a plate having an opening; and a vertical side wall structure disposed between said substrate and said plate, said vertical side wall structure being open in one direction, said plate being positioned at an upper surface of said side wall structure, said plate and said side wall structure forming a frame having a height which is lower than a height of an upper surface of said driving means relative to said floor of said substrate.
0. 42. A heat sink comprising:
a substrate having a floor; a plurality of fins vertically projecting from said floor of said substrate; a driving device at least a part of which is supported by said substrate; a fan for being rotated by said driving device; a plate having an opening; and a vertical side wall structure disposed between said substrate and said plate, said vertical side wall structure being open in one direction, said plate being positioned at an upper surface of said side wall structure, said plate and said side wall structure forming a frame having a height which is lower than a height of an upper surface of said driving device relative to said floor of said substrate.
0. 14. A heat sink apparatus for being mounted in an electric device in a state of contact with a heat emitting element, said apparatus comprising:
a housing including an upper wall, a lower wall and a side wall, said housing having two openings; a plurality of fins provided in said housing; driving device provided in said housing; and a fan for being rotated by said driving device, wherein: a height of an upper surface of said side wall is lower than that of an upper surface of said driving device relative to said lower wall so as to generate a smooth air flow when said heat sink apparatus is mounted in the electric device so that said upper surface of said driving device faces a plane surface in said electric device. 0. 18. A heat sink apparatus for being mounted in an electric device in a state of contact with a heat emitting element, said apparatus comprising:
a housing having an inlet and an outlet for air; a driving device provided in said housing and having a protruding portion thereof form said inlet of said housing; a fan provided in said housing and for being rotated by said driving device; and a plurality of fins provided in said housing, wherein: said protruding portion of said driving device and a portion of said housing adjacent to said inlet are for cooperating with said plane surface in said electric device to generate a smooth air flow when said heat sink apparatus is mounted in the electric device so that said inlet is disposed apart from said plane surface. 0. 33. A heat sink apparatus comprising:
a heat sink substrate including a bottom wall, a plurality of side walls mounted on each of the sides of said bottom wall except for one side, said bottom wall and a plurality of side walls being formed integrally in a one-piece structure; a cover providing a first opening by being mechanically mounted on an edge portion of said side walls and being formed with a second opening therein; a motor supported by said heat sink substrate and being disposed adjacent to said second opening; a centrifugal fan for being rotated by said motor; and a plurality of fins provided on said bottom wall of said heat sink substrate, wherein: an air flow generated by said centrifugal fan passes from said second opening to said first opening. 3. A heat sink according
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1. Field of the Invention
The present invention relates to a heat sink for cooling a semiconductor element which emits much heat such as a micro processing unit (referred to as an MPU hereinafter).
2. Description of the Prior Art
Heat sinks have been used for cooling semiconductors and the like which emit much heat. Recently, in particular, a fan-motor-integrated heat sink incorporated with a small fan is used for coping with the high heat emission of the MPU etc.
Conventional heat sinks will be described hereinafter.
In
The operation of a conventional fan-motor-integrated heat sink having the aforementioned structure will be described hereinafter. Heat emitted from the MPU 81 is transmitted to the heat sink substrate 82 and the radiator fins 83. Air flow generated by the fan 85 rotated by the driving means 84 is taken in between the structure and the upper surface of the heat sink as shown by an arrow A and passes among the radiator fins 83 while carrying off heat therefrom to be vented from the side surface thereof as shown by an arrow B.
The aforementioned conventional structure had a problem that it was impossible for thin devices such as the notebook-type personal computer limited in thickness to secure a sufficient space for taking in air from above the heat sink and consequently to secure a sufficient cooling performance. Although the entire heat sink may be made thin for securing sufficient space, a motor capable of rotating the fan to generate a sufficient amount of air flow for cooling the device required a certain degree of thickness because of the structure of its bearing and coil, so that the motor was structurally limited in being made thin.
An object of the present invention is to provide a fan-motor-integrated heat sink capable of effectively supplying cooling air flow to an element even if the same is a heat emitting element such as an MPU etc. employed by a thin device which cannot secure a sufficient space above the heat sink.
In order to attain the above object, the present invention obtains a sufficient space for taking in air between the upper surface of the heat sink and the casing of a device by making the height of the fan and those of the fins of the heat sink lower than the height of the upper surface of the fan driving means such as a motor which is structurally limited in thickness relative to the heat sink substrate. Furthermore, the heat sink substrate and the fins are formed such that air is vented only in one direction to compensate for the reduction of cooling performance caused by miniaturizing the fan and the fins of the heat sink substrate, and a cover is provided on the inlet side to prevent the vented air from being taken in.
This structure enables arranging a structure above the heat sink nearly as low as the height of the motor and consequently mounting the heat sink on a thin device.
