Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.

Patent
   RE47444
Priority
Nov 17 2011
Filed
May 05 2016
Issued
Jun 18 2019
Expiry
Nov 16 2032
Assg.orig
Entity
Small
0
100
currently ok
1. A light emitting element package, comprising:
a lead frame;
a light emitting element on the lead frame;
a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element;
a reflection structure having an opening that corresponds to the opening of the molded material and contacting the molded material; and
an adhesive layer provided in at least part of a region between the molded material and the reflection structure to fix the reflection structure onto the molded material,
wherein the adhesive layer has a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, and wherein the first thickness is greater than the second thickness.
14. A light emitting element package, comprising:
a lead frame;
a light emitting element on the lead frame;
a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element;
a reflection structure having an opening that corresponds to the opening of the molded material, and contacting the molded material;
a supporting portion provided discretely or continuously on the molded material to fix the reflection structure onto the molded material; and
an adhesive layer provided in at least part of a region between the molded material and the reflection structure, and having a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, wherein the first thickness is greater than the second thickness.
7. A light emitting element package, comprising:
a lead frame;
a light emitting element on the lead frame;
a molded material combined with the lead frame and haying an opening for emitting light generated by the light emitting element; and
a reflection structure having an opening that corresponds to the opening of the molded material and contacting the molded material,
wherein the reflection structure comprises a radial surface formed in a radial shape extending radially from the molded material relative to a direction along which light generated by the light emitting element emits, and
wherein the radial surface of the reflection structure forms a first angle with a main emission direction of light generated by the light emitting element, from a point where the radial surface contacts the molded material to a first point away from the molded material, and forms a second angle with the main emission direction from the first point to a second point further away from the molded material compared to the first point, wherein the second angle is greater than the first angle.
2. The light emitting element package according to claim 1, wherein the reflection structure comprises:
a supporting portion contacting the molded material and provided continuously or discretely along a circumference of the opening of the molded material; and
a radial portion contacting the supporting portion and extending radially from the molded material relative to a direction along which light generated by the light emitting element emits.
3. The light emitting element package according to claim 1, wherein the molded material comprises a supporting portion provided continuously or discretely along a circumference of the opening of the molded material, and
wherein the reflection structure comprises a radial portion contacting the supporting portion and having a radial shape extending radially from the molded material relative to a direction along which light generated by the light emitting element emits.
4. The light emitting element package according to claim 1, wherein the molded material comprises a supporting portion provided continuously or discretely along a circumference of the opening of the molded material, and
wherein the reflection structure has a shape that corresponds to the supporting portion of the molded material, and contacts the molded material.
5. The light emitting element package according to claim 1, wherein recesses or concave and convex portions are provided on the molded material, and
wherein the reflection structure is fitted into the recesses or concave and convex portions.
6. The light emitting element package according to claim 1, wherein the thickness of the adhesive layer is gradually reduced away from the light emitting element.
8. The light emitting element package according to claim 7, further comprising a first resin layer that includes a fluorescent material and is provided in the opening of the molded material to cover the light emitting element.
9. The light emitting element package according to claim 8, further comprising a light-transmitting second resin layer that covers the first resin layer and contacts the radial surface.
10. The light emitting element package according to claim 7, further comprising:
a light-transmitting second resin layer provided in the opening of the molded material to cover the light emitting element; and
a first resin layer that includes a fluorescent material, covers the second resin layer, and contacts the radial surface.
11. The light emitting element package according to claim 1, wherein the reflection structure comprises metal.
12. The light emitting element package according to claim 1, wherein a surface of the supporting portion facing the opening of the molded material has a radial shape extending radially relative to a direction along which light generated by the light emitting element emits.
13. The light emitting element package according to claim 1, wherein part of the reflection structure is inserted into the opening of the molded material, and
Wherein the other part of the reflection structure, protruding from the opening of the molded material has a radial shape extending radially from the molded material relative to a direction along which light generated by the light emitting element emits.
15. A backlight unit, comprising:
a reflective sheet;
a light guide plate on or above the reflective sheet; and
alight emitting element package according to claim 1, configured to illuminate the light guide plate.

The inner surface of the molded material 30 facing with the opening 30a thereof has a first slope line S1. The inner surface of the molded material may have the first slope line S1 in all circumferential direction of the opening 30a of the molded material 30.this51 61 of the adhesive layer 60 in areas adjacent to the light emitting element 20 may be greater than the second thickness 52 62 of the adhesive layer 60 in areas away from the light emitting element 20. The adhesive layer 60 according to this embodiment is the same as or similar to the adhesive layer 60 according to the preceding embodiments, and thus a detailed description thereof will be omitted. The adhesive layer 60 is used to maintain adhesive force.

FIG. 17 is a schematic side elevation view of a backlight unit according to an embodiment of the present invention.

As illustrated in FIG. 17, the backlight unit according to this embodiment includes a frame 110, a reflective sheet 115 on part of the frame 110, a light guide plate 120 on the reflective sheet 115, and a light emitting element package 100 on other part of the frame 110 and configured to illuminate the light guide plate 120. The light emitting element package 100 may be any one of the light emitting element packages according to the preceding embodiments and modifications thereof. The light emitting element package 100 may be connected to a printed circuit board 112.

According to his embodiment, since the light emitting element package 100 included in the backlight unit has improved heat radiation function and forward direction luminance, the whole backlight unit may have improved heat radiation function and improved luminance of emitted light.

Although the light emitting element package 100 is illustrated to be provided on a side surface of the light guide plate 120 in FIG. 17, the present invention is not limited thereto and but applicable to a direct-type backlight unit in which a light guide plate is provided on or above a reflective sheet and a light emitting element package is provided under or below the light guide plate.

While the present invention has been described with reference to embodiments illustrated in the drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as as set forth in the following claims.

The present invention may be used to manufacture a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same.

Lee, Seung Hoon, Oh, Seung Hyun, Lim, Jun Hyung, Lim, Jung A, Kim, Pyoung Gug, Min, Chun Ki, Jung, Cheol Hun, Chung, Bo Hyun

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