According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.
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1. An electronic device comprising:
a board having a first face;
a first electronic component disposed on the first face; and
a heat dissipation member disposed at a side opposite to the first face of the first electronic component, the heat dissipation member being thermally connected to the first electronic component, the heat dissipation member including a first extending portion, a second extending portion, and a plurality of third extending portions, wherein
the first extending portion extends along the first face, the second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space, the second extending portion extending along the first face, and the plurality of third extending portions are connected to the first extending portion and the second extending portion, the plurality of third extending portions being positioned away from each other by a space,
the first extending portion, the second extending portion, and the plurality of third extending portions are walls, and
a plurality of air passages that are surrounded by the first extending portion, the second extending portion, and two third extending portions among the plurality of third extending portions, the plurality of air passages penetrating the heat dissipation member, is provided in the heat dissipation member, and
a housing that houses the board, the first electronic component, and the heat dissipation member, wherein the housing has a second opening, the second opening penetrating an interior and an exterior of the housing, the plurality of air passages extend in a direction along the first face, and an opening end of the air passages face the second opening.
0. 19. An electronic device comprising:
a board having a first face;
a first electronic component disposed on the first face;
a second electronic component disposed on the first face and disposed at a first distance from the first electronic component; and
a heat dissipation member disposed at a side opposite to a contact surface of the first electronic component with the board, the heat dissipation member being thermally connected to the first electronic component and to the second electronic component, the heat dissipation member including a first extending portion, a second extending portion, and a plurality of third extending portions, wherein
the first extending portion extends along the first face,
the second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space, the second extending portion extending along the first face, and the second extending portion being thermally connected to the first extending portion,
the plurality of third extending portions respectively extend from the first extending portion, the plurality of third extending portions being positioned away from each other,
a first opening is provided in the first extending portion
a second opening is provided between end portions of the first extending portion and second extending portion,
a passage connects the first and second openings,
at least one of the third extending portions is a wall extending in a direction from the second opening to the first opening in a plan view,
in a plan view, a first number of the plurality of third extending portions are provided in a region where the first electronic component is located and are separated from each other, and
a second number of the plurality of third extending portions are provided in a region where the second electronic component is located and are separated from each other.
2. The electronic device according to
the heat dissipation member has a framework structure, and
the framework structure includes the first extending portion, the second extending portion, and the plurality of third extending portions.
3. The electronic device according to
the first extending portion includes a plurality of row portions and a plurality of column portions,
the plurality of row portions are disposed away from each other,
the plurality of column portions intersect the row portions, the plurality of column portions being disposed away from each other.
4. The electronic device according to
the plurality of third extending portions connect a connecting portion, the connecting portion being a portion via which the row portion and the column portion are connected.
0. 5. The electronic device according to
6. The electronic device according to
the heat dissipation member is thermally connected to the first electronic component and to the second electronic component.
7. The electronic device according to
8. The electronic device according to
9. The electronic device according to
the heat dissipation member includes a slope at a side opposite to the first face, and
a distance from the first face to the slope decreases in a direction along the first face.
0. 10. The electronic device according to
the first extending portion, the second extending portion, and the plurality of third extending portions are walls, and
a plurality of air passages that are surrounded by the first extending portion, the second extending portion, and two third extending portions among the plurality of third extending portions, the plurality of air passages penetrating the heat dissipation member is provided in the heat dissipation member.
11. The An electronic deviceaccording to
a board having a first face;
a first electronic component disposed on the first face; and
a heat dissipation member disposed at a side opposite to the first face of the first electronic component, the heat dissipation member being thermally connected to the first electronic component, the heat dissipation member including a first extending portion, a second extending portion, and a plurality of third extending portions, wherein
the first extending portion extends along the first face, the second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space, the second extending portion extending along the first face, and the plurality of third extending portions are connected to the first extending portion and the second extending portion, the plurality of third extending portions being positioned away from each other by a space,
the first extending portion, the second extending portion, and the plurality of third extending portions are walls,
a plurality of air passages that are surrounded by the first extending portion, the second extending portion, and two third extending portions among the plurality of third extending portions, the plurality of air passages penetrating the heat dissipation member, is provided in the heat dissipation member, and
the plurality of air passages are curved.
0. 12. The electronic device according to
the housing has a second opening, the second opening penetrating an interior and an exterior of the housing,
the plurality of air passages extend in a direction along the first face, and
an opening end of the air passages face the second opening.
