The present invention relates to a method for making a hexagonal boron nitride slurry and the resulting slurry. The method involves mixing from about 0.5 wt. % to about 5 wt. % surfactant with about 30 wt. % to about 50 wt. % hexagonal boron nitride powder in a medium under conditions effective to produce a hexagonal boron nitride slurry. The present invention also relates to a method for making a spherical boron nitride powder and a method for making a hexagonal boron nitride paste using a hexagonal boron nitride slurry. Another aspect of the present invention relates to a hexagonal boron nitride paste including from about 60 wt. % to about 80 wt. % solid hexagonal boron nitride. Yet another aspect of the present invention relates to a spherical boron nitride powder, a polymer blend including a polymer and the spherical hexagonal boron nitride powder, and a system including such a polymer blend.
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0. 59. A polymer blend comprising:
a polymer; and
a power phase comprising sintered spherical agglomerates of boron nitride.
0. 57. A spherical boron nitride powder comprising sintered spherical agglomerates of hexagonal boron nitride platelets having a crystallization index of at least 0.12.
9. A spherical boron nitride powder comprising sintered spherical agglomerates of boron nitride platelets having an average agglomerate diameter of from about 10 microns to about 500 microns.
0. 55. A spherical boron nitride powder comprising sintered spherical agglomerates of boron nitride platelets having an average agglomerate diameter of from about 30 microns to about 125 microns.
0. 37. A polymer blend comprising:
a polymer; and
a powder phase comprising sintered spherical agglomerates of boron nitride having an average diameter of from about 10 microns to about 500 microns.
0. 56. A polymer blend comprising:
a polymer; and
a powder phase comprising sintered spherical agglomerates of boron nitride having an average diameter of from about 30 microns to about 125 microns.
0. 44. A spherical boron nitride powder comprising sintered spherical agglomerates of boron nitride platelets, wherein the spherical agglomerates have been sintered at a temperature of at least about 1800° C.
0. 50. A polymer blend comprising:
a polymer; and
a powder phase comprising sintered spherical agglomerates of boron nitride, wherein the spherical agglomerates have been sintered at a temperature of at least about 1800° C.
1. A method for making spherical boron nitride powder comprising:
providing a hexagonal boron nitride slurry;
spray drying the slurry under conditions effective to produce spherical boron nitride powder comprising spherical agglomerates of boron nitride platelets; and
sintering the spherical boron nitride powder.
2. The method according to
3. The method according to
4. The method according to
5. The method according to
6. The method according to
7. The method according to
classifying the spherical boron nitride powder under conditions effective to obtain a desired agglomerate size distribution.
8. The method according to
10. The spherical boron nitride powder according to
11. The spherical boron nitride powder according to
0. 12. The spherical boron nitride powder according to
0. 13. A method for making a hexagonal boron nitride paste comprising:
providing a hexagonal boron nitride slurry and
treating the slurry under conditions effective to produce a hexagonal boron nitride paste comprising from about 60 wt. % to about 80 wt. % solid hexagonal boron nitride.
0. 14. The method according to
0. 15. The method according to
0. 16. The method according to
0. 17. A hexagonal boron nitride paste comprising from about 60 wt. % to about 80 wt. % solid hexagonal boron nitride in a medium.
0. 18. The hexagonal boron nitride paste according to
0. 19. The hexagonal boron nitride paste according to
0. 20. A polymer blend comprising:
a polymer, and
a powder phase comprising spherical agglomerates of hexagonal boron nitride platelets, wherein the powder phase is distributed homogeneously within the polymer.
0. 21. The polymer blend according to
0. 22. The polymer blend according to
0. 23. The polymer blend according to
0. 24. The polymer blend according to
0. 25. The polymer blend according to
0. 26. The polymer blend according to
0. 27. A system comprising:
a heat source;
a heat sink; and
a thermally conductive material connecting the heat source to the heat sink, wherein the thermally conductive material comprises a powder phase comprising spherical agglomerates of hexagonal boron nitride platelets.
