A custom-fit in-ear-monitor (IEM) is provided that utilizes a plurality of drivers and a single piece driver module that significantly simplifies fabrication while insuring that the completed IEM achieves the desired acoustic performance. The driver module, which is fit within a custom-fit ear mold shell, includes a plurality of driver ports to which the drivers are coupled. The driver module also includes an acoustic output member that includes one or more sound bores that acoustically couple the acoustic output surface of the custom-fit ear mold shell to the plurality of driver ports via a plurality of sound ducts within the driver module.

Patent
   RE48424
Priority
Oct 24 2013
Filed
Jan 18 2017
Issued
Feb 02 2021
Expiry
Oct 24 2033

TERM.DISCL.
Assg.orig
Entity
Large
0
55
currently ok
0. 69. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module disposed within the custom-fit ear mold shell, wherein the single piece driver module includes a first end and an output face, and the single piece driver module comprises:
a plurality of driver ports that each have a first end that is positioned at the first end of the single piece driver module;
a first opening formed within the single piece driver module that is acoustically coupled to the first end of a first driver port of the plurality of driver ports and the output face, wherein the first opening has a first opening length and a first cross-sectional area; and
a second opening formed within the single piece driver module that is acoustically coupled to the first end of a second driver port of the plurality of driver ports and the output face, wherein the second opening has a second opening length and a second cross-sectional area; and
a removable faceplate configured to close an opening in the custom-fit ear mold shell, wherein the single piece driver module and the plurality of drivers are configured to be inserted while separated from the faceplate through the opening prior to closing the opening with the faceplate.
0. 63. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module disposed within the custom-fit ear mold shell and positioned to deliver an acoustic output through a first opening formed in an end of the custom-fit ear mold shell, wherein the single piece driver module comprises:
a plurality of driver ports formed in the single piece driver module; and
an acoustic output member that comprises:
a first sound bore that is acoustically coupled to a first driver port of the plurality of driver ports, and has first length and a first cross-sectional area; and
a second sound bore that is acoustically coupled to a second driver port of the plurality of driver ports, and has a second length and a second cross-sectional area, wherein the first and second sound bores are both acoustically coupled to the first opening formed in the end of the custom-fit ear mold shell;
a plurality of drivers disposed within the custom-fit ear mold shell, wherein one of each of the plurality of drivers is coupled to a corresponding one of each of the plurality of driver ports; and
a removable faceplate configured to close an opening in the custom-fit ear mold shell, wherein the single piece driver module and the plurality of drivers are configured to be inserted while separated from the faceplate through the opening prior to closing the opening with the faceplate.
0. 1. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module configurable to fit within said custom-fit ear mold shell, said single piece driver module comprising:
a plurality of driver ports, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore that is acoustically coupled to an acoustic output surface of said custom-fit ear mold shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said single piece driver module to said plurality of driver ports; and
a plurality of drivers disposed within said custom-fit ear mold shell, wherein one of each of said plurality of drivers is coupled to a corresponding one of each of said plurality of driver ports;
a crossover circuit disposed within said custom-fit ear mold shell and electrically coupled to said plurality of drivers, wherein said crossover circuit is configured to receive an electrical signal from an audio source that is external to said custom-fit IEM and to provide separate input signals to each of said plurality of drivers based on said electrical signal; and
a filler disposed within said custom-fit ear mold shell, wherein said filler is disposed within said custom-fit ear mold shell after said single piece driver module and said plurality of drivers and said crossover circuit have been installed within said custom-fit ear mold shell, and wherein said filler captures and holds said single piece driver module and said plurality of drivers and said crossover circuit within said custom-fit ear mold shell.
0. 2. A custom-fit in-ear-monitor (IEM), comprising;
a custom-fit ear mold shell;
a single piece driver module configurable to fit within said custom-fit ear mold shell, said single piece driver module comprising:
a plurality of driver ports, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore that is acoustically coupled to an acoustic output surface of said custom-fit ear mold shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said single piece driver module to said plurality of driver ports; and
a plurality of drivers disposed within said custom-fit ear mold shell, wherein one of each of said plurality of drivers is coupled to a corresponding one of each of said plurality of driver ports;
a crossover circuit disposed within said custom-fit ear mold shell and electrically coupled to said plurality of drivers, wherein said crossover circuit is configured to receive an electrical signal from an audio source that is external to said custom-fit IEM and to provide separate input signals to each of said plurality of drivers based on said electrical signal; and
a faceplate configured to close an opening in said custom-fit ear mold shell, wherein said single piece driver module and said plurality of drivers are inserted through said opening in said custom-fit ear mold shell prior to closing said opening with said faceplate.
0. 3. The custom-fit IEM of claim 1, wherein a second driver port of said plurality of driver ports is comprised of a second hollow member that extends away from said body portion of said single piece driver module.
0. 4. The custom-fit IEM of claim 1, wherein at least one of said plurality of driver ports is comprised of a cavity formed within said body portion of said single piece driver module, and wherein at least one of said plurality of drivers is at least partially disposed within said cavity.
0. 5. The custom-fit IEM of claim 1, further comprising a cable socket integrated into said custom-fit ear mold shell, wherein a source input cable coupleable to said audio source is attached to said custom-fit IEM and to said crossover circuit via said cable socket.
0. 6. The custom-fit IEM of claim 5, wherein said crossover circuit is integrated into said cable socket.
0. 7. The custom-fit IEM of claim 1, wherein said body portion of said single piece driver module is fabricated from a rigid material and wherein said first hollow member and said acoustic output member are fabricated from a pliable material.
0. 8. The custom-fit IEM of claim 7, wherein said rigid material is comprised of a plastic material.
