Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing emi shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide emi shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.
|
0. 46. A method for electromagnetic interference (emi) shielding a ventilation opening of an electronic enclosure, the method comprising positioning a frameless metallized dielectric vent panel within the ventilation opening such that the frameless metallized dielectric vent panel is compressively retained within the ventilation opening by a resiliently compressible electrically-conductive edge disposed substantially about the perimeter of the frameless metallized dielectric vent panel and substantially covering the thickness defined between a first side and a second side of the frameless metallized dielectric vent panel, and such that the resiliently compressible electrically-conductive edge places the frameless metallized dielectric vent panel in electrical communication with the electronic enclosure.
0. 49. A method of making a frameless vent panel capable of providing electromagnetic interference (emi) shielding for a ventilation opening of an electronic enclosure, the method comprising providing a frameless metallized dielectric vent panel with a resiliently compressible electrically-conductive edge substantially about a perimeter of the frameless metallized dielectric vent panel such that the resiliently compressible electrically-conductive edge substantially covers a thickness defined between a first side and a second side of the frameless metallized dielectric vent panel, the resiliently compressible electrically-conductive edge being configured for allowing the frameless vent panel to be compressively fit and retained within the ventilation opening in electrical contact with the electronic enclosure.
0. 17. A frameless vent panel for providing electromagnetic interference (emi) shielding for a ventilation opening of an electronic enclosure, the frameless vent panel comprising:
a dielectric panel having a thickness defined by a first side and a second side, a perimeter, and a plurality of apertures extending from the first side to the second side for allowing airflow therethrough;
at least one electrically-conductive material provided to the dielectric panel for attenuating a transfer of electromagnetic energy from the first side to the second side; and
a resiliently compressible electrically-conductive edge substantially about the perimeter of the frameless vent panel and substantially covering said thickness between said first side and said second side, for compressively fitting the frameless vent panel within the ventilation opening in electrical communication with the electronic enclosure.
0. 35. A frameless vent panel for providing electromagnetic interference (emi) shielding for a ventilation opening of an electronic enclosure, the frameless vent panel comprising:
a frameless dielectric panel having a thickness defined by a first side and a second side, a perimeter, and a plurality of apertures extending from the first side to the second side for allowing airflow therethrough;
at least one electrically-conductive material provided to the frameless dielectric panel for attenuating a transfer of electromagnetic energy from the first side to the second side; and
a resiliently compressible emi gasket having a width substantially equal to the thickness of the frameless dielectric panel, the resiliently compressible emi gasket being wrapped around the perimeter of the frameless dielectric panel and substantially covering the thickness defined between the first side and the second side.
0. 38. A frameless vent panel for providing electromagnetic interference (emi) shielding for a ventilation opening of an electronic enclosure, the frameless vent panel comprising:
a dielectric panel having a thickness defined by a first side and a second side, a perimeter, and a plurality of apertures extending from the first side to the second side for allowing airflow therethrough;
at least one electrically-conductive material provided to the dielectric panel for attenuating a transfer of electromagnetic energy from the first side to the second side; and
means for compressively fitting and retaining the frameless vent panel within the ventilation opening and for placing the frameless vent panel in electrical communication with the electronic enclosure,
said means disposed substantially about the perimeter of the frameless vent panel with said means substantially covering the thickness defined between the first side and the second side.
0. 39. An electronic enclosure comprising:
a ventilation opening;
a frameless vent panel within the ventilation opening for providing electromagnetic interference (emi) shielding, the frameless vent panel including:
a dielectric panel having a thickness defined by a first side and a second side, a perimeter, and a plurality of apertures extending from the first side to the second side for allowing airflow therethrough;
at least one electrically-conductive material provided to the dielectric panel for attenuating a transfer of electromagnetic energy from the first side to the second side; and
a resiliently compressible electrically-conductive edge substantially about the perimeter of the frameless vent panel and substantially covering the thickness defined between the first side and the second side, the resiliently compressible electrically-conductive edge compressively retaining the frameless vent panel within the ventilation opening in electrical communication with the electronic enclosure.
0. 1. A frameless vent panel adapted to shield against electromagnetic interference (emi) comprising:
a dielectric panel having a thickness defined by a first side and a second side, and defining a plurality of apertures, said dielectric panel further having a perimeter;
a first electrically conductive layer applied to the dielectric pane, wherein the conductively coated dielectric panel attenuates a transfer of electromagnetic energy from the first side to the second side of the substrate; and
a strip of compressible conductive foam material, said strip having a width substantially equal to the thickness of said dielectric panel and being wrapped around the perimeter thereof and substantially covering said thickness between said first side and said second side.