13. The electronic device according to claim 10 11, comprising a housing that houses the board, the first electronic component, and the heat dissipation member, wherein
the housing includes two walls that are disposed away from each other in a direction along the first face,
a first opening end of a first passage among the plurality of passages and a first opening end of a second passage among the plurality of passages are located at a first end portion of the heat dissipation member in the direction along the first face,
a plurality of second openings that are pr-vided provided through one wall among the two walls of the housing, the plurality of second openings penetrating an interior and an exterior of the housing, and
the first opening end of the first passage faces one of the plurality of second openings, and the first opening end of the second passage faces another opening among the plurality of second openings.
14. The electronic device according to
a second opening end of the first passage and a second opening end of the second passage are located at a second end portion of the heat dissipation member, the second end portion being at a side opposite to the first end portion in a direction along the first face,
a third opening is provided at the other wall among the two walls of the housing, the third opening penetrating an interior and an exterior of the housing, and
both the second opening end of the first passage and the second opening end of the second passage face the third opening.
15. The electronic device according to claim 10 11, comprising a housing that houses the board, the first electronic component, and the heat dissipation member, wherein
the housing includes two walls that are disposed away from each other in a direction along the first face,
a plurality of second openings that are provided through one wall among the two walls of the housing, the plurality of second openings penetrating an interior and an exterior of the housing,
a first opening end of a third passage among the plurality of passages and a second opening end of the third passage are located at the first end portion of the heat dissipation member in the direction along the first face, and
the first opening end of the third passage faces one of the plurality of second openings, and the second opening end of the third passage faces another opening among the plurality of second openings.
16. The electronic device according to claim 12 1, wherein
the housing includes two walls disposed away from each other in a direction along the first face, and
one of the opening ends of the air passage faces one of the two walls, and the other of the opening ends of the air passage faces the other wall among the two walls.
17. The electronic device according to
the third electronic component is positioned at a first direction side of the first electronic component, and
the air passage extends along a second direction that intersects the first direction.
18. The electronic device according to
the third electronic component is a NAND flash memory, and the first electronic component is a controller that controls the NAND flash memory.
0. 20. The electronic device according to claim 1, wherein the plurality of air passages are curved.
0. 21. The electronic device according to claim 1, wherein
the housing includes two walls that are disposed away from each other in a direction along the first face,
a first opening end of a first passage among the plurality of passages and a first opening end of a second passage among the plurality of passages are located at a first end portion of the heat dissipation member in the direction along the first face,
a plurality of third openings are provided through one wall among the two walls of the housing, the plurality of third openings penetrating an interior and an exterior of the housing, and
the first opening end of the first passage faces one of the plurality of third openings, and the first opening end of the second passage faces another opening among the plurality of third openings.
0. 22. The electronic device according to claim 1, wherein
the housing includes two walls that are disposed away from each other in a direction along the first face,
a plurality of third openings are provided through one wall among the two walls of the housing, the plurality of third openings penetrating an interior and an exterior of the housing,
a first opening end of a third passage among the plurality of passages and a second opening end of the third passage are located at the first end portion of the heat dissipation member in the direction along the first face, and
the first opening end of the third passage faces one of the plurality of third openings, and the second opening end of the third passage faces another opening among the plurality of third openings.
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This application is based upon and claims the benefit of priority from U.S. Provisional Application No. 62/131,077, filed on Mar. 10, 2015; the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to an electronic device.
There is a known electronic component in which a heat sink is mounted and heat dissipation performance is improved.
It is meaningful to provide a heat dissipation member having higher heat dissipation performance, and an electronic device including such a heat dissipation member.
In general, according to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.
In the following, exemplary embodiments of the electronic device and the heat dissipation member will be disclosed. Configurations and control (technical characteristics) of the following embodiments described below, and functions and results (effects) provided by such configurations and control are examples. Further, a plurality of embodiments and a modified example exemplified below include same components. In the following, the same components are denoted by same references sings, and repetition of description will be omitted.
In the respective drawings, directions are indicated for the sake of convenience. An X-direction and a Y-direction are directions along a face 3a of a circuit board 3 (board, refer to
Additionally, the wall 2a is provided with an opening 2b. The opening 2b penetrates the wall 2a in a thickness direction of the wall 2a, and connects an interior and an exterior of the housing 2. The opening 2b is, for example, a through hole, a notch, and a slit. The opening 2b may be used to, for example, insert and pass an external component such as a connector, expose an internal component such as a connector or an indicator (light emitting portion), and ventilate air.