0. 28. The system according to
0. 29. The system according to
0. 30. The system according to
0. 31. The system according to
0. 32. The system according to
0. 33. The system according to
0. 34. The system according to
0. 35. The system according to
0. 36. The system according to
0. 38. The polymer blend according to claim 37, wherein the sintered spherical agglomerates of boron nitride have an average agglomerate diameter of from about 150 microns to about 500 microns.
0. 39. The polymer blend according to claims 37 or 50 or 59, wherein the polymer is selected from the group consisting of melt-processable polymers, polyesters, phenolics, silicone polymers, acrylics, waxes, thermoplastic polymers, low molecular weight fluids, and epoxy molding compounds.
0. 40. The polymer blend according to claims 37 or 50 or 59, wherein the polymer blend comprises from about 30 wt. % to about 80 wt. % of the powder phase.
0. 41. The polymer blend according to claim 40, wherein the polymer blend comprises from about 50 wt. % to about 80 wt. % of the powder phase.
0. 42. The polymer blend according to claims 37 or 50 or 59, wherein the polymer blend has a thermal conductivity of from about 1 W/mK to about 15 W/mK.
0. 43. The method according to claim 2, wherein the hexagonal boron nitride slurry comprises from about 40 wt. % to about 50 wt. % hexagonal boron nitride powder.
0. 45. The spherical boron nitride powder according to claim 44, wherein the spherical agglomerates have been sintered at a temperature of from about 2000° C. to about 2400° C.
0. 46. The spherical boron nitride powder according to claim 44, wherein the spherical boron nitride powder has a tap density of about 0.4 g/cc to about 0.7 g/cc.
0. 47. The spherical boron nitride powder according to claim 44, wherein the spherical agglomerates of boron nitride platelets have an average agglomerate diameter of from about 10 microns to about 500 microns.
0. 48. The spherical boron nitride powder according to claim 47, wherein a majority of boron nitride agglomerates have an average diameter of from about 30 microns to about 150 microns.
0. 49. The spherical boron nitride powder according to claim 44, wherein the spherical agglomerates of boron nitride platelets have an average agglomerate diameter of from about 150 microns to about 500 microns.
0. 51. The polymer blend according to claim 50, wherein the spherical agglomerates have been sintered at a temperature of from about 2000° C. to about 2400° C.
0. 52. The polymer blend according to claim 50, wherein a majority of boron nitride agglomerates have an average agglomerate diameter of from about 10 microns to about 500 microns.
0. 53. The polymer blend according to claim 52, wherein a majority of boron nitride agglomerates have an average diameter of from about 30 microns to about 150 microns.
0. 54. The polymer blend according to claim 50, wherein the spherical agglomerates of boron nitride platelets have an average agglomerate diameter of from about 150 microns to about 500 microns.
0. 58. The spherical boron nitride powder according to claim 57, wherein the spherical boron nitride powder has a tap density of about 0.4 g/cc to about 0.7 g/cc.
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and inlet and outlet temperatures had to be increased. Along with these changes, the flow rate of the slurry was slowed down and the revolutions per minute (rpm) of the atomizer increased. In addition, 4 wt. % glycerol was added into the slurry before spray drying if it was going to be used for dry pressing applications. During spray drying, the slurry was constantly mixed.
The inlet temperature was set to 235° C. which gave an outlet temperature of 85° C. The flow rate of the slurry was 60 ml/minute and the atomizer (Pentronix, Detroit, Mich.) was set at 12,500 rpm. These settings generally produced spherical BN powder in the size range of −150 μm/+30 μm. The lower end of the scale was quite variable depending on the dust collector damper setting. The powder collected had a moisture content of approximately 0.25-0.5%.
The slurry example outlined above required about 70 minutes to put through the spray dryer under these conditions. The powder yield was about 80% after screening out coarse particles, accounting for wall material, and material collected in the cyclone.
All of the conditions above are only valid for the spray dryer used in the present Example. Minor changes would be needed for work in any other system, which is expected. Larger dryers would allow more flexibility in particle size distribution and higher production rates.