0. 2. The frameless vent panel of
0. 3. The frameless vent panel of
0. 4. The frameless vent panel of
0. 5. The frameless vent panel of
0. 6. The frameless vent panel of
0. 7. The frameless vent panel of
0. 8. The frameless vent panel of
0. 9. The frameless vent panel of
0. 10. The frameless vent panel of
0. 11. The frameless vent panel of
0. 12. The frameless vent panel of
0. 13. The frameless vent panel of
0. 14. The frameless vent panel of
0. 15. The frameless vent panel of
0. 16. The frameless vent panel of
0. 18. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge is configured for allowing the frameless vent panel to be compressively fit and retained within the ventilation opening without using any mechanical fasteners.
0. 19. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge is configured for allowing the frameless vent panel to be compressively fit and retained within the ventilation opening in a direction normal to the longitudinal axes of the apertures.
0. 20. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises a band of one or more materials, the band having a width substantially equal to the thickness of the dielectric panel and being wrapped around the perimeter of the dielectric panel such that the band substantially covers the thickness defined between the first side and the second side.
0. 21. The frameless vent panel of claim 20, wherein the band of one or more materials comprises at least one or more of electrically-conductive foam, electrically-conductive fabric, and electrically-conductive fabric wrapped over foam.
0. 22. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive fabric.
0. 23. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive fabric wrapped over foam.
0. 24. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive foam.
0. 25. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises a resiliently compressible emi gasket having a width substantially equal to the thickness of the dielectric panel, the resiliently compressible emi gasket being wrapped around the perimeter of the dielectric panel such that the resiliently compressible emi gasket substantially covers the thickness defined between the first side and the second side.
0. 26. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive elastomer.
0. 27. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive protrusions extending outwardly substantially about the perimeter.
0. 28. The frameless vent panel of claim 27, wherein the electrically-conductive protrusions comprise at least one or more of a resilient spring finger, a dimple, or a combination thereof.
0. 29. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive wire mesh.
0. 30. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive material disposed over a resiliently compressible member.
0. 31. The frameless vent panel of claim 17, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive fabric applied to an elastomer.
0. 32. The frameless vent panel of claim 17, wherein the openings have a honeycomb configuration.
0. 33. The frameless vent panel of claim 17, further comprising flame retardant provided to the conductively coated dielectric panel for achieving a flame rating of V0 under Underwriter's Laboratories (UL) Standard No. 94.
0. 34. The frameless vent panel of claim 17, further comprising a corrosion inhibitor provided to the conductively coated dielectric panel.
0. 36. The frameless vent panel of claim 35, wherein the resiliently compressible emi gasket comprises electrically-conductive fabric wrapped over foam.
0. 37. The frameless vent panel of claim 35, wherein the resilient compressible emi gasket comprises electrically-conductive material coupled to a resiliently compressible member.
0. 40. The electronic enclosure of claim 39, wherein the frameless vent panel is compressively retained within the ventilation opening by the resiliently compressible electrically-conductive edge without using any mechanical fasteners.
0. 41. The electronic enclosure of claim 39, wherein the resiliently compressible electrically-conductive edge is compressed within the ventilation opening in a direction normal to the longitudinal axes of the apertures.
0. 42. The electronic enclosure of claim 39, wherein the resiliently compressible electrically-conductive edge comprises a band of one or more materials, the band having a width substantially equal to the thickness of the dielectric panel and being wrapped around the perimeter of the dielectric panel such that the band substantially covers the thickness defined between the first side and the second side.
0. 43. The electronic enclosure of claim 42, wherein the band of one or more materials comprises at least one or more of electrically-conductive foam, electrically-conductive fabric, and electrically-conductive fabric wrapped over foam.
0. 44. The electronic enclosure of claim 39, wherein the resiliently compressible electrically-conductive edge comprises electrically-conductive fabric wrapped over foam.
0. 45. The electronic enclosure of claim 39, wherein the resiliently compressible electrically-conductive edge comprises a resiliently compressible emi gasket having a width substantially equal to the thickness of the dielectric panel and being wrapped around the perimeter of the dielectric panel such that the resiliently compressible emi gasket substantially covers the thickness defined between the first side and the second side.