The electronic device 1 is, for example, a solid state drive (SSD). The SSD may be also referred to as a silicon drive, a flash drive, and so on. Note that the electronic device 1 may be, for example, an electronic device other than the SSD, such as a personal computer, a smartphone, a smart-television, a smartbook, a cellular phone, a personal digital assistant (PDA), an image display device, and a video telephone set.
The electronic component 4 (first electronic component) is disposed on the face 3a. The electronic component 4 is a face mount component provided on the face 3a by a face mount technology. More specifically, the electronic component 4 may be formed as a land grid array (LGA), a ball grid array (BGA), and a chip size package (CSP), for example. Note that the electronic component 4 is not necessarily the face mount component. The electronic component 4 may also be referred to as a package. Further, the electronic component 4 thermally connected with a heat dissipation member may be an electronic component (package) other than the SSD, such as a central processing unit (CPU).
The electronic component 4 includes a face 4a and a face 4b. The face 4a faces the face 3a of the circuit board 3. The face 4b is positioned at a side opposite to the face 4a in the thickness direction (Z-direction) of the electronic component 4 and the circuit board 3. Further, according to the present embodiment, the electronic component 4 is disposed on the face 3a of the circuit board 3, and not disposed on the face 3b. Therefore, the face 3a may be referred to as a component mounting face, and the face 3b may be referred to as a non-component mounting face. Note that the electronic component 4 may also be disposed on the face 3b, or the electronic component 4 may be disposed on each of the face 3a and the face 3b. In this case, a heat dissipation member 5 may also be disposed at the electronic component on each of the face 3a and the face 3b. The thickness direction is the direction orthogonal to the face 4a and the face 4b.
The memory 41 is a non-volatile memory such as a NAND flash memory. The memory 41 is not limited to the NAND flash memory, and may be a magnetoresistive random access memory (MRAM), a resistance random access memory (RERAM), a ferroelectric random access memory (FERAM), and so on. Further, the memory 41 stores user data transmitted from the outside (host device) of the semiconductor device 1, system data used only inside the electronic component 4, and so on. Furthermore, the memory 41 includes a memory cell array in which a plurality of memory cells (not illustrated) is arrayed in a matrix form. Each of the memory cells can store two value or multiple values. Additionally, the memory 41 includes a plurality (n) of memory chips 41a (#0 to #n−1).
The data buffer 43 temporarily holds data. The data buffer 43 is, for example, a dynamic static random access memory (DRAM). Note that the data buffer 43 is not limited to the DRAM, and may be a static random access memory (SRAM) or the like. The data buffer 43 may be provided independently from the controller 42, or may be implemented as an incorporated memory inside a chip of the controller 42.
The controller 42 controls the electronic component 4. Functions of the controller 42 are implemented by, for example, a processor configured to execute firmware stored in the memory 41 or a read only memory (ROM) included in the controller 42, or hardware. The controller 42 reads data from the memory 41 and writes data in the memory 41 in accordance with a command from the host device.
Further, the controller 42 includes, for example, a command processor 420, a memory interface unit 421, a data controller 422, a data read controller 423, a data write controller 424, an ECC encoder 425, and an ECC decoder 426.
The command processor 420 determines a command received from the host. The commands includes, for example, a read command, a write command, a command to retrieve individual information, and a command to change setting values in order to control various kinds of operation. The controller 42 executes processing in accordance with the command determined by the command processor 420.
The memory interface unit 421 is a controller to control the memory 41. The memory interface unit 421 writes, in the memory 41, a code word received from the ECC encoder 425 in accordance with control of the data write controller 424 and the like. Further, the memory interface unit 421 reads the code word from the memory 41 in accordance with control of the data read controller 423 and the like, and transfers the same to the ECC decoder 426.
The data controller 422 controls a position where data is to be stored on the memory 41. The data controller 422 has an address conversion table 222a in which a logic address provided from the host device is correlated to a physical position on the memory 41, and executes garbage collection in accordance with a block usage condition on the memory.
The data read controller 423 executes processing to read data from the memory 41 in accordance with a command notified from the host device via a connector 44. More specifically, the data read controller 423 acquires, from the data controller 422, a physical position on the memory 41 corresponding to a logic address of read data, and notifies the memory interface unit 421 of the physical position. The read data is transmitted to the host device via the ECC decoder 426, data buffer 43, and so on.