The effect of wt. % boron nitride solids slurry loading on spray dried properties was then tested, as shown in Table 2.
TABLE 2
Effect of wt. % BN solids slurry loading on spray dried properties.
Tap
Solids
LPD
Density
Flow
Sizing
Powder
(wt. %)
(g/cc)
(g/cc)
(sec)
(mm)
A
25
0.462
0.55
55.7
−150/+75
B
25
0.492
0.586
57.4
−75
C
25
n/a
0.541
−45
D
50
0.533
0.62
54
−75
E
50
0.574
0.652
43.2
−150
XP
n/a
0.44
0.562
75.3
−105/+74
Powders B and D, which were screened to the same size, showed that as solids loading increased, the density of the resulting spray dried powder increased.
Slurry from Example 1 was poured into a plaster slip cast mold. Pressure was applied and the set-up left to cast on the order of 12 hours. Because the molds were “blinded” so quickly, casting stopped and no more moisture was removed from the slip. The resultant material was a thick pasty material. The solids content was 76%.
Slurry from Example 1 was poured into a Buchner Funnel with filter paper. A vacuum was pulled on the slurry from below. The water from the system flowed into a graduated flask. When the desired amount of water was removed from the slurry, the vacuum was removed. The BN paste sample, which had a solids content of 74%, was collected and sealed in an airtight bag for later use.
Although preferred embodiments have been depicted and described herein, it will be apparent to those skilled in the relevant art that various modifications, additions, substitutions and the like can be made without departing from the spirit of the invention and these are therefore considered to be within the scope of the invention as defined in the following claims.
Clere, Thomas M., Pujari, Vimal K., Collins, William T., Kutsch, Jeffrey J., Pruss, Eugene A.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
2991508, | |||
3125547, | |||
3351690, | |||
3617358, | |||
3720740, | |||
3954483, | Jan 08 1974 | General Electric Company | Dense polycrystalline silicon carbide |
4097293, | Apr 30 1969 | Tokyo Shibaura Electric Co., Ltd. | Method for manufacturing heat-resistant reinforced composite materials |
4107276, | Dec 30 1974 | Elektroschmelzwerk Kempten GmbH | Manufacture of hexagonal boron nitride |
4188194, | Oct 29 1976 | General Electric Company | Direct conversion process for making cubic boron nitride from pyrolytic boron nitride |
4195002, | Jul 27 1978 | International Lead Zinc Research Organization, Inc. | Water-dispersible coatings containing boron nitride for steel casting dies |
4394170, | Nov 30 1979 | Nippon Oil and Fats Company, Limited | Composite sintered compact containing high density boron nitride and a method of producing the same |
4412008, | Feb 23 1980 | Nippon Kokan Kabushiki Kaisha; Shinagawa Shiroenga Kabushiki Kaisha | Composite sinter of silicon nitride/boron nitride and method for manufacturing thereof |
4514370, | Nov 25 1981 | Tokyo Shibaura Denki Kabushiki Kaisha; Toshiba Ceramics Co., LTD | Process for preparing silicon nitride powder |
4634640, | Jan 20 1982 | Elektroschmelzwerk Kempten GmbH | Dense shaped articles consisting of polycrystalline hexagonal boron nitride and process for their manufacture by isostatic hot-pressing |
4642298, | Mar 15 1984 | Tokuyama Soda Kabushiki Kaisha | Composite nitride sintered body |
4731311, | Oct 09 1985 | Mitsubishi Kasei Corporation | Electrically conductive material and secondary battery using the electrically conductive material |
4784978, | Jun 07 1984 | Kawasaki Steel Corporation; Kawasaki Refractories Co. Inc. | Hexagonal boron nitride powder having excellent sinterability and a method for the preparation thereof |