0. 47. The method of claim 46, wherein the frameless metallized dielectric vent panel is compressively retained within the ventilation opening by the resiliently compressible electrically-conductive edge without using any mechanical fasteners.
0. 48. The method of claim 46, wherein the frameless metallized dielectric vent panel includes a plurality of apertures extending from the first side to the second side for allowing airflow therethrough, and wherein positioning the frameless metallized dielectric vent panel within the ventilation opening includes compressing the resiliently compressible electrically-conductive edge within the ventilation opening in a direction generally perpendicular to the longitudinal axes of the apertures.
0. 50. The method of claim 49, further comprising metalizing a dielectric panel to thereby create the frameless metallized dielectric vent panel before providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge.
0. 51. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning a band of one or more materials about the perimeter of the frameless metallized dielectric vent panel such that the band of one or more materials substantially covers the thickness defined between the first side and said second side.
0. 52. The method of claim 51, wherein the band of one or more materials comprises at least one or more of electrically-conductive foam, electrically-conductive fabric, and electrically-conductive fabric wrapped over foam.
0. 53. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning electrically-conductive fabric wrapped over foam about the perimeter of the frameless metallized dielectric vent panel such that the electrically-conductive fabric wrapped over foam substantially covers the thickness defined between the first side and said second side.
0. 54. The method of claim 50, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning electrically-conductive fabric about the perimeter of the frameless metallized dielectric vent panel such that the electrically-conductive fabric substantially covers the thickness defined between the first side and said second side.
0. 55. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning electrically-conductive foam about the perimeter of the frameless metallized dielectric vent panel such that the electrically-conductive foam substantially covers the thickness defined between the first side and said second side.
0. 56. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning a resiliently compressible emi gasket about the perimeter of the frameless metallized dielectric vent panel such that the resiliently compressible emi gasket substantially covers the thickness defined between the first side and said second side.
0. 57. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning electrically-conductive elastomer about the perimeter of the frameless metallized dielectric vent panel such that the electrically-conductive elastomer substantially covers the thickness defined between the first side and said second side.
0. 58. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises providing edge treatment to the frameless metallized dielectric vent panel to create electrically-conductive protrusions extending outwardly substantially about the perimeter of the metallized dielectric vent panel.
0. 59. The method of claim 58, wherein the electrically-conductive protrusions comprise at least one or more of a resilient spring finger, a dimple, or a combination thereof.
0. 60. The method of claim 49, wherein providing the frameless metallized dielectric vent panel with the resiliently compressible electrically-conductive edge comprises positioning an electrically-conductive wire mesh about the perimeter of the frameless metallized dielectric vent panel such that the electrically-conductive wire mesh substantially covers the thickness defined between the first side and said second side.
0. 61. The method of claim 49, further comprising providing the frameless metallized dielectric vent panel with flame retardant sufficient for achieving a flame rating of V0 under Underwriter's Laboratories (UL) Standard No. 94.
0. 62. The method of claim 49, further comprising providing the frameless metallized dielectric vent panel with a corrosion inhibitor.
0. 63. The method of claim 49, further comprising applying at least one coating to the frameless vent panel for enhancing at least one performance attribute of the frameless vent panel.
0. 64. The method of claim 63, wherein the coating comprises at least one or more of a mildew inhibitor, a corrosion inhibitor, and a flame retardant.
|
of from 0.002 inch to 0.05 inch, but are not limited to this range. For applications where a more rugged dielectric honeycomb substrate 52 is required, a higher density dielectric honeycomb substrate 52 or a different honeycomb geometry can be selected.
To manufacture a vent panel according to the invention, in one embodiment referring now to
Next, the dielectric honeycomb substrate 52 can be shaped into any desired configuration (step 62). For example, a planar dielectric substrate 52 can be configured in any desired planar shape, such as a square, a rectangle, a circle, etc., having predetermined dimensions to conform to an intended aperture. Such overall shaping can be performed during the manufacturing stage of the substrate 52, for example by selectively altering the shape of a mold, or extruder. The shaping can also be performed post-manufacturing. For example, the substrate 52 can be cut using a knife, a saw, shears, a laser, or a die. Additionally, certain dielectric substrates, such as polymers, lend themselves to a variety of machining techniques. For example, a dielectric honeycomb substrate 52 can be machined to shape one or more of its edges along its perimeter to include a bevel, or a rabbet. Still further, the dielectric substrate 52 can be shaped to include a convex or concave surface or indentation over a portion of either or both of its planar surfaces. Such a planar surface deformation may be desired, to accommodate a mechanical fit.