0. 9. The custom-fit IEM of claim 7, wherein said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 10. The custom-fit IEM of claim 1, wherein said single piece driver module including said body portion, said plurality of driver ports and said acoustic output member are fabricated from a pliable material.
0. 11. The custom-fit IEM of claim 10, wherein said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 12. The custom-fit IEM of claim 1, wherein a second driver port of said plurality of driver ports is comprised of a second hollow member that extends away from said body portion of said single piece driver module and is acoustically coupled to an ambient environment.
0. 13. The custom-fit IEM of claim 1, further comprising a printed circuit board (PCB), wherein said crossover circuit is contained on said PCB.
0. 14. The custom-fit IEM of claim 13, said single piece driver module further comprising a PCB cavity, wherein said PCB and said crossover circuit are at least partially housed within said PCB cavity.
0. 15. The custom-fit IEM of claim 13, further comprising a plurality of barbed stand-offs attached to a surface of said single piece driver module, wherein said PCB and said crossover circuit are mounted to said single piece driver module by said plurality of barbed stand-offs.
0. 16. The custom-fit IEM of claim 13, further comprising a plurality of PCB mounting clips attached to a surface of said single piece driver module, wherein said PCB and said crossover circuit are mounted to said single piece driver module by said plurality of PCB mounting clips.
0. 17. The custom-fit IEM of claim 1, said single piece driver module further comprising at least one locking feature configured to capture and hold said single piece driver module within said custom-fit ear mold shell.
0. 18. The custom-fit IEM of claim 17, wherein said at least one locking feature is comprised of a locking barb integrated onto an outer surface of said acoustic output member.
0. 19. The custom-fit IEM of claim 1, wherein said acoustic output member includes a first sound bore acoustically coupled to a first of said plurality of driver ports via a first duct of said plurality of sound ducts within said single piece driver module, and wherein said acoustic output member includes a second sound bore acoustically coupled to a second of said plurality of driver ports via a second duct of said plurality of sound ducts within said single piece driver module.
0. 20. The custom-fit IEM of claim 19, wherein said second sound bore of said acoustic output member is acoustically coupled to a third of said plurality of driver ports via a third duct of said plurality of sound ducts within said single piece driver module.
0. 21. The custom-fit IEM of claim 20, wherein a first driver of said plurality of drivers is coupled to said first driver port, wherein a second driver of said plurality of drivers is coupled to said second driver port, wherein a third driver of said plurality of drivers is coupled to said third driver port, wherein said first driver is a high-frequency driver, wherein said second driver is a mid-frequency driver, and wherein said third driver is a low-frequency driver.
0. 22. The custom-fit IEM of claim 19, wherein said first sound bore and said second sound bore are concentric.
0. 23. The custom-fit IEM of claim 19, wherein said first sound bore has a first circular cross-section and said second sound bore has a second circular cross-section.
0. 24. The custom-fit IEM of claim 23, wherein said first circular cross-section is larger than said second circular cross-section.
0. 25. The custom-fit IEM of claim 19, wherein said first sound bore has a shaped, non-circular cross-section and said second sound bore has a circular cross-section.
0. 26. The custom-fit IEM of claim 19, wherein said first sound bore has a first shaped, non-circular cross-section and said second sound bore has a second shaped, non-circular cross-section.
0. 27. The custom-fit IEM of claim 1, further comprising an acoustic output extension, wherein said acoustic output extension is slidably mounted to said acoustic output member, and wherein said acoustic output extension is adjustable between a non-extended position and an extended position.
0. 28. An in-ear-monitor (IEM) driver component configured to fit within an IEM shell, comprising:
a single piece driver module, said single piece driver module comprising:
a plurality of driver ports configured to be coupled to a plurality of drivers, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module, and wherein at least one of said plurality of driver ports is comprised of a cavity formed within said body portion of said single piece driver module and configured to accept at least a portion of at least one of said plurality of drivers; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore configured to be acoustically coupled to an acoustic output surface of said IEM shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said body portion of said single piece driver module to said plurality of driver ports.
0. 29. The IEM driver component of claim 28, wherein a second driver port of said plurality of driver ports is comprised of a second hollow member that extends away from said body portion of said single piece driver module.
0. 30. The IEM driver component of claim 28, wherein said body portion of said single piece driver module is fabricated from a rigid material and wherein said first hollow member and said acoustic output member are fabricated from a pliable material.
0. 31. The IEM driver component of claim 30, wherein said rigid material is comprised of a plastic material and said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 32. The IEM driver component of claim 28, wherein said single piece driver module including said body portion, said plurality of driver ports and said acoustic output member are fabricated from a pliable material.
0. 33. The IEM driver component of claim 32, wherein said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 34. The IEM driver component of claim 28, said single piece driver module further comprising at least one locking feature integrated onto an outer surface of said single piece driver module and configured to capture and hold said single piece driver module within said IEM shell.
0. 35. The IEM driver component of claim 28, wherein said acoustic output member includes a first sound bore acoustically coupled to a first of said plurality of driver ports via a first duct of said plurality of sound ducts within said single piece driver module, and wherein said acoustic output member includes a second sound bore acoustically coupled to a second of said plurality of driver ports via a second duct of said plurality of sound ducts within said single piece driver module.
0. 36. The IEM driver component of claim 28, further comprising an acoustic output extension, wherein said acoustic output extension is slidably mounted to said acoustic output member, and wherein said acoustic output extension is adjustable between a non-extended position and an extended position.
0. 37. The IEM driver component of claim 28, wherein said single piece driver module is configurable by blocking off one of said plurality of driver ports of said single piece driver module.
0. 38. The custom-fit IEM of claim 2, wherein a second driver port of said plurality of driver ports is comprised of a second hollow member that extends away from said body portion of said single piece driver module.
