A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.
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9. A method of mounting a cooling device, comprising:
disposing at least one mounting post on a substrate; and
mounting a cooling device on the mounting post at an angle transverse to a plane of the substrate by way of a plurality of connectors at least one connector extending outwardly from the cooling device, wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the substrate.
1. A mounting apparatus for a cooling device, comprising:
a plurality of connectors at least one connector extending outwardly from the cooling device and configured to orient the cooling device at an angle transverse to a substrate; and
at least one mounting post coupled to the plurality of connectors at least one connector and configured to mount the cooling device on the substrate,
wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the substrate.
0. 15. A cooling system for a printed circuit board comprising:
a printed circuit board having a plurality of electronic components mounted thereon, wherein at least one of the plurality of electronic components does not require cooling; and
a cooling device coupled to a plurality of mounting posts, wherein the plurality of mounting posts orient the cooling device at an angle to the printed circuit board and form a region under the cooling device;
wherein the at least one of the plurality of electronic components not requiring cooling is disposed in the region under the cooling device.
14. A method of mounting a cooling device on a printed circuit board comprising:
disposing a plurality of mounting posts on the cooling device to orient the cooling device at an angle relative to the circuit board and forming a region under the cooling device; and
disposing a plurality of electronic components that do not require cooling in the region under the cooling device, wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the circuit board.
0. 17. A cooling system for a circuit board comprising:
a printed circuit board having a plurality of electronic components mounted thereon; and
a cooling device attached to the printed circuit board with an adhesive;
wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air being blown out therefrom;
wherein the cooling device is attached to the printed circuit board such that it is at an angle transverse to the printed circuit board; and
wherein at least one of the plurality of electronic components is encased within the adhesive.
0. 16. A cooling system for a printed circuit board comprising:
a printed circuit board having at least one electronic component mounted thereon; and
at least one through-board clip insertable and mateable with the printed circuit board so as to extend therethrough; and
a cooling device coupled to the at least one through-board clip to secure the cooling device in-place relative to the at least one electronic component, the cooling device comprising an active material that is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air being blown out therefrom;
wherein the through-board clip disposes the cooling device above the at least one electronic component and orients the cooling device at an angle transverse to the printed circuit so as to cool the at least one electronic component.
2. The mounting apparatus of
3. The mounting apparatus of
4. The mounting apparatus of
5. The mounting apparatus of
6. The mounting apparatus of
7. The mounting apparatus of
10. The method of
11. The method of
12. The method of
13. The method of
0. 18. The cooling system of claim 17 wherein the cooling device is a piezoelectric cooling device.
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This application is a divisional application of application Ser. No. 11/761,557, filed Jun. 12, 2007.
The invention relates generally to thermal management systems, and more particularly to thermal management systems for use in microelectronic devices.
Thermal management is becoming an increasingly significant concern in the microelectronics industry. Non-limiting examples of microelectronic devices include printed circuit board computers, programmable logic controllers (PLCs), operator interface computers, laptop computers, cell phones, personal digital assistants (PDAs), and personal pocket computers. Such devices generate waste heat during normal operation that must be dissipated for desirable performance and reliability of microelectronic components in the device.
Several technologies have been employed to remove heat from microelectronic devices. An example includes forced air cooling via conventional cooling fans and heat sinks. Heat sinks conduct thermal energy away from the devices and transfers the thermal energy to air circulated by cooling fans. However, cooling fans use an undesirable amount of energy, create audible noise and have space limitations.
In accordance with an aspect of the invention, a mounting apparatus for a cooling device is provided. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.
In accordance with another aspect of the invention, a method of mounting a cooling device is provided. The method includes disposing at least one mounting post on a substrate. The method also includes mounting a cooling device on the mounting post by way of a plurality of connectors extending outwardly from the cooling device.
In accordance with another aspect of the invention, a method of fabricating a cooling device is provided. The cooling device includes at least one plate defining a chamber, at least one active material on the at least one plate, and a compliant material within the at least one plate and encompassing the chamber, the compliant material having at least one opening facilitating fluid communication between the chamber and an exterior environment. The method includes disposing an active material on the plate, wherein said disposing comprises at least one selected from the group consisting of dispensing the active material via an automated system, condensate or thermally curing a preformed membrane of active material with the plate via an adhesive, ultraviolet light curing a preformed membrane of active material with the plate via an adhesive, and applying a preformed pressure sensitive tape to the plate.
In accordance with another aspect of the invention, a cooling device is provided. The cooling device includes at least one supporting structure, including an inner surface defining a chamber and having a pair of grooves. The supporting structure also includes at least one opening facilitating fluid communication between the chamber and an exterior environment. The cooling device also includes a pair of flexible plates, each said plate being disposed within one of the pair of grooves.