In order to provide EMI shielding, a conductive layer 54 is applied to the dielectric honeycomb substrate 52, resulting in the metallized dielectric honeycomb filter 50. In one method, a first conductive layer is applied to the dielectric honeycomb substrate 52 (step 64). The first conductive layer can be applied using a variety of techniques known to those skilled in the art, such as electroless plating or physical vapor deposition. See, for example, U.S. Pat. No. 5,275,861 issued to Vaughn and U.S. Pat. No. 5,489,489 issued to Swirbel et al., the disclosures of which are herein incorporated by reference in their entirety. For example, a conductor, such as copper, can be applied using an electroless bath as taught by Vaughn.
The electroless bath method is particularly well suited for a class of polymers known as plateable plastics. This class of plastics includes acrylonitrile-butadiene-styrene (ABS) and polycarbonates, along with other polymer compounds, such as polysulfones, polyamides, polypropylenes, polyethylene, and polyvinyl chloride (PVC). Generally, the dielectric honeycomb substrate 52 should be pretreated to remove any impurities (e.g., dirt, and oil). Depending on the type of material, the substrate 52 may be treated still further to enhance its adhesion properties with the initial conductive layer. For example, the surface can be abraded by mechanical means (e.g., sanding or sandblasting) or by a chemical means (e.g., by using a solvent for softening or an acid for etching). A chemical pretreatment can also be added to alter the chemistry of the surface, further enhancing its ability to chemically bond to the first layer.
Other methods of applying the first conductive layer include applying a conductive paint, such as a lacquer or shellac impregnated with particulate conductors, such as copper, silver, or bronze. Still other methods of applying the first conductive layer include physical deposition, such as evaporation, non-thermal vaporization process (e.g., sputtering), and chemical vapor deposition. Sputtering techniques include radio-frequency (RF) diode, direct-current (DC) diode, triode, and magnetron sputtering. Physical vapor deposition includes such techniques as vacuum deposition, reactive evaporation, and gas evaporation.
Depending on the desired thickness and/or coverage, the step of applying the first conductive layer can be optionally repeated (step 66), such that one or more additional conductive layers, being made of substantially the same conductor, are applied to the previously-treated substrate 52, thereby increasing the thickness of the layer. In repeating the application of the conducting layer, generally the same method of plating can be used; however, a different method can also be used.
Generally, any conductive material can be used for the conductive layer 54. Some examples of metals that can be used for the conductive layer 54 are copper, nickel, tin, aluminum, silver, graphite, bronze, gold, lead, palladium, cadmium, zinc and combinations or alloys thereof, such as lead-tin and gold-palladium. The conductive layer 54 can also be applied directly as a conductive compound. For example, the substrate 52 can be treated with a single electroless bath having both copper and nickel. The resulting conductive layer 54 is a compound of both copper and nickel.
Optionally, more than one type of conductive layer can be applied to the honeycomb substrate 52 (step 68). For example, after the initial conductive layer 54 has been applied, one or more additional conductive layers of the same, or different material, can be applied using electroless plating, electrolytic plating, physical vapor deposition, or other methods known to those skilled in the art (step 70). Electrolytic plating would generally be available for applying subsequent conducting layers, as the initial conducting layer would provide the requisite surface conductivity.
In one embodiment, a second conductive layer of nickel is applied over a first conductive layer of copper, the copper providing a relatively high electrical conductivity and the nickel providing a corrosion resistant top coat. As with the initial conductive layer 54, and for similar reasons, the second type of conductive coating can be optionally reapplied until a desired thickness is achieved.
Additional layers of coating or treatment of still other different types of conductive, or even non-conductive materials can be optionally applied to the metallized dielectric honeycomb filter 50 (step 72). For example a fire retardant, a mildew inhibitor, or an anti-corrosion treatment can be applied to the metallized dielectric honeycomb filter 50. These coatings can be selectively applied either covering the entire surface, or any portion thereof. For example, the metallized dielectric honeycomb filter 50 can be completely immersed in a fire retardant, or selectively treated with a corrosion inhibitor, using a masking technique such that a perimeter of the filter 50 remains untreated, thereby avoiding any reduction in the quality of the achievable electrical contact.