4801445, | Jul 29 1985 | Shiseido Company Ltd; SHEISEIDO COMPANY LTD | Cosmetic compositions containing modified powder or particulate material |
4863881, | Sep 15 1988 | CALIFORNIA INSTITUTE OF TECHNOLOGY, 1201 EAST CALIFORNIA BLVD , PASADENA, CA 91125 A CORP OF CA | Shock consolidation of cubic boron nitride with whiskers of silicon compounds |
4869954, | Sep 10 1987 | Parker Intangibles LLC | Thermally conductive materials |
4882225, | Jul 29 1985 | Shiseido Company Ltd. | Modified powder or particulate material |
4927587, | Feb 29 1988 | Shin-Etsu Chemical Co., Ltd. | Method for manufacturing extrusion molded silicone insulating articles |
4971779, | Feb 17 1989 | University of New Mexico | Process for the pyrolytic conversion of a polymeric precursor composition to boron nitride |
4997633, | Apr 30 1987 | Kawasaki Steel Corporation | Water-soluble boron containing impurity reduced hexagonally crystalline boron nitride |
5001091, | Jan 27 1986 | NORTON COMPANY, WORCESTER, MA A CORP OF MA | Readily moldable or castable ceramic powders |
5011870, | Feb 08 1989 | Dow Corning Corporation; DOW CORNING CORPORATION, A MI CORP | Thermally conductive organosiloxane compositions |
5039435, | Jan 13 1989 | Hanano Commercial Co., Ltd. | Die-casting powdery mold releasing agent |
5063184, | Apr 01 1987 | Agency of Industrial Science and Technology; Denki Kagaku Kogyo Kabushiki Kaisha | Pressureless sintered body of boron nitride |
5064589, | Dec 29 1989 | Showa Denko K.K. | Method for producing high density hexagonal boron nitride sintered article |
5098609, | Nov 03 1989 | The Research Foundation of State Univ. of N.Y. | Stable high solids, high thermal conductivity pastes |
5116589, | Jun 18 1990 | The United States of America as represented by the United States | High density hexagonal boron nitride prepared by hot isostatic pressing in refractory metal containers |
5120688, | May 29 1990 | MORGAN CRUCIBLE COMPANY PLC, THE | Pressureless sintered silicon nitride-boron nitride composite |
5194480, | May 24 1991 | Parker Intangibles LLC | Thermally conductive elastomer |
5213868, | Aug 13 1991 | Parker Intangibles LLC | Thermally conductive interface materials and methods of using the same |
5229339, | Nov 12 1991 | Norton Company | Pressure casting ceramic slurries |
5234712, | Jun 08 1992 | The Dow Chemical Company; DOW CHEMICAL COMPANY, THE | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
5273558, | Aug 30 1991 | Minnesota Mining and Manufacturing Company | Abrasive composition and articles incorporating same |
5283542, | Sep 11 1991 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
5285108, | Jun 21 1991 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Cooling system for integrated circuits |
5298791, | Aug 13 1991 | Parker Intangibles LLC | Thermally conductive electrical assembly |
5308044, | May 12 1987 | Kabushiki Kaisha Kouransha | Boron nitride ceramics and molten metal container provided with members made of the same ceramics |
5312571, | Jan 07 1993 | Norton Company | Shaped bodies and the production thereof |
5320989, | Dec 07 1992 | ZYP COATINGS, INC | Boron nitride-containing bodies and method of making the same |
5332629, | Jan 11 1985 | Sumitomo Electric Industries, Ltd. | Boron nitride system including an hBN starting material with a catalyst and a sintered cNB body having a high heat conductivity based on the catalyst |
5374036, | Oct 27 1992 | Foseco International Limited | Metallurgical pouring vessels |
5409868, | Dec 23 1993 | ELECTROFUEL MANUFACTURING CO , THE | Ceramic articles made of compositions containing borides and nitrides |
5457075, | May 11 1993 | Hitachi Metals, Ltd | Sintered ceramic composite and molten metal contact member produced therefrom |
