A custom-fit in-ear-monitor (IEM) is provided that utilizes a plurality of drivers and a single piece driver module that significantly simplifies fabrication while insuring that the completed IEM achieves the desired acoustic performance. The driver module, which is fit within a custom-fit ear mold shell, includes a plurality of driver ports to which the drivers are coupled. The driver module also includes an acoustic output member that includes one or more sound bores that acoustically couple the acoustic output surface of the custom-fit ear mold shell to the plurality of driver ports via a plurality of sound ducts within the driver module.
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0. 69. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module disposed within the custom-fit ear mold shell, wherein the single piece driver module includes a first end and an output face, and the single piece driver module comprises:
a plurality of driver ports that each have a first end that is positioned at the first end of the single piece driver module;
a first opening formed within the single piece driver module that is acoustically coupled to the first end of a first driver port of the plurality of driver ports and the output face, wherein the first opening has a first opening length and a first cross-sectional area; and
a second opening formed within the single piece driver module that is acoustically coupled to the first end of a second driver port of the plurality of driver ports and the output face, wherein the second opening has a second opening length and a second cross-sectional area; and
a removable faceplate configured to close an opening in the custom-fit ear mold shell, wherein the single piece driver module and the plurality of drivers are configured to be inserted while separated from the faceplate through the opening prior to closing the opening with the faceplate.
0. 63. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module disposed within the custom-fit ear mold shell and positioned to deliver an acoustic output through a first opening formed in an end of the custom-fit ear mold shell, wherein the single piece driver module comprises:
a plurality of driver ports formed in the single piece driver module; and
an acoustic output member that comprises:
a first sound bore that is acoustically coupled to a first driver port of the plurality of driver ports, and has first length and a first cross-sectional area; and
a second sound bore that is acoustically coupled to a second driver port of the plurality of driver ports, and has a second length and a second cross-sectional area, wherein the first and second sound bores are both acoustically coupled to the first opening formed in the end of the custom-fit ear mold shell;
a plurality of drivers disposed within the custom-fit ear mold shell, wherein one of each of the plurality of drivers is coupled to a corresponding one of each of the plurality of driver ports; and
a removable faceplate configured to close an opening in the custom-fit ear mold shell, wherein the single piece driver module and the plurality of drivers are configured to be inserted while separated from the faceplate through the opening prior to closing the opening with the faceplate.
0. 1. A custom-fit in-ear-monitor (IEM), comprising:
a custom-fit ear mold shell;
a single piece driver module configurable to fit within said custom-fit ear mold shell, said single piece driver module comprising:
a plurality of driver ports, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore that is acoustically coupled to an acoustic output surface of said custom-fit ear mold shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said single piece driver module to said plurality of driver ports; and
a plurality of drivers disposed within said custom-fit ear mold shell, wherein one of each of said plurality of drivers is coupled to a corresponding one of each of said plurality of driver ports;
a crossover circuit disposed within said custom-fit ear mold shell and electrically coupled to said plurality of drivers, wherein said crossover circuit is configured to receive an electrical signal from an audio source that is external to said custom-fit IEM and to provide separate input signals to each of said plurality of drivers based on said electrical signal; and
a filler disposed within said custom-fit ear mold shell, wherein said filler is disposed within said custom-fit ear mold shell after said single piece driver module and said plurality of drivers and said crossover circuit have been installed within said custom-fit ear mold shell, and wherein said filler captures and holds said single piece driver module and said plurality of drivers and said crossover circuit within said custom-fit ear mold shell.
0. 2. A custom-fit in-ear-monitor (IEM), comprising;
a custom-fit ear mold shell;
a single piece driver module configurable to fit within said custom-fit ear mold shell, said single piece driver module comprising:
a plurality of driver ports, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore that is acoustically coupled to an acoustic output surface of said custom-fit ear mold shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said single piece driver module to said plurality of driver ports; and
a plurality of drivers disposed within said custom-fit ear mold shell, wherein one of each of said plurality of drivers is coupled to a corresponding one of each of said plurality of driver ports;
a crossover circuit disposed within said custom-fit ear mold shell and electrically coupled to said plurality of drivers, wherein said crossover circuit is configured to receive an electrical signal from an audio source that is external to said custom-fit IEM and to provide separate input signals to each of said plurality of drivers based on said electrical signal; and
a faceplate configured to close an opening in said custom-fit ear mold shell, wherein said single piece driver module and said plurality of drivers are inserted through said opening in said custom-fit ear mold shell prior to closing said opening with said faceplate.