Further, the metallized, treated filter 50 can again be shaped, as required, by any of the previously disclosed techniques (step 74). Also, an edge treatment can be optionally applied to the perimeter or mounting surface of the filter 50 (step 76). Particular edge treatments include commercially available EMI gaskets, including metallized spring fingers, conductive fabrics, conductive elastomers, wire mesh, conductive foam, and conductive fabric coated elastomers.
In order to provide improved airflow, reduce costs, and simplify manufacture, the metallized dielectric substrate 50, referring again to
The cylindrical tubes 55 that make up the cells 53 of the metallized dielectric honeycomb filter 50, shown in
The cells 53 can be cut along their diameter, leaving an approximately semicircular cell portion, as shown. Alternatively, the cells 53 can be cut leaving either a greater or lesser amount of the cell wall to form a spring.
In yet other embodiments, shown in
In other embodiments, shown in
In yet another embodiment, in a slim frame configuration, shown in
In yet further embodiments, the band frame 96 may be constructed from any conductive material that maintains maximum air flow area through the dielectric honeycomb filter 50, but in addition to being electrically conductive, can also help to accommodate variations in dimensional tolerances during insertion of the dielectric honeycomb filter 50 into the cabinet 20. Dimensional tolerances between the dielectric honeycomb filter 50 and the enclosure 20 can be accommodated, for example, by using conductive foam, conductive fabric, or conductive fabric wrapped foam for the band material. These band materials create good electrical contact just like a metal band, but unlike a metal band, these band materials have a much lower compression force and are more compliant allowing them to readily accommodate tolerance variations between the metallized dielectric honeycomb filter 50 and the cabinet 20. Conductive fabric wrapped foams and conductive foams can be obtained from Laird Technologies, Inc., located in Delaware Water Gap, Pa.
In one embodiment, illustrated in
As readily understood by those skilled in the art, many different configurations can be used to contain the metallized dielectric honeycomb filter 50 in the enclosure 20.
The metallized dielectric honeycomb filter 50 provides improved airflow while meeting stringent flammability standards. Once One such flammability standard is the UL94 Vertical Flame Test, described in detail in Underwriter Laboratories Standard 94 entitled “Tests for Flammability of Plastic Materials for Parts in Devices and Appliances,” 5th Edition, 1996, the disclosure of which is incorporated herein by reference in its entirety. The metallized dielectric vent panels 50 according to the invention are able to achieve V0 flame rating, as well as V1 and V2 vertical ratings described in the standard.
EMI shielding effectiveness and airflow test data for a metallized dielectric honeycomb filter in accordance with certain embodiments of the invention are shown respectively in
The filters tested for airflow effectiveness are the standard aluminum honeycomb and two different polycarbonate polymer honeycombs with a plating of nickel over copper in accordance with the invention. The test panels were about 0.5 inch thick with a cell size of about 0.125 inch. One of the dielectric honeycomb panels had a density of about 4 lb/ft3 and the other dielectric honeycomb panel had a density of about 10 lb/ft3.
Accordingly, vent panels produced in accordance with the invention can yield significantly improved shielding effectiveness for the same airflow characteristics as conventional metal vent panels.
Variations, modifications, and other implementations of what is described herein will occur to those of ordinary skill in the art without departing from the spirit and the scope of the invention as claimed. The various features and configurations shown and equivalents thereof can be used in various combinations and permutations. Accordingly, the invention is to be defined not by the preceding illustrative descriptions, but instead by the following claims.
