A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
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8. A method of forming a polishing pad, comprising:
providing a polishing layer;
forming a plurality of concave regions in the polishing layer; and
forming a plurality of arc grooves in regions outside the concave regions; and
recovering the concave regions to form a smooth surface in the polishing layer,
wherein each of the plurality of arc grooves has two ends, at least one end thereof has an inclined wall, and an angle between the inclined wall and a surface plane of the polishing layer is less than 90 degrees.
1. A polishing pad, comprising:
a polishing layer; and
a plurality of arc grooves, disposed in the polishing layer and forming a plurality of fan-shaped regions,
wherein the plurality of arc grooves in the same fan-shaped region are concentric arc grooves with unequal radii, and
a radial center of the concentric arc grooves in at least one fan-shaped region does not overlap with a rotational axis of the polishing pad, wherein one or both of the following conditions is satisfied:
(a) the radial center of the concentric arc grooves in at least one fan-shaped region is located inside the polishing layer and spaced apart from an outer circumferential edge of the polishing layer, and
(b) each of the concentric arc grooves in the at least one fan-shaped region has two ends, at least one of the ends located inside the polishing layer and spaced apart from the outer circumferential edge of the polishing layer.
2. The polishing pad according to
4. The polishing pad according to
5. The polishing pad according to
6. The polishing pad according to
7. The polishing pad according to
9. The method of forming the polishing pad according to
providing a sucker device, wherein the sucker device comprises a plurality of recess regions corresponding to the plurality of concave regions; fixing the polishing pad using the sucker device to form the concave regions; and forming the plurality of arc grooves in the regions outside the concave regions.
10. The method of forming the polishing pad according to
providing a sucker device and a gasket, wherein the gasket comprises a plurality of recess regions corresponding to the concave regions; fixing the polishing pad using the sucker device and the gasket to form the plurality of concave regions; and forming the plurality of arc grooves in the regions outside the plurality of concave regions.
11. The method of forming the polishing pad according to
forming a plurality of recess regions corresponding to the plurality of concave regions in a back surface of the polishing pad; providing a sucker device to fix the polishing pad to form the plurality of concave regions; and forming the plurality of arc grooves in the regions outside the plurality of concave regions.
12. The method of forming the polishing pad according to
13. The method of forming the polishing pad according to
14. The method of forming the polishing pad according to
15. The method of forming the polishing pad according to
16. The method of forming the polishing pad according to
17. The method of forming the polishing pad according to
18. The method of forming the polishing pad according to
19. The method of forming the polishing pad according to
20. The method of forming the polishing pad according to
21. The method of forming the polishing pad according to
22. The method of forming the polishing pad according to
23. A method of producing an industrial device comprising:
at least a step of polishing a substrate by using the a polishing pad according to
a polishing layer; and
a plurality of arc grooves, disposed in the polishing layer and forming a plurality of fan-shaped regions,
wherein the plurality of arc grooves in the same fan-shaped region are concentric arc grooves with unequal radii, and
a radial center of the concentric arc grooves in at least one fan-shaped region does not overlap with a rotational axis of the polishing pad, wherein one or both of the following conditions is satisfied:
(a) the radial center of the concentric arc grooves in at least one fan-shaped region is located inside the polishing layer and spaced apart from an outer circumferential edge of the polishing layer, and
(b) each of the concentric arc grooves in the at least one fan-shaped region has two ends, at least one of the ends located inside the polishing layer and spaced apart from the outer circumferential edge of the polishing layer.
0. 24. The polishing pad according to claim 1, wherein shapes of the plurality of arc grooves are selected from the group consisting of circular arcs, elliptical arcs, parabolic arcs, irregular arcs, and combinations thereof.
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This application is a divisional of U.S. application Ser. No. 12/428,231, filed on Apr. 22, 2009, which claims the priority benefit of Taiwan application serial No. 97125981, filed on Jul. 9, 2008, the entireties of which are incorporated herein.
1. Field of the Invention
The present invention relates to a polishing pad, a polishing method and a method of forming a polishing pad. More particularly, the polishing pad can provide a different slurry flow distribution.