0. 39. The custom-fit IEM of claim 2, wherein at least one of said plurality of driver ports is comprised of a cavity formed within said body portion of said single piece driver module, and wherein at least one of said plurality of drivers is at least partially disposed within said cavity.
0. 40. The custom-fit IEM of claim 2, further comprising a cable socket integrated into said custom-fit ear mold shell, wherein a source input cable coupleable to said audio source is attached to said custom-fit IEM and to said crossover circuit via said cable socket.
0. 41. The custom-fit IEM of claim 40, wherein said crossover circuit is integrated into said cable socket.
0. 42. The custom-fit IEM of claim 2, wherein said body portion of said single piece driver module is fabricated from a rigid material and wherein said first hollow member and said acoustic output member are fabricated from a pliable material.
0. 43. The custom-fit IEM of claim 42, wherein said rigid material is comprised of a plastic material.
0. 44. The custom-fit IEM of claim 42, wherein said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 45. The custom-fit IEM of claim 2, wherein said single piece driver module including said body portion, said plurality of driver ports and said acoustic output member are fabricated from a pliable material.
0. 46. The custom-fit IEM of claim 45, wherein said pliable material is selected from the group of elastomeric materials consisting of silicone, neoprene, ethylene propylene diene monomer, nitrile rubber, nitrile, polyvinyl chloride, nitrile/PVC blends, and urethane.
0. 47. The custom-fit IEM of claim 2, wherein a second driver port of said plurality of driver ports is comprised of a second hollow member that extends away from said body portion of said single piece driver module and is acoustically coupled to an ambient environment.
0. 48. The custom-fit IEM of claim 2, further comprising a printed circuit board (PCB), wherein said crossover circuit is contained on said PCB.
0. 49. The custom-fit IEM of claim 48, said single piece driver module further comprising a PCB cavity, wherein said PCB and said crossover circuit are at least partially housed within said PCB cavity.
0. 50. The custom-fit IEM of claim 48, further comprising a plurality of barbed stand-offs attached to a surface of said single piece driver module, wherein said PCB and said crossover circuit are mounted to said single piece driver module by said plurality of barbed stand-offs.
0. 51. The custom-fit IEM of claim 48, further comprising a plurality of PCB mounting clips attached to a surface of said single piece driver module, wherein said PCB and said crossover circuit are mounted to said single piece driver module by said plurality of PCB mounting clips.
0. 52. The custom-fit IEM of claim 2, said single piece driver module further comprising at least one locking feature configured to capture and hold said single piece driver module within said custom-fit ear mold shell.
0. 53. The custom-fit IEM of claim 52, wherein said at least one locking feature is comprised of a locking barb integrated onto an outer surface of said acoustic output member.
0. 54. The custom-fit IEM of claim 2, wherein said acoustic output member includes a first sound bore acoustically coupled to a first of said plurality of driver ports via a first duct of said plurality of sound ducts within said single piece driver module, and wherein said acoustic output member includes a second sound bore acoustically coupled to a second of said plurality of driver ports via a second duct of said plurality of sound ducts within said single piece driver module.
0. 55. The custom-fit IEM of claim 54, wherein said second sound bore of said acoustic output member is acoustically coupled to a third of said plurality of driver ports via a third duct of said plurality of sound ducts within said single piece driver module.
0. 56. The custom-fit IEM of claim 55, wherein a first driver of said plurality of drivers is coupled to said first driver port, wherein a second driver of said plurality of drivers is coupled to said second driver port, wherein a third driver of said plurality of drivers is coupled to said third driver port, wherein said first driver is a high-frequency driver, wherein said second driver is a mid-frequency driver, and wherein said third driver is a low-frequency driver.
0. 57. The custom-fit IEM of claim 54, wherein said first sound bore and said second sound bore are concentric.
0. 58. The custom-fit IEM of claim 54, wherein said first sound bore has a first circular cross-section and said second sound bore has a second circular cross-section.
0. 59. The custom-fit IEM of claim 48, wherein said first circular cross-section is larger than said second circular cross-section.
0. 60. The custom-fit IEM of claim 54, wherein said first sound bore has a shaped, non-circular cross-section and said second sound bore has a circular cross-section.
0. 61. The custom-fit IEM of claim 54, wherein said first sound bore has a first shaped, non-circular cross-section and said second sound bore has a second shaped, non-circular cross-section.
0. 62. The custom-fit IEM of claim 2, further comprising an acoustic output extension, wherein said acoustic output extension is slidably mounted to said acoustic output member, and wherein said acoustic output extension is adjustable between a non-extended position and an extended position.
0. 64. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the first cross-sectional area is larger than the second cross-sectional area.
0. 65. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the plurality of drivers comprise a first driver that is coupled to the first sound bore and a second driver that is coupled to the second sound bore, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.
0. 66. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the first sound bore is substantially straight between a first driver port of the plurality of driver ports and the output face.
0. 67. The custom-fit in-ear-monitor (IEM) of claim 66, wherein the plurality of drivers comprise a first driver that is coupled to the first sound bore and a second driver that is coupled to the second sound bore, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.
0. 68. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the single piece driver module comprises an elastomeric material.
0. 70. The custom-fit in-ear-monitor (IEM) of claim 69, wherein the first opening is configured to transfer a first acoustic output from the first driver port to the output face of the single piece driver module, and the second opening is configured to transfer a second acoustic output from the second driver port to the output face of the single piece driver module.
0. 71. The custom-fit in-ear-monitor (IEM) of claim 70, wherein the first acoustic output has a first plurality of frequencies within a first frequency range and the second acoustic output has a second plurality of frequencies within a second frequency range, and the first plurality of frequencies are higher than the second plurality of frequencies.
0. 72. The custom-fit in-ear-monitor (IEM) of claim 69, wherein the first cross-sectional area is larger than the second cross-sectional area.
0. 73. The custom-fit in-ear-monitor (IEM) of claim 69, further comprising a plurality of drivers, wherein the plurality of drivers comprise a first driver that is coupled to the first opening and a second driver that is coupled to the second opening, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.