The data write controller 424 executes processing to write data in the memory 41 in accordance with a command notified from the host device via the connector 44. More specifically, the data write controller 424 acquires, from the data controller 422, a physical position on the memory 41 where the data is to be written, and outputs the physical position and a code word output from the ECC encoder 425 to the memory interface unit 421.
The ECC encoder 425 encodes the data held at the data buffer 43, and generates a code word including data and a redundant portion (parity). The ECC decoder 426 acquires, from the memory interface unit 421, the code word read from the memory 41, and decodes the acquired code word. The ECC decoder 426 notifies the data read controller 423 of a read error in the case of failing in error correction at the time of decoding. Further, the electronic component 4 may be other a controller not including a memory, or other electronic components that generate heat, such as a CPU and an amplifier. The electronic component 4 is the component that generates a large amount of heat, compared to other components inside the housing 2. The electronic component 4 may also be referred to as a heating element.
Further, as illustrated in
Further, the heat dissipation member 5 has a framework structure as illustrated in
Additionally, the heat dissipation member 5 may be formed by integrally connecting a plurality of components (split bodies). As an example, each of the plurality of components may be formed of a structure including the layer 55 and the plurality of frames 53. Further, the plurality of components may be connected by, for example, bonding, welding, or soldering. Furthermore, the heat dissipation member 5 may be manufactured as a layered modeled object by using a layered modeling device (3D printer), or may be manufactured by combining molding and cutting work. Note that the heat dissipation member 5 may be formed by including material having relatively high thermal conductivity, for example, metallic material such as copper-based material, aluminum-based material, and iron-based material, or synthetic resin material including a thermal conductive filler.
As described above, according to the present embodiment, the heat dissipation member 5 includes the plurality of layers 55 (first extending portion and second extending portion) disposed away from each other by a space in the Z-direction (second direction) that intersects the face 3a of the circuit board 3, and the plurality of layers 55 is mutually connected with the frame 53 (third extending portion) extended along the Z-direction. Therefore, according to the present embodiment, for example, the heat dissipation member 5 having the larger face area and higher heat dissipation performance, therefore the electronic device 1 provided with the electronic component 4 having the improved heat dissipation performance can be easily obtained.
Further, according to the present embodiment, the heat dissipation member 5 has the framework structure. Therefore, the heat dissipation member 5 having the larger face area and much higher heat dissipation performance, therefore the electronic device 1 provided with the electronic component 4 having the more improved heat dissipation performance can be easily obtained. Further, the heat dissipation member 5 may be formed having less weight and more easily bendable, for example.
Moreover, in the case where the heat dissipation member 5 has the three-dimensional lattice shape including the three frames 51, 52, 53 formed along the three directions (X-direction, Y-direction, and Z-direction) orthogonal to each other, not only manufacture may be facilitated but also labor and cost for manufacturing the electronic device 1 may be reduced.
Further, as illustrated in
Further, as illustrated in
Further, an opening 5a (first opening) is also provided at the heat dissipation member 58B of the present embodiment. According to the present embodiment, interference between a component (not illustrated) and the heat dissipation member 5B is prevented by the opening 5a. In other words, clearance is provided between the component and the heat dissipation member 5B by the opening 5a. According to the present embodiment, effects by the opening 5a same as the second embodiment can be also obtained.
While the present embodiments and modified example have been exemplified above, the present embodiments and modified example are examples and not intended to limit the scope of the invention. The present embodiments and modified example can be implemented in other various modes, and various kinds of omission, replacement, combination, and change can be made in the scope without departing from the gist of the present invention. The present embodiments and modified example are included in the scope and gist of the invention and further included in the scope equivalent to the inventions recited in the scope of claims. Further, the structures and shapes in the respective present embodiments and modified example can be partially switched for implementation. Additionally, the specification such as the respective structures and shapes (structure, type, direction, shape, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be suitably changed for implementation.
Patent | Priority | Assignee | Title |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 18 2018 | TOSHIBA MEMORY CORPORATION | (assignment on the face of the patent) | / | |||
Aug 01 2018 | TOSHIBA MEMORY CORPORATION | K K PANGEA | MERGER SEE DOCUMENT FOR DETAILS | 058946 | /0675 | |
Aug 01 2018 | K K PANGEA | TOSHIBA MEMORY CORPORATION | CHANGE OF NAME AND ADDRESS | 058957 | /0124 | |
Oct 01 2019 | TOSHIBA MEMORY CORPORATION | Kioxia Corporation | CHANGE OF NAME AND ADDRESS | 058905 | /0582 |
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