van Haaster, Philip, Lambert, Michael R., McFadden, Jeff
Patent | Priority | Assignee | Title |
8961280, | Nov 04 2004 | International Business Machines Corporation | Method of manufacturing a venting device for tamper resistant electronic modules |
9173331, | Nov 20 2012 | LENOVO INTERNATIONAL LIMITED | Variable thickness EMI shield with variable cooling channel size |
9173333, | Jan 25 2013 | Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC | Shielding structures including frequency selective surfaces |
9307631, | Jan 25 2013 | Laird Technologies, Inc. | Cavity resonance reduction and/or shielding structures including frequency selective surfaces |
9622338, | Jan 25 2013 | Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC | Frequency selective structures for EMI mitigation |
D728773, | May 08 2012 | LAIRD TECHNOLOGIES, INC | Vent panel |
Patent | Priority | Assignee | Title |
3231663, | |||
3546359, | |||
3580091, | |||
3580981, | |||
3584134, | |||
3991242, | Oct 30 1973 | Brunswick Corporation | Panel end structure |
4143501, | Oct 30 1973 | Brunswick Corporation | Materable unitary edge member and panel |
4851608, | May 08 1987 | Parker Intangibles LLC | Electromagnetic shielding media and methods for manufacturing the same |
5032689, | Aug 15 1989 | Parker Intangibles LLC | EMI/RFI shielding vent and method of use |
5082734, | Nov 13 1990 | LAIRD TECHNOLOGIES, INC | Catalytic, water-soluble polymeric films for metal coatings |
5217556, | May 31 1990 | Hexcel Corporation | Continuous process for the preparation of unitary thermoplastic honeycomb containing areas with different physical properties |
5275861, | Dec 21 1989 | LAIRD TECHNOLOGIES, INC | Radiation shielding fabric |
5489489, | Jul 21 1994 | Motorola, Inc. | Substrate having an optically transparent EMI/RFI shield |
5506047, | Oct 23 1991 | W L GORE & ASSOCIATES, INC | Electromagnetic interfernce shielding filter |
5895885, | Mar 20 1997 | Air vent for electromagnetic shielding | |
5910639, | Mar 20 1997 | Air vent panels for electromagnetic shielding | |
6018125, | Nov 15 1996 | Hewlett Packard Enterprise Development LP | High frequency EMI shield with air flow for electronic device enclosure |
6063152, | Feb 19 1997 | VERTIV ENERGY SYSTEMS, INC | Tuned electromagnetic interference air filter |
6171357, | Jan 04 1999 | ECI Telecom Ltd | Air filter |
6211458, | Feb 17 1998 | Parker Intangibles LLC | EMI shielded vent panel and method |
6252161, | Nov 22 1999 | Dell USA, L.P. | EMI shielding ventilation structure |
6297446, | Feb 26 1999 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | High performance EMC vent panel |
6426459, | Aug 17 1999 | Parker Intangibles LLC | EMI shielding vent panel for high volume applications |
6610922, | Dec 20 2001 | Cisco Technology, Inc. | Apparatus for securing an electromagnetic shield in a conductive casing |
6646197, | May 02 2000 | Nortel Networks Limited | High performance EMI shield for electronic equipment |
7338547, | Oct 02 2003 | LAIRD TECHNOLOGIES, INC | EMI-absorbing air filter |
20020046849, | |||
20030085050, | |||
20040174676, | |||
20060150599, | |||
20070095567, | |||
EP843512, | |||
EP883978, | |||
EP1452080, | |||
EP1799023, | |||
JP10256777, | |||
JP2001503915, | |||
JP8064988, | |||
JP8162794, | |||
JP8264990, | |||
WO113695, | |||
WO2004032580, | |||
WO9732459, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 27 2003 | LAMBERT, MICHAEL | LAIRD TECHNOLOGIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022239 | /0942 | |
May 27 2003 | MCFADDEN, JEFF | LAIRD TECHNOLOGIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022239 | /0942 | |
May 27 2003 | VAN HAASTER, PHILIP | LAIRD TECHNOLOGIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022239 | /0942 | |
Nov 10 2008 | Laird Technologies, Inc. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Jul 25 2011 | ASPN: Payor Number Assigned. |
Aug 22 2012 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Oct 28 2016 | REM: Maintenance Fee Reminder Mailed. |
Mar 22 2017 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Jul 05 2014 | 4 years fee payment window open |
Jan 05 2015 | 6 months grace period start (w surcharge) |
Jul 05 2015 | patent expiry (for year 4) |
Jul 05 2017 | 2 years to revive unintentionally abandoned end. (for year 4) |
Jul 05 2018 | 8 years fee payment window open |
Jan 05 2019 | 6 months grace period start (w surcharge) |
Jul 05 2019 | patent expiry (for year 8) |
Jul 05 2021 | 2 years to revive unintentionally abandoned end. (for year 8) |
Jul 05 2022 | 12 years fee payment window open |
Jan 05 2023 | 6 months grace period start (w surcharge) |
Jul 05 2023 | patent expiry (for year 12) |
Jul 05 2025 | 2 years to revive unintentionally abandoned end. (for year 12) |