0. 3. The custom-fit IEM of
0. 4. The custom-fit IEM of
0. 5. The custom-fit IEM of
0. 6. The custom-fit IEM of
0. 7. The custom-fit IEM of
0. 8. The custom-fit IEM of
0. 9. The custom-fit IEM of
0. 10. The custom-fit IEM of
0. 11. The custom-fit IEM of
0. 12. The custom-fit IEM of
0. 13. The custom-fit IEM of
0. 14. The custom-fit IEM of
0. 15. The custom-fit IEM of
0. 16. The custom-fit IEM of
0. 17. The custom-fit IEM of
0. 18. The custom-fit IEM of
0. 19. The custom-fit IEM of
0. 20. The custom-fit IEM of
0. 21. The custom-fit IEM of
0. 22. The custom-fit IEM of
0. 23. The custom-fit IEM of
0. 24. The custom-fit IEM of
0. 25. The custom-fit IEM of
0. 26. The custom-fit IEM of
0. 27. The custom-fit IEM of
0. 28. An in-ear-monitor (IEM) driver component configured to fit within an IEM shell, comprising:
a single piece driver module, said single piece driver module comprising:
a plurality of driver ports configured to be coupled to a plurality of drivers, wherein at least one of said plurality of driver ports is comprised of a first hollow member that extends away from a body portion of said single piece driver module, and wherein at least one of said plurality of driver ports is comprised of a cavity formed within said body portion of said single piece driver module and configured to accept at least a portion of at least one of said plurality of drivers; and
an acoustic output member, wherein said acoustic output member extends away from said body portion of said single piece driver module, wherein said acoustic output member includes at least one sound bore configured to be acoustically coupled to an acoustic output surface of said IEM shell, and wherein said at least one sound bore is acoustically coupled via a plurality of sound ducts within said body portion of said single piece driver module to said plurality of driver ports.
0. 29. The IEM driver component of
0. 30. The IEM driver component of
0. 31. The IEM driver component of
0. 32. The IEM driver component of
0. 33. The IEM driver component of
0. 34. The IEM driver component of
0. 35. The IEM driver component of
0. 36. The IEM driver component of
0. 37. The IEM driver component of
0. 38. The custom-fit IEM of
0. 39. The custom-fit IEM of
0. 40. The custom-fit IEM of
0. 41. The custom-fit IEM of
0. 42. The custom-fit IEM of
0. 43. The custom-fit IEM of
0. 44. The custom-fit IEM of
0. 45. The custom-fit IEM of
0. 46. The custom-fit IEM of
0. 47. The custom-fit IEM of
0. 48. The custom-fit IEM of
0. 49. The custom-fit IEM of
0. 50. The custom-fit IEM of
0. 51. The custom-fit IEM of
0. 52. The custom-fit IEM of
0. 53. The custom-fit IEM of
0. 54. The custom-fit IEM of
0. 55. The custom-fit IEM of
0. 56. The custom-fit IEM of
0. 57. The custom-fit IEM of
0. 58. The custom-fit IEM of
0. 59. The custom-fit IEM of
0. 60. The custom-fit IEM of
0. 61. The custom-fit IEM of
0. 62. The custom-fit IEM of
0. 64. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the first cross-sectional area is larger than the second cross-sectional area.
0. 65. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the plurality of drivers comprise a first driver that is coupled to the first sound bore and a second driver that is coupled to the second sound bore, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.
0. 66. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the first sound bore is substantially straight between a first driver port of the plurality of driver ports and the output face.
0. 67. The custom-fit in-ear-monitor (IEM) of claim 66, wherein the plurality of drivers comprise a first driver that is coupled to the first sound bore and a second driver that is coupled to the second sound bore, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.
0. 68. The custom-fit in-ear-monitor (IEM) of claim 63, wherein the single piece driver module comprises an elastomeric material.
0. 70. The custom-fit in-ear-monitor (IEM) of claim 69, wherein the first opening is configured to transfer a first acoustic output from the first driver port to the output face of the single piece driver module, and the second opening is configured to transfer a second acoustic output from the second driver port to the output face of the single piece driver module.
0. 71. The custom-fit in-ear-monitor (IEM) of claim 70, wherein the first acoustic output has a first plurality of frequencies within a first frequency range and the second acoustic output has a second plurality of frequencies within a second frequency range, and the first plurality of frequencies are higher than the second plurality of frequencies.
0. 72. The custom-fit in-ear-monitor (IEM) of claim 69, wherein the first cross-sectional area is larger than the second cross-sectional area.