In accordance with another aspect of the invention, a cooling device is provided. The cooling device includes a supporting frame, including an inner surface defining a chamber and at least one opening facilitating fluid communication between the chamber and an exterior environment. The cooling device also includes a pair of suspended jet plates, each suspended jet plate attached to the supporting frame.
In accordance with another aspect of the invention, a cooling device is provided. The cooling device includes a cup shaped supporting structure that has an inner surface defining a chamber, an orientation plate attached to a base and configured to provide angular orientation, and at least one opening facilitating fluid communication between the chamber and an exterior environment. The cooling device also includes a pair of flexible plates, each said plate being attached to the cup shaped supporting structure via an attachment.
In accordance with another aspect of the invention, a modular cooling device is provided. The modular cooling device includes a pair of flexible discs having at least one opening facilitating fluid communication between the chamber and an exterior environment, and a pair of electrical terminals configured to provide a parallel electrical connection to a second cooling device.
In accordance with another aspect of the invention, a method of mounting a cooling device on a printed circuit board is provided. The method includes disposing a plurality of mounting posts on the cooling device to orient the cooling device at an angle relative to the circuit board and forming a region under the cooling device. The method also includes disposing a plurality of electronic components that do not require cooling in the region under the cooling device.
These and other advantages and features will be more readily understood from the following detailed description of preferred embodiments of the invention that is provided in connection with the accompanying drawings.
As discussed in detail below, embodiments of the invention include a system and method for mounting a cooling device and a method of fabricating the cooling device. As used herein, the term ‘cooling device’ refers to a device blowing jet streams into systems such as, but not limited to, a microelectronic assembly and a printed circuit board assembly.
Turning now to the drawings,
Examples of a suitable active material 110 include piezoelectric material, magnetostrictive material (magnetic fields from coils attract/oppose one another), shape-memory alloy, and motor imbalance (motor with a mass imbalance creates oscillatory motion). Within the subset of piezoelectric materials, suitable active materials include bimorph piezoelectric configurations, where two piezo layers are energized out of phase to produce bending; thunder configurations, where one piezo layer is disposed on a pre-stressed stainless steel shim; buzzer element configurations, where one piezo layer is disposed on a brass shim; and MFC configurations, where a piezo fiber composite on a flexible circuit is bonded to a shim. The active material 110 may also incorporate a ceramic material.
In another illustrated embodiment of the invention as described in
The various embodiments of a system and method for mounting a cooling device and a method of fabrication described above thus provide a way to achieve a convenient and efficient means of installing a cooling device into various applications. These techniques and systems also allow for highly efficient microelectronic assemblies due to improved packaging.
Of course, it is to be understood that not necessarily all such objects or advantages described above may be achieved in accordance with any particular embodiment. Thus, for example, those skilled in the art will recognize that the systems and techniques described herein may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein.
Furthermore, the skilled artisan will recognize the interchangeability of various features from different embodiments. For example, the use of a PSA tape to attach an elastomeric material to a plate with respect to one embodiment can be adapted for use with an elastomeric tab connector described with respect to another. Similarly, the various features described, as well as other known equivalents for each feature, can be mixed and matched by one of ordinary skill in this art to construct additional systems and techniques in accordance with principles of this disclosure.
While the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. For example, while embodiments of the invention describe the use of multiple mounting posts for use with a single cooling device, it should be appreciated that a single mounting post with branching mounting arms may be used. Further, although the mounting posts are described as being stiff and unmovable, it should be appreciated that the mounting posts may be stiff but pliable to enable one to tune particular cooling devices to a specific angle relative to the plane in which the substrate exists. Alternatively, the mounting posts may incorporate a mechanism by which the angle for any particular cooling device can be manually indexed. Additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only some of the described embodiments. Accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.
Utturkar, Yogen Vishwas, Arik, Mehmet, Burdick, Jr., William Edward, Weaver, Stanton Earl, Seeley, Charles Erklin, Goray, Kunal Ravindra
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
5427642, | Jan 13 1989 | Matsushita Electric Industrial Co., Ltd. | Method for mounting electronic parts on a printed circuit board by use of an adhesive composition |
6722581, | Oct 24 2001 | General Electric Company | Synthetic jet actuators |
6801430, | May 09 2003 | Intel Corporation | Actuation membrane to reduce an ambient temperature of heat generating device |
7198250, | Sep 18 2000 | Par Technologies, LLC | Piezoelectric actuator and pump using same |
7492592, | Feb 27 2007 | Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. | Heat dissipating apparatus for equipment chassis |
20030024781, | |||
20030218863, | |||
20050199282, | |||
20060196638, | |||
20070029070, | |||
20070119573, | |||
20090086416, | |||
EP1762725, | |||
WO2006114934, |
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