The preferred embodiments of the present invention will be described hereinafter with reference to
In
Although they are arranged substantially in circular arcs according to this embodiment, they may be arranged substantially along a spiral. Numeral 6 is a motor serving as driving means, which motor 6 is fixed to the surface of the heat sink substrate 2 on which the radiator fins 5 are provided according to a fixing method using a bond, screws, press fitting, etc.
Numeral 7 designates an axial fan rotated by the motor 6, which fan 7 is arranged inside the side wall 3 for generating air flow to take in and blow out air. The fan 7 is made of metal having high thermal conductivity such as aluminum etc. for enhancing radiator effect. Incidentally, it may be made of resin such as plastic etc., not being limited to metal so long as it is high in thermal conductivity as a member. Numeral 8 is a cover for covering the edges of the heat sink substrate 2 where the side wall 3 is provided, which cover 8 has an opening larger in diameter than the outer diameter of the motor 6 and smaller than the outer diameter of the fan 7 and which is mounted on the side wall 3 of the heat sink substrate 2 using a bond, screws, pressure welding etc. Numeral 9 designates a structure such as the casing of a notebook-type personal computer for regulating space above the heat sink.
The side wall 3 is smaller in height than the motor 6. The fan 7 is provided on the side surface of the motor 6 being shifted toward the lower end thereof, such that the upper surface of the fan 7 is lower than the upper surface of the motor 6, being in height between the heat sink substrate 2 and the cover 8. The fins 5 are so high as not to touch the fan 7 thereunder while being substantially as high as the side wall 3 in the vicinity of the outlet 4 and outside the fan 7. As shown in
The operation of the heat sink having the above structure will be described with reference to drawings.
In
Next, the operation of the cover 8 will be described with reference to
Incidentally, although the motor 6 is mounted on the heat sink substrate 2 according to this embodiment, it may be mounted on the cover 8 so as to be mounted on the heat sink substrate 2 by way of the cover 8.
A second embodiment will now be described.
Reference numeral 11 designates a heat emitting element such as an MPU etc. on which the heat sink is mounted for cooling, 12 is a heat sink substrate, 13 designates a side wall provided on three edge surfaces of the heat sink substrate 12, 14 designates an outlet for blowing out air formed on an edge surface of the heat sink substrate 12 where no side wall 13 is provided, 15 designates a plurality of radiator fins integrally provided with the heat sink substrate 12, 16 is a motor serving as driving means, 17 is an axial fan rotated by the motor 16, 18 is a first cover for covering the edges of the heat sink substrate 12 where the side wall 13 is provided, and 21 designates a structure such as the casing of a notebook-type personal computer for regulating a space above the heat sink. The components described above are similar to those according to the first embodiment, so that the description thereof is omitted. Numeral 19 is a second cover which is substantially quadrangular and concave in outline and one side of which is open with an inlet 20 for determining the inflow direction of air. The second cover 19 is mounted on the heat sink substrate 12 such that the inlet 20 is directed in a predetermined direction relative to the heat sink substrate 12.
The operation of the heat sink having the above structure according to the second embodiment will be described with reference to
It is possible to mount the second cover 19 on the heat sink substrate and take in air from a direction also in the conventional structure, but the thickness of the heat sink substrate increases by that of the second cover 19. In case that the second cover 19 is mounted on the heat sink according to the second embodiment of the present invention, it is possible to arrange the motor 16 and the second cover 19 closely to each other, thereby realizing a thin heat sink capable of taking in air from a particular direction and venting the air in one direction. Devices requiring the one-direction air taking and the one-direction air venting are mainly thin devices limited in space, so that the thin one-direction air taking and one-direction air venting heat sink having the structure of the present invention can realize a large effect.
Now, a third embodiment will be described.
Reference numeral 60 designates a heat emitting element, 61 is a heat sink similar to that of the second embodiment, 62 is an inlet provided in the heat sink 61 for taking in air, 63 designates an outlet provided in the heat sink 61 for venting air therefrom, 64 is a first duct connected to the inlet 62, and 65 is a second duct connected to the outlet 63. Although the figure illustrates the first duct 64 and the second duct 65 each having a rectangular cross section similar to that of the inlet 62 or that of the outlet 63, they can have any shape; for example, it is also possible that the tip end of the first duct 64 at the side of taking in air has a shape laterally wider than the inlet 62 and the tip end of the second duct 65 at the side of venting air has a shape of a circle or the like larger than the outlet 63. Alternatively, the duct can be provided only at either of the inlet 62 or the outlet 63. In
The operation of the heat sink having the above structure according to the third embodiment will be described with reference to
As shown in
The present invention can be embodied in other various forms without departing from the spirit or main features thereof. Therefore, the preferred embodiments set forth above are illustrated only by way of examples in all respects, and should not be interpreted by way of limitation. The scope of the present invention is represented by the scope of the claims for a patent but not restrained by the specification at all. Furthermore, the modifications or variations belonging to the equivalent of the scope of the claims for a patent are all within the scope of the present invention.
Inoue, Yasushi, Miyahara, Masaharu, Suga, Kenji
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