shell 701, this view providing an internal top view of IEM 700 in order to clearly show the relative positions of the drivers relative to the driver ports 401-403, and driver ports 401-403 relative to the first opening 702 of the custom-fit ear mold shell 701. Preferably driver 703, which is housed within cavity 605, is a high-frequency driver, thereby taking advantage of the short and relatively straight acoustic pathway between the driver output and the output face 613 of acoustic output member 405. Preferably drivers 705 and 707 are mid- and low-frequency drivers, respectively. Crossover circuit 111, either a passive crossover circuit or an active crossover circuit, is coupled to external audio source 113 and provides input to drivers 703, 705 and 707. As in the prior art IEMs, cable 115 may either be hard-wired to IEM 700 or electrically connected to IEM 700 via a cable socket 117 integrated into the IEM as shown.

In addition to simplifying IEM fabrication, the single piece driver module of the present invention also provides a single component that can be used in a variety of IEM configurations by simply varying the number and type of drivers coupled to the driver ports. For example, in the configuration illustrated in FIG. 8, rather than coupling a driver to driver port 411, this port is coupled via sound bore 801 to the ambient environment. As a result, ambient noises pass through bores 801, 611 and 603 and then directly into the user's ear canal via through the output face 613 of acoustic output member 405 and first opening 702 of the custom-fit ear mold shell 701. Although not required, in this embodiment a damper 803 is inserted into the bore to attenuate ambient sound levels to the desired level. Note that FIG. 8 provides a similar view of an IEM to that shown in FIG. 7, except that driver 707 has been replaced by ambient sound bore 801.

In the configuration described above in which single piece driver module 400 is separate from the custom-fit ear mold, preferably one or more of the various members that extend away from body 407, e.g., output member 405 and driver port members 409 and 411, are fabricated from a pliable material so that they may be moved out of plane as required by the specific geometry of each particular user's ear mold. The body 407 of the module may be fabricated from the same pliable material or from a rigid material such as a plastic. Preferably the pliable portions of module 400 are fabricated from silicone, although other elastomeric materials that allow out-of-plane positioning of members 405, 409 and 411 may be used (e.g., neoprene, ethylene propylene diene monomer (EPDM), nitrile rubber, nitrile, polyvinyl chloride (PVC), nitrile/PVC blends, urethane, etc.).

The IEM's crossover circuit, which provides a means of dividing the input electrical signal among the plurality of IEM drivers (e.g., drivers 703, 705 and 707), may be integrated into the IEM in a variety of ways without affecting the invention. For example, in IEM 900 shown in FIG. 9, the cable socket and the crossover circuit are combined into a single component 901, thereby further simplifying IEM fabrication. Alternately, the crossover circuit may be fabricated on a separate printed circuit board (PCB) 1001 that is installed within the IEM during assembly. Although not required, in such a configuration preferably driver module 400 includes mounting means for circuit board 1001, thus simplifying IEM fabrication. It should be understood that there are a variety of techniques that may be used to capture circuit board 1001 and that the invention is not limited to a specific mounting means, nor does the invention even require the use of mounting means. FIGS. 10-12 illustrate exemplary circuit mounting means. In the embodiment shown in FIG. 10, a slotted cavity 1003 is formed on one surface of body 407 of the driver module. During IEM fabrication circuit 1001 is slipped into the cavity as shown. In the embodiment shown in FIG. 11, a plurality of mounting clips 1101 hold circuit board 1001 in place. In the embodiment shown in FIG. 12, a plurality of barbed stand-offs 1201 are inserted through corresponding mounting holes within circuit board 1001. In an alternate embodiment, circuit board 1001 is simply bonded to a surface of driver module 400.

In some embodiments of the invention, driver module 400 includes one or more external features that aid in positioning and/or maintaining the module within the custom-fit ear mold. For example, IEM 1300 shown in FIG. 13 includes a locking barb 1301 located on acoustic output member 405 that insures that the driver module is properly positioned and held in place within IEM custom-fit ear mold 1303.

As previously noted, sound output member 405 preferably includes a pair of sound bores although it may be configured to use a single sound bore or more than two sound bores. Additionally, and as described below, the present invention is not limited to a specific cross-sectional shape for either the acoustic output member or the sound bores contained therein. FIGS. 14-18 illustrate exemplary cross-sections for an acoustic output member with dual sound bores. In the embodiment shown in FIG. 14, acoustic output member 1400 includes a pair of side-by-side sound bores 1401 and 1403, where the two sound bores have equivalent cross-sections. Acoustic output member 1500 shown in the embodiment of FIG. 15 also includes a pair of side-by-side sound bores, but in this embodiment the cross-section of sound bore 1501 is larger than the cross-section of sound bore 1503. Typically in this embodiment the high frequency driver (e.g., driver 703) is acoustically coupled to the larger sound bore (e.g., sound bore 1501) while the mid- and low-frequency drivers (e.g., drivers 705 and 707) are acoustically coupled to the smaller sound bore (e.g., sound bore 1503). In the embodiment illustrated in FIG. 16, sound bore 1601 has a non-circular cross-section while the second, smaller sound bore 1603 has a circular cross-section. In the embodiment illustrated in FIG. 17, both sound bore 1701 and sound bore 1703 utilize non-circular cross-sections. The embodiment of FIG. 18 uses a pair of concentric sound bores 1801 and 1803 with the inner bore 1801 being held in place and apart from the outer bore 1803 by a plurality of support struts 1805.

In at least one embodiment of the invention, driver module 400 includes an extension 1901 fitted onto the acoustic output member 405. FIG. 19 shows extension 1901 in a non-extended position while FIG. 20 shows extension 1901 in an extended position. Extension 1901 allows the length 1903 of the acoustic output member to be varied depending upon the desired acoustic performance as well as the size and shape of the custom-fit ear mold into which the driver module is to be fit.

One of the benefits of the present invention is that it allows a pre-tuned driver assembly which utilizes the acoustically optimized driver module described above to be inserted into a custom-fit IEM shell, thereby greatly simplifying custom-fit IEM fabrication and assembly. While the driver assembly and the crossover circuit may be sealed within the IEM shell using a filler, an alternative approach is to use a faceplate to seal the IEM shell after the components have been inserted. In this approach, the IEM components may be held in place by an adhesive, padding, filler or an interference fit with the internal features of the IEM shell. By using the same size cutout for each custom IEM shell, the same faceplate can be used, thereby further reducing IEM fabrication complexity.

FIGS. 21 and 22 illustrate a preferred design for an IEM faceplate in accordance with the invention. Faceplate 2101, which can be fabricated from plastic or any sufficiently rigid material, fits within a suitably sized opening within IEM shell 2103 of IEM 2100. Although the opening within the IEM shell may have a distinct shape, preferably it is circularly-shaped, thus allowing the faceplate to be easily installed. Rather than being bonded to the IEM shell, preferably faceplate 2101 is designed to snap-fit within the IEM opening, thus allowing subsequent faceplate removal if the IEM must be repaired or otherwise altered. In order to achieve the preferred snap-fit, the lip 2201 of the IEM shell opening fits within a corresponding groove within faceplate 2101 as shown in the cross-sectional view of FIG. 22. Preferably an O-ring 2203 seals faceplate 2101 into IEM shell 2103. For clarity, the IEM components, e.g., driver module, drivers, crossover circuit, etc., are not shown in the open center section 2205 of the cross-sectional view of FIG. 22.

As noted above, the use of a pre-tuned, single piece driver module simplifies the fabrication of a custom-fit IEM, thereby reducing cost, while insuring that the performance consistently meets the acoustic goals for the device. FIG. 23 illustrates the primary manufacturing steps associated with the fabrication of a custom-fit IEM utilizing the single piece driver module of the invention. Initially in step 2301 a mold is taken of the end user's ear or, more typically, of both of the end user's ears in order to allow a pair of custom-fit IEMs to be fabricated. Using the mold(s), the custom-fit IEM shell(s) is fabricated (step 2303). Then, after installing the drivers into the driver module (step 2305) and coupling the crossover circuit to the drivers (step 2307), the single piece driver module, drivers, and crossover circuit are inserted into the custom-fit IEM shell(s) (step 2309). Lastly, the IEM shell is sealed (step 2311) in order to protect the internal components. The step of sealing the IEM shell may use a filler (e.g., an epoxy or polyester resin) that is added to the cavity within the IEM shell(s), the filler capturing and protecting the driver module, drivers, crossover circuit and wiring within the shell(s). Step 2311 may also utilize the IEM cover described above and shown in FIGS. 21 and 22. It will be appreciated that due to the use of the pre-tuned driver module, the IEM(s) does not have to be tuned prior to finalization.

By eliminating the necessity of tuning each IEM prior to finalization, the present invention allows the manufacturing process to be substantially altered from the traditional, more labor intensive process typically used to manufacture custom-fit IEMs. For example, FIG. 24 illustrates a modified assembly process based on the procedure outlined in FIG. 23. In the modified process after the end user's ear mold is taken (step 2301), the ear mold is scanned (step 2401), for example using a three-dimensional (3D) scanner, in order to create a data file that represents the shape of the desired ear mold (step 2401). The data file is then analyzed and modified to create a final data file that represents the desired external shape as well as the desired internal features that will allow the ear mold to accommodate the single piece driver module 400 and driver assembly. (Step 2403). Using the final data file, a 3D printer is then used to fabricate the IEM shell (step 2405). Once the IEM shell is fabricated and the drivers and crossover circuit have been installed onto the driver module (steps 2305 and 2307), the single piece driver module, drivers, and crossover circuit are inserted into the IEM shell (step 2309) and the IEM shell is sealed in order to protect the IEM internal assembly (step 2311).

As a result of simplifying the manufacturing and assembly process, the present invention allows portions of the process to be performed remotely and off-site. For example and as illustrated in FIG. 25, the ear mold may be made (step 2301) and scanned (step 2401) at a location convenient for the end user, for example a store within a shopping mall, a stand-alone store, or a region carved out of an existing store (e.g., a store-within-a-store). The data file created at the store can then be sent to another site, for example a central processing site in a different geographic region, for analysis (step 2501). At the central processing site the initial data file is analyzed and modified to include the desired internal features that will allow the ear mold to accommodate the single piece driver module 400 and driver assembly (step 2503). The final data file along with assembly instructions are then sent back to the remotely located store (step 2505) where the IEM shell is fabricated, for example using a 3D printer (step 2405). The driver assembly, i.e., single piece driver module, drivers and crossover circuit, is then assembled (steps 2305 and 2307) and inserted into the IEM shell (step 2309) after which the IEM shell is sealed (step 2311).

In the process described above, the use of a single piece, pre-tuned driver module not only simplifies IEM construction, but it also allows relatively un-trained personnel to assemble the final IEM. To further simplify the process entire driver assemblies, i.e., single piece driver module, drivers and crossover circuit, may be pre-assembled, thereby further minimizing the tasks that must be performed on-site (e.g., within the store).

In order to further expand the usefulness of the single piece driver module of the invention, it is possible to block off one or more of the driver ports during assembly. As a result, the same single piece driver module can be modified to use a fewer number of drivers, thereby lowering IEM cost. FIGS. 26 and 27 illustrate the use of a simple plug 2601 which, in this example, is inserted into driver port 403. FIGS. 28 and 29 illustrate a different type of plug, also shown inserted into driver port 403, which requires that driver port member 411 be removed (e.g., cut-off) prior to insertion of plug 2801.

Systems and methods have been described in general terms as an aid to understanding details of the invention. In some instances, well-known structures, materials, and/or operations have not been specifically shown or described in detail to avoid obscuring aspects of the invention. In other instances, specific details have been given in order to provide a thorough understanding of the invention. One skilled in the relevant art will recognize that the invention may be embodied in other specific forms, for example to adapt to a particular system or apparatus or situation or material or component, without departing from the spirit or essential characteristics thereof. Therefore the disclosures and descriptions herein are intended to be illustrative, but not limiting, of the scope of the invention.

Depallens, Philippe, Saggio, Jr., Joseph A.

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