5466269, | Jul 25 1991 | General Electric Company | Polycrystalline cubic boron nitride abrasive particles and abrasive tools made therefrom |
5466400, | Jan 07 1993 | Norton Company | Process for drip casting silicon nitride slurries |
5508110, | Jan 28 1993 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
5510174, | Jul 14 1993 | Parker Intangibles LLC | Thermally conductive materials containing titanium diboride filler |
5525557, | Jan 07 1993 | Norton Company | High density green bodies |
5528462, | Jun 29 1994 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD ; AVAGO TECHNOLOGIES GENERAL IP PTE LTD | Direct chip connection using demountable flip chip package |
5536485, | Aug 12 1993 | Nisshin Seifun Group Inc | Diamond sinter, high-pressure phase boron nitride sinter, and processes for producing those sinters |
5545473, | Feb 14 1994 | W L GORE & ASSOCIATES, INC | Thermally conductive interface |
5567353, | Apr 13 1995 | Rohm and Haas Company | Method for dispersing ceramic material in an aqueous medium |
5571760, | Aug 27 1993 | Saint-Gobain Norton Industrial Ceramics Corporation | Silicon nitride having a high tensile strength |
5591034, | Feb 14 1994 | W L GORE & ASSOCIATES, INC | Thermally conductive adhesive interface |
5593773, | Jul 23 1992 | Silberline Limited | Metal powder pigment |
5601874, | Dec 08 1994 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
5610203, | Apr 10 1996 | THE CHEMOURS COMPANY FC, LLC | Foamable fluoropolymer composition |
5614319, | May 04 1995 | COMMSCOPE, INC OF NORTH CAROLINA | Insulating composition, insulated plenum cable and methods for making same |
5660917, | Jul 06 1993 | Kabushiki Kaisha Toshiba | Thermal conductivity sheet |
5681883, | Mar 05 1996 | General Electric Company | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
5688449, | Oct 02 1995 | H B FULLER COMPANY | Method of forming and extruding an additive-coated resin composition |
5688457, | Apr 10 1996 | THE CHEMOURS COMPANY FC, LLC | High speed extrusion |
5696041, | May 10 1995 | COORSTEK, INC | High solids silicon nitride aqueous slurries |
5716665, | May 23 1994 | Ausimont S.p.A. | Process for coating an electroconductive material using foamable solid compositions based on perfluoropolymers |
5726502, | Apr 26 1996 | SHENZHEN XINGUODU TECHNOLOGY CO , LTD | Bumped semiconductor device with alignment features and method for making the same |
5738936, | Jun 27 1996 | W L GORE & ASSOCIATES, INC | Thermally conductive polytetrafluoroethylene article |
5759481, | Oct 18 1994 | Saint-Gobain/Norton Industrial Ceramics Corp. | Silicon nitride having a high tensile strength |
5770819, | Feb 13 1995 | Raychem Corporation | Insulated wire or cable having foamed fluoropolymer insulation |
5781412, | Nov 22 1996 | Parker Intangibles LLC | Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
5783308, | Oct 25 1996 | HVL COS , LLC | Ceramic reinforced fluoropolymer |
5849316, | Sep 30 1994 | L'Oreal | Anhydrous and water resistant cosmetic compositions |
5854155, | Jan 24 1996 | Denki Kagaku Kogyo Kabushiki Kaisha | Hexagonal system boron nitride powder |
5898009, | Mar 19 1996 | General Electric Company | High density agglomerated boron nitride particles |
5898217, | Jan 05 1998 | SHENZHEN XINGUODU TECHNOLOGY CO , LTD | Semiconductor device including a substrate having clustered interconnects |
5907474, | Apr 25 1997 | GLOBALFOUNDRIES Inc | Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package |
5908796, | May 01 1998 | COORSTEK, INC | Dense silicon nitride ceramic having fine grained titanium carbide |