2. Description of Related Art
With the progress of the industry, a planarization process is often adopted as a process for manufacturing various devices. A chemical mechanical polishing (CMP) process is often used in the planarization process in the industry. General speaking, the chemical mechanical polishing process supplies slurry having a chemical on the polishing pad, applies a pressure on the substrate to be polished to press it on the polishing pad, and provides a relative motion between the substrate and the polishing pad. Through the mechanical friction generated by the relative motion and the chemical effects of the slurry, a portion of the surface layer of the substrate is removed to make the surface flat and smooth so as to achieve planarization.
As shown in
Therefore, it is needed to provide a polishing pad which can provide a different slurry flow distribution for industry in response to the requirements of various polishing processes.
Accordingly, the present invention provides a polishing pad and a polishing method using the polishing pad. The polishing pad can provide a different slurry flow distribution.
The present invention further provides a forming method of a polishing pad, wherein the formed polishing pad provides a different slurry flow distribution.
The present invention provides a polishing pad and a polishing method using the polishing pad. The polishing pad includes a polishing layer and a plurality of arc grooves. The plurality of arc grooves are disposed in the polishing layer. Each of the plurality of arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall and the surface plane of the polishing layer is less than 90 degrees.
The present invention further provides a polishing pad and a polishing method using the polishing pad. The polishing pad includes a polishing layer, a plurality of arc grooves, and a polishing surface. The plurality of arc grooves are disposed in the polishing layer and surrounding the rotational axis of the polishing pad. The polishing surface is disposed between the arc grooves and including a first polishing region and a second polishing region. The first polishing region is disposed between neighboring two arc grooves in the circumferential direction. The second polishing region is disposed between neighboring two arc grooves in the radial direction. The first polishing region becomes larger gradually as the polishing surface is abraded downward.
The present invention further provides a polishing pad and a polishing method using the polishing pad. The polishing pad includes a polishing layer and a plurality of arc grooves. The plurality of arc grooves are disposed in the polishing layer to form a plurality of fan-shaped regions, wherein the arc grooves in the same fan-shaped region are concentric arc grooves with unequal radii, and the center of the concentric arc grooves in at least one fan-shaped region does not overlap with the rotational axis of the polishing pad.
The present invention provides a method of forming a polishing pad. First, a polishing layer is provided. Thereafter, a plurality of concave regions is formed in the polishing layer. Afterwards, a plurality of arc grooves is formed in regions outside the concave regions.
The polishing pad of the present invention is a polishing pad which can provide a different slurry flow distribution.
In order to make the above and other objects, features and advantages of the present invention more comprehensible, several embodiments accompanied with figures are described in detail below.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
The Seventh Embodiment
FIG. 8 is a schematic top view of a polishing pad according to a seventh embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but with the interposed regions 206a, 206b, 206c, and 206d including at least one of the bent line radial extending grooves 216a, 216b, 216c, and 216d.
The Eighth Embodiment
FIG. 9 is a schematic top view of a polishing pad according to an eighth embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but with the interposed regions 206a, 206b, 206c, and 206d including at least one of the arc radial extending grooves 216a, 216b, 216c, and 216d.
The Ninth Embodiment
FIG. 10 is a schematic top view of a polishing pad according to a ninth embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but with the interposed regions 206a, 206b, 206c, and 206d including at least one of the straight line radial extending grooves 216a, 216b, 216c, and 216d.
The Tenth Embodiment
FIG. 11 is a schematic top view of a polishing pad according to a tenth embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but the arc grooves 208a, 210a, and 212a in the tenth embodiment are elliptical rather than circular.
The Eleventh Embodiment
FIG. 12 is a schematic top view of a polishing pad according to an eleventh embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but the arc grooves 208a, 210a, and 212a in the eleventh embodiment are parabolic rather than circular.
The Twelfth Embodiment
FIG. 13 is a schematic top view of a polishing pad according to a twelfth embodiment of the present invention. This embodiment is similar to the fifth embodiment depicted in FIG. 2E, but the arc grooves 208a, 210a, and 212a in the twelfth embodiment are irregular rather than circular.
Although the present invention has been disclosed above by the embodiments, they are not intended to limit the present invention. Anybody skilled in the art can make some modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the protected range of the present invention falls in the appended claims.
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