0. 73. The custom-fit in-ear-monitor (IEM) of claim 69, further comprising a plurality of drivers, wherein the plurality of drivers comprise a first driver that is coupled to the first opening and a second driver that is coupled to the second opening, and the first driver is a high frequency driver and the second driver is a mid or a low frequency driver.
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shell 701, this view providing an internal top view of IEM 700 in order to clearly show the relative positions of the drivers relative to the driver ports 401-403, and driver ports 401-403 relative to the first opening 702 of the custom-fit ear mold shell 701. Preferably driver 703, which is housed within cavity 605, is a high-frequency driver, thereby taking advantage of the short and relatively straight acoustic pathway between the driver output and the output face 613 of acoustic output member 405. Preferably drivers 705 and 707 are mid- and low-frequency drivers, respectively. Crossover circuit 111, either a passive crossover circuit or an active crossover circuit, is coupled to external audio source 113 and provides input to drivers 703, 705 and 707. As in the prior art IEMs, cable 115 may either be hard-wired to IEM 700 or electrically connected to IEM 700 via a cable socket 117 integrated into the IEM as shown.
In addition to simplifying IEM fabrication, the single piece driver module of the present invention also provides a single component that can be used in a variety of IEM configurations by simply varying the number and type of drivers coupled to the driver ports. For example, in the configuration illustrated in
In the configuration described above in which single piece driver module 400 is separate from the custom-fit ear mold, preferably one or more of the various members that extend away from body 407, e.g., output member 405 and driver port members 409 and 411, are fabricated from a pliable material so that they may be moved out of plane as required by the specific geometry of each particular user's ear mold. The body 407 of the module may be fabricated from the same pliable material or from a rigid material such as a plastic. Preferably the pliable portions of module 400 are fabricated from silicone, although other elastomeric materials that allow out-of-plane positioning of members 405, 409 and 411 may be used (e.g., neoprene, ethylene propylene diene monomer (EPDM), nitrile rubber, nitrile, polyvinyl chloride (PVC), nitrile/PVC blends, urethane, etc.).
The IEM's crossover circuit, which provides a means of dividing the input electrical signal among the plurality of IEM drivers (e.g., drivers 703, 705 and 707), may be integrated into the IEM in a variety of ways without affecting the invention. For example, in IEM 900 shown in
In some embodiments of the invention, driver module 400 includes one or more external features that aid in positioning and/or maintaining the module within the custom-fit ear mold. For example, IEM 1300 shown in
As previously noted, sound output member 405 preferably includes a pair of sound bores although it may be configured to use a single sound bore or more than two sound bores. Additionally, and as described below, the present invention is not limited to a specific cross-sectional shape for either the acoustic output member or the sound bores contained therein.
In at least one embodiment of the invention, driver module 400 includes an extension 1901 fitted onto the acoustic output member 405.
One of the benefits of the present invention is that it allows a pre-tuned driver assembly which utilizes the acoustically optimized driver module described above to be inserted into a custom-fit IEM shell, thereby greatly simplifying custom-fit IEM fabrication and assembly. While the driver assembly and the crossover circuit may be sealed within the IEM shell using a filler, an alternative approach is to use a faceplate to seal the IEM shell after the components have been inserted. In this approach, the IEM components may be held in place by an adhesive, padding, filler or an interference fit with the internal features of the IEM shell. By using the same size cutout for each custom IEM shell, the same faceplate can be used, thereby further reducing IEM fabrication complexity.
As noted above, the use of a pre-tuned, single piece driver module simplifies the fabrication of a custom-fit IEM, thereby reducing cost, while insuring that the performance consistently meets the acoustic goals for the device.
By eliminating the necessity of tuning each IEM prior to finalization, the present invention allows the manufacturing process to be substantially altered from the traditional, more labor intensive process typically used to manufacture custom-fit IEMs. For example,
As a result of simplifying the manufacturing and assembly process, the present invention allows portions of the process to be performed remotely and off-site. For example and as illustrated in
In the process described above, the use of a single piece, pre-tuned driver module not only simplifies IEM construction, but it also allows relatively un-trained personnel to assemble the final IEM. To further simplify the process entire driver assemblies, i.e., single piece driver module, drivers and crossover circuit, may be pre-assembled, thereby further minimizing the tasks that must be performed on-site (e.g., within the store).
In order to further expand the usefulness of the single piece driver module of the invention, it is possible to block off one or more of the driver ports during assembly. As a result, the same single piece driver module can be modified to use a fewer number of drivers, thereby lowering IEM cost.
Systems and methods have been described in general terms as an aid to understanding details of the invention. In some instances, well-known structures, materials, and/or operations have not been specifically shown or described in detail to avoid obscuring aspects of the invention. In other instances, specific details have been given in order to provide a thorough understanding of the invention. One skilled in the relevant art will recognize that the invention may be embodied in other specific forms, for example to adapt to a particular system or apparatus or situation or material or component, without departing from the spirit or essential characteristics thereof. Therefore the disclosures and descriptions herein are intended to be illustrative, but not limiting, of the scope of the invention.
Depallens, Philippe, Saggio, Jr., Joseph A.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
5056204, | May 17 1989 | OTICON A S | Method of producing hearing aids |
5184306, | Jun 09 1989 | Regents of the University of Minnesota | Automated high-precision fabrication of objects of complex and unique geometry |
5487012, | Dec 21 1990 | Topholm & Westermann ApS | Method of preparing an otoplasty or adaptive earpiece individually matched to the shape of an auditory canal |
5631965, | Jun 19 1992 | Hearing protector | |
6401859, | Sep 25 2000 | Sonova AG | Custom-molded ear-plug, and process for producing a custom-molded ear-plug device |
6432247, | Dec 18 1997 | SOFTEAR TECHNOLOGIES, L L C | Method of manufacturing a soft hearing aid |
6473512, | Dec 18 1997 | SOFTEAR TECHNOLOGIES, L L C | Apparatus and method for a custom soft-solid hearing aid |
6540045, | Jun 30 2000 | Sonova AG | Method for manufacturing an ear device and ear device |
6695943, | Dec 18 1997 | SOFTEAR TECHNOLOGIES, L L C | Method of manufacturing a soft hearing aid |
7050876, | Oct 06 2000 | PHONAK LTD | Manufacturing methods and systems for rapid production of hearing-aid shells |
7084870, | Dec 19 2002 | Siemens Corporation | Interactive binaural shell modeling for hearing aids |
7286679, | Dec 19 2002 | Siemens Corporation | Automatic binaural shell modeling for hearing aids |
7308328, | May 15 2003 | Siemens Corporation | Synchronized processing of ear shells for hearing aids |
7317806, | Dec 22 2004 | LOGITECH INTERNATIONAL, S A | Sound tube tuned multi-driver earpiece |
7421087, | Jul 28 2004 | Earlens Corporation | Transducer for electromagnetic hearing devices |
7447556, | Feb 03 2006 | Sivantos GmbH | System comprising an automated tool and appertaining method for hearing aid design |
7489794, | Sep 07 2005 | LOGITECH INTERNATIONAL, S A | Earpiece with acoustic vent for driver response optimization |
7571018, | Jun 14 2006 | Sonova AG | Preserving localization information from modeling to assembling |
7634099, | Jul 22 2005 | LOGITECH INTERNATIONAL, S A | High-fidelity earpiece with adjustable frequency response |
8032337, | Mar 02 2001 | 3Shape ApS | Method for modeling customized earpieces |
8194911, | Mar 27 2007 | LOGITECH INTERNATIONAL, S A | Earphone integrated eartip |
8841603, | Aug 28 2013 | ETHOS-UNITED-I, LLC | Illumination for optical scan and measurement |
8900125, | Mar 12 2012 | ETHOS-UNITED-I, LLC | Otoscanning with 3D modeling |
8900127, | Mar 12 2012 | ETHOS-UNITED-I, LLC | Otoscanner with pressure sensor for compliance measurement |
8900128, | Mar 12 2012 | ETHOS-UNITED-I, LLC | Otoscanner with camera for video and scanning |
8900129, | Mar 12 2012 | ETHOS-UNITED-I, LLC | Video otoscanner with line-of-sight probe and screen |
8900130, | Mar 12 2012 | ETHOS-UNITED-I, LLC | Otoscanner with safety warning system |
9042589, | Oct 24 2013 | LOGITECH EUROPE, S.A. | Custom fit in-ear monitors utilizing a single piece driver module |
20040069560, | |||
20060133636, | |||
20070036385, | |||
20070121980, | |||
20110058702, | |||
20120028107, | |||
20140313506, | |||
20150038850, | |||
20150038871, | |||
20150038880, | |||
20150039087, | |||
20150057533, | |||
20150067929, | |||
20150097929, | |||
20150097931, | |||
20150097935, | |||
20150097968, | |||
20150098636, | |||
20150099981, | |||
20150099983, | |||
20150190043, | |||
20160051134, | |||
WO2012129229, | |||
WO2013138078, | |||
WO2013138079, | |||
WO2015030861, | |||
WO2015030862, |
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