5926371, | Apr 25 1997 | GLOBALFOUNDRIES Inc | Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device |
5945217, | Oct 14 1997 | W L GORE & ASSOCIATES, INC | Thermally conductive polytrafluoroethylene article |
5945478, | Apr 10 1996 | THE CHEMOURS COMPANY FC, LLC | High speed extrusion |
5950066, | Jun 14 1996 | Henkel IP & Holding GmbH | Semisolid thermal interface with low flow resistance |
5962122, | Nov 28 1995 | DEUTSCHE BANK AG, NEW YORK BRANCH, AS COLLATERAL AGENT | Liquid crystalline polymer composites having high dielectric constant |
5981641, | Aug 09 1996 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition, heat conductive material and heat conductive silicone grease |
5984055, | Nov 21 1997 | Northrop Grumman Systems Corporation | Integrated fiber reinforced ceramic matrix composite brake pad and back plate |
5985228, | Dec 22 1992 | DIAMOND INNOVATIONS, INC; GE SUPERABRASIVES, INC | Method for controlling the particle size distribution in the production of multicrystalline cubic boron nitride |
6048511, | Mar 19 1996 | General Electric Company | Method for forming high density boron nitride and high density agglomerated boron nitride particles |
6054520, | Aug 04 1997 | SHIN-ETSU CHEMICAL CO , LTD | Heat conductive BN filler and electrically insulating/heat dissipating sheet |
6096671, | Jan 24 1996 | Denki Kagaku Kogyo Kabushiki Kaisha | Method of using hexagonal system boron nitride powder |
6110527, | Jun 17 1991 | General Electric Company | Silicon carbide composite with metal nitride coated fiber reinforcement |
6124579, | Oct 06 1997 | Watlow Electric Manufacturing | Molded polymer composite heater |
6158894, | Jul 28 1999 | COORSTEK, INC | All ceramic bearing |
6162849, | Jan 11 1999 | Ferro Corporation | Thermally conductive thermoplastic |
6168859, | Jan 29 1998 | The Dow Chemical Company | Filler powder comprising a partially coated alumina powder and process to make the filler powder |
6249703, | Jul 08 1994 | Medtronic, Inc | Handheld patient programmer for implantable human tissue stimulator |
6251513, | Nov 08 1997 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
6255376, | Jul 28 1997 | Kyocera Corporation | Thermally conductive compound and semiconductor device using the same |
6284817, | Feb 07 1997 | Loctite Corporation | Conductive, resin-based compositions |
6287489, | Apr 07 1999 | Sandvik Intellectual Property Aktiebolag | Method for making a sintered composite body |
6300607, | Oct 06 1997 | Watlow Electric Manufacturing Company | Molded polymer composite heater |
6319602, | Aug 06 1996 | Otsuka Kagaku Kabushiki Kaisha | Boron nitride and process for preparing the same |
6348179, | May 19 1999 | Science & Technology Corporation @ UNM | Spherical boron nitride process, system and product of manufacture |
6541111, | Aug 06 1996 | Otsuka Kagaku Kabushiki Kaisha | Process for producing boron nitride |
6548152, | Oct 09 1996 | Matsushita Electric Industrial Co., Ltd. | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
6585039, | Feb 01 2000 | TICONA POLYMERS, INC | Composite overmolded heat pipe construction |
6645612, | Aug 07 2001 | Saint-Gobain Ceramics & Plastics, Inc | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
6652822, | May 17 2001 | Triad National Security, LLC | Spherical boron nitride particles and method for preparing them |
6660241, | May 01 2000 | Saint-Gobain Ceramics & Plastics, Inc | Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof |
6676893, | Apr 07 1999 | SANDVIK INTELLECTUAL PROPERTY HB | Porous cubic boron nitride based material suitable for subsequent production of cutting tools and method for its production |
