A three-dimensional profile inspecting apparatus includes at least two optical inspecting apparatuses and a tilt angle adjusting mechanism. The tilt angle adjusting mechanism is equipped with the at least two optical inspecting apparatuses so as to adjust the tilt angles of the at least two optical inspecting apparatuses. When the tilt angles of the optical inspecting apparatuses are changed, the focuses of the optical inspecting apparatuses remain at a single position and a subject to be inspected is within the fields of view of the optical inspecting apparatuses. The three-dimensional profile of the subject can be obtained by building the images collected by the two optical inspecting apparatuses.
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1. A three-dimensional profile inspecting apparatus comprising:
at least a pair of optical-inspecting apparatuses; and
a tilt angle adjustment mechanism having said at least a pair of optical-inspecting apparatuses, said tilt angle adjustment mechanism configured to adjust tilt angles of said at least a pair of optical-inspecting apparatuses, wherein said at least a pair of optical-inspecting apparatuses maintain focus on a single position and a subject to be inspected is within fields-of-view of said at least a pair of optical-inspecting apparatuses when said at least a pair of optical-inspecting apparatuses change the tilt angle, said tilt angle adjustment mechanism being a circular rail.
2. The three-dimensional profile inspecting apparatus of
3. The three-dimensional profile inspecting apparatus of
4. The three-dimensional profile inspecting apparatus of
5. The three-dimensional profile inspecting apparatus of
a direction angle adjustment mechanism suitable for adjusting a direction angle of the subject.
6. The three-dimensional profile inspecting apparatus of
7. The three-dimensional profile inspecting apparatus of
8. The three-dimensional profile inspecting apparatus of
9. The three-dimensional profile inspecting apparatus of
10. The three-dimensional profile inspecting apparatus of
11. The three-dimensional profile inspecting apparatus of
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Not applicable.
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Not applicable.
1. Field of the Invention
The present invention relates to an optical inspecting apparatus, and more specifically, to a three-dimensional profile inspecting apparatus.
2. Description of Related Art Including Information Disclosed Under 37 CFR 1.97 and 37 CFR 1.98.
Accurate profile inspection is an important modern technology. With recent downsizing of many devices, accurate and reliable inspection technology is needed to measure dimensions and profiles of miniature structures so as to control quality and process. An optical non-contact detection technology capable of obtaining exact profile information of a subject in a non-destructive manner is required for a wide variety of applications.
Referring to
Taiwan Pat. No. 1229186 uses a linear scanning apparatus with dual view angles equipped with an inclined light source to detect approximate shapes and dimensions of a defect. The main advantages of such design include the capability to quickly inspect large areas and judge whether the defect is a protrusion or a recess. However, the apparatus cannot precisely measure the three-dimensional profile of a miniature structure, and cannot resolve the problem of difficulty in capturing the surface signal if the slope of the profile of the subject is large.
U.S. Pat. No. 6,449,048 uses an interferometer to scan the sample surface laterally with respect to the optical axis of the interferometer objective at a tilt angle, which allows the sample surface not exceed the maximum coherence plane of the interferometer. Thereby, a traditional vertical scanning interferometer (VSI) can be used to laterally scan the surface of the subject and the profile of the subject can be obtained without using image stitching technology. However, due to the limitation of the angle of the maximum coherence plane for the chosen objective, this method also cannot resolve the problem where the profile cannot be captured if the slope of the sample surface is larger than the angle of the maximum coherence plane of the interferometer. Furthermore, according to the nature of the lateral scanning at single axis, the profile of the sample surface should all be located within the maximum coherence plane along the longitudinal direction with respect to the optical axis of the interferometer objective, otherwise the complete profile cannot be obtained completely.
QED Technology™ developed a method of tilting and rotating the subject to obtain the profile of a subject with a large surface of a large slope. However, this method is restricted to the applications with small subjects, and cannot be used for large subjects that cannot be tilted.
The present invention provides advanced detection and verification technology for gathering profiles of miniature structures, nano-analysis with large stroke and high speed measurement of sophisticated machines relating to advanced machining, pressing, grinding, and nano-processing. The present invention proposes a three-dimensional profile inspecting apparatus capable of effectively resolving the problem where the profile of a subject cannot be captured if the slope of the profile of the subject to be inspected is large, because the reflected light of the subject surface does not enter a microscope. Both simple and complex miniature structures, including nano-applications, can be inspected according to the present invention.
According to an embodiment of the present invention, a three-dimensional profile inspecting apparatus includes at least two optical inspecting apparatuses and a tilt angle adjustment mechanism. The tilt angle adjustment mechanism is equipped with the optical inspecting apparatuses to adjust the tilt angles of the optical inspecting apparatuses. When the tilt angles of the optical inspecting apparatuses are changed, the optical inspecting apparatuses maintain focuses on one a single or particular position (point) or plane, and the subject is placed within the fields of view of the optical inspecting apparatus. The three-dimensional profile of the subject is obtained by building the captured images of multiple optical inspecting apparatuses.
The embodiments will be explained with the appended drawings to clearly disclose the technical characteristics of the three dimensional profile inspecting apparatus of the present invention.
As shown in
The tilt angles of the optical inspecting apparatuses 21 and 22 can be adjusted according to the route of the circular rail 23, i.e., the circular rail 23 is viewed as a tilt angle adjustment mechanism. The center of the circle formed by circular rail 23 is the focal point of the optical inspecting apparatuses 21 and 22, and therefore the optical inspecting apparatuses 21 and 22 remain focused on a single position or the same position (same point or focus plane) as the tilt angles of the optical inspecting apparatuses 21 and 22 are changed. In order to place the subject 26 to be inspected within the fields of view of the optical inspecting apparatuses 21 and 22 or to obtain images from multiple angles, a rotation stage 27 for a subject 26 and a moving stage 28 may be further introduced to assist in obtaining the images.
The optical inspecting apparatuses 21 and 22 gather images after tilting. The tilt angles are determined by the surface slope of the subject 26. The captured images are combined by software to build the profile of the subject 26. Moreover, the profile complex can be considered to determine whether additional rotation stage 27 and moving stage 28 for the subject 26 need to be added, so as to change the view angles or inspect positions in obtaining three-dimensional profile images from multiple angles.
An embodiment of the above three-dimensional profile inspecting apparatus 20 is shown in
In practice, the present invention is not restricted to the above embodiments. The circular rail can be replaced with another tilt angle adjustment mechanism such as a connection-rod mechanism, an X-Y planar moving stage or a rotation stage. The optical inspecting apparatuses 21 and 22 may be optical microscopes, non-optical microscopes and interferometers.
In summary, the concept of the present invention is shown in
While inspecting complex curved surfaces or cone structures, the complex miniature structures may not be inspected by the two optical inspecting apparatuses and the tilt angle adjustment mechanism, and a direction angle adjustment mechanism for the subject to be inspected is further needed. Referring to
The optical inspecting apparatuses of tilt-type of the present invention can obtain data of a profile with a large slope, and can be used for a subject that is not easily tilted. Moreover, the optical inspecting apparatuses can be adjusted to any desired angle by the tilt angle adjustment mechanism to obtain images of the subject and build the three-dimensional profile, and can inspect profile dimensions of miniature structures and subjects with large surfaces.
The apparatus of the present invention can be applied to roller mold machines used for backlight units of the panel display industry. In such applications, the accuracy of the finished subject can be inspected while the subjects are still in the machines, so the subjects do not need to be unloaded for inspection and reloaded for further processing if the accuracy is not acceptable. Eliminating such unload/reload procedures reduces process time and increases efficiency.
Also, the apparatus of the present invention can be applied to the semiconductor industry, panel display industry, miniature structure inspection for optical device industry and profile inspection of optical devices. The present invention can be used for the frame of microscopes to inspect the three-dimensional profiles of the miniature structures of a subject to be inspected, and particularly can overcome the inspection problems of subject surfaces with large slopes. Moreover, the inspecting apparatus of the present invention can inspect subjects with large surfaces such as non-spherical lenses, so as to ensure product quality and increase process efficiency.
The above-described embodiments of the present invention are intended to be illustrative only. Numerous alternative embodiments may be devised by those skilled in the art without departing from the scope of the following claims.
Wang, Wei Cheng, Kuo, Shih Hsuan, Chen, Jin Liang
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
4185298, | Aug 13 1975 | Compagnie Industrielle des Telecommunications Cit-Alcatel S.A. | Process and apparatus for the automatic inspection of patterns |
4739175, | Feb 24 1986 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for inspecting configuration of terminal legs of an electronic device |
5583948, | Oct 18 1993 | Sumitomo Wiring Systems, Ltd | Connecting element inspecting method and connecting element inspecting device |
5638461, | Jun 09 1994 | Kollmorgen Instrument Corporation | Stereoscopic electro-optical system for automated inspection and/or alignment of imaging devices on a production assembly line |
5691764, | Aug 05 1994 | Tokyo Electron Limited | Apparatus for examining target objects such as LCD panels |
5852298, | Mar 30 1995 | Ebara Corporation; Yotaro, Hatamura | Micro-processing apparatus and method therefor |
6373520, | Apr 14 2000 | PHILIP MORRIS USA INC | System and method for visually inspecting a cigarette packaging process |
6449048, | May 11 2000 | Bruker Nano Inc | Lateral-scanning interferometer with tilted optical axis |
6525810, | Nov 11 1999 | IMAGEXPERT, INC | Non-contact vision based inspection system for flat specular parts |
6954274, | Mar 30 2001 | Renesas Electronics Corporation | Method of inspecting semiconductor integrated circuit which can quickly measure a cubic body |
6987561, | Apr 24 2002 | Analog Devices, Inc | System and apparatus for testing a micromachined optical device |
7619190, | Sep 21 2007 | Industrial Technology Research Institute | Tilting adjustable surface profilometer |
7719672, | Dec 10 2007 | International Business Machines Corporation | Macro inspection apparatus and microscopic inspection method |
20050025353, | |||
JP2007309718, | |||
JP9311021, | |||
TW1229186, | |||
TW200617805, | |||
TW339878, |
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Apr 23 2009 | CHEN, JIN LIANG | Industrial Technology Research Institute | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029419 | /0773 | |
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