6713088, | Aug 31 1999 | MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC | Low viscosity filler composition of boron nitride particles of spherical geometry and process |
6764975, | Nov 28 2000 | Saint-Gobain Ceramics & Plastics, Inc | Method for making high thermal diffusivity boron nitride powders |
6794435, | May 18 2000 | Saint-Gobain Ceramics & Plastics, Inc | Agglomerated hexagonal boron nitride powders, method of making, and uses thereof |
6824753, | Apr 25 2001 | Science & Technology Corporation @ UNM | Organoboron route and process for preparation of boron nitride |
6867445, | Jul 10 2002 | Samsung Electronics Co., Ltd. | Semiconductor memory devices including different thickness dielectric layers for the cell transistors and refresh transistors thereof |
6951583, | May 01 2000 | Saint-Gobain Ceramics & Plastics, Inc. | Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof |
7189774, | Nov 28 2000 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making high thermal diffusivity boron nitride powders |
7494635, | Aug 21 2003 | Saint-Gobain Ceramics & Plastics, Inc | Boron nitride agglomerated powder |
7557054, | Feb 27 2006 | Kyocera Corporation | Boron carbide sintered body and protective member |
7914886, | Aug 21 2003 | Saint-Gobain Ceramics & Plastics, Inc. | Structural component comprising boron nitride agglomerated powder |
8169767, | Aug 21 2003 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder and devices comprising the powder |
20010004131, | |||
20010021740, | |||
20010048179, | |||
20020004111, | |||
20020006373, | |||
20020006511, | |||
20020155052, | |||
20030038278, | |||
20040041257, | |||
20040077764, | |||
20040208812, | |||
20050041373, | |||
20060121068, | |||
20060127422, | |||
20060228542, | |||
20070041918, | |||
20070205706, | |||
20080076856, | |||
AU9067727, | |||
BR9006359, | |||
CA2031834, | |||
CA2389963, | |||
CN1269273, | |||
CN1834167, | |||
DE279769, | |||
DE2629960, | |||
DE3917726, | |||
DE4013025, | |||
EP279769, | |||
EP396448, | |||
EP432007, | |||
EP479387, | |||
EP717020, | |||
EP896031, | |||
EP939066, | |||
EP982391, | |||
EP1053973, | |||
EP1702907, | |||
FI906048, | |||
FR2655638, | |||
GB1179156, | |||
GB1241206, | |||
GB2301818, | |||
GB870084, | |||
JP10194711, | |||
JP10204300, | |||
JP1065073, | |||
JP11005907, | |||
JP11060215, | |||
JP11116213, | |||
JP11134944, | |||
JP1119564, | |||
JP11209618, | |||
JP1122971, | |||
JP1126661, | |||
JP11277515, | |||
JP1131062, | |||
JP1131065, | |||
JP1131066, | |||
JP1133982, | |||
JP1239066, | |||
JP1275471, | |||
JP154379, | |||
JP2000279796, | |||
JP200034107, | |||
JP2000508259, | |||
JP2001010867, | |||
JP2001172604, | |||
JP2002080617, | |||
JP2002097372, | |||
JP2002198619, | |||
JP2003518185, | |||
JP2005036016, | |||
JP2044067, | |||
JP2055766, | |||
JP2092868, | |||
JP2164433, | |||
JP2590908, | |||
JP2590964, | |||
JP2981002, | |||
JP3012316, | |||
JP3177361, | |||
JP3215364, | |||
JP3290127, | |||
JP4065366, | |||
JP4164805, | |||
JP4321506, | |||
JP5000853, | |||
JP5000854, | |||
JP5078106, | |||
JP5148038, | |||
JP58060679, | |||
JP58060680, | |||
JP61132564, | |||
JP61268763, | |||
JP62123070, | |||
JP6219714, | |||
JP63006093, | |||
JP63040769, | |||
JP63045104, | |||
JP63045178, | |||
JP63117966, | |||
JP6321638, | |||
JP6438424, | |||
JP7041311, | |||
JP7157369, | |||
JP7204492, | |||
JP7315937, | |||
JP8127793, | |||
JP8183906, | |||
JP9151324, | |||
JP9202663, | |||
PT96113, | |||
SU514796, | |||
WO2088234, | |||
WO2005021428, | |||
WO2006023860, | |||
WO9737828, | |||
WO146313, | |||
WO183371, | |||
WO